Chiu; Shih-Kuang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Shih-Kuang.The latest application filed is for "buckle device".

Company Profile

5.51.56

Chiu; Shih-Kuang - Kaohsiung TW
Chiu; Shih-Kuang - Taichung TW
CHIU; Shih-Kuang - Kaohsiung City TW
Chiu; Shih-Kuang - Taichung City TW
Chiu; Shih-Kuang - Taichung Hsien N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Buckle device Grant 11,213,102 - Chiu January 4, 2	2022-01-04
Electrical testing method of interposer Grant 10,950,507 - Chen , et al. March 16, 2	2021-03-16
Buckle device Grant 10,772,390 - Chiu , et al. Sept	2020-09-15
Buckle Device App 20200221830 - CHIU; Shih-Kuang ; et al.	2020-07-16
Method for fabricating package structure Grant 10,615,055 - Chiu , et al.	2020-04-07
Physiological Signal Correction Device, Correction Method, And Wearable Device With Correction Function App 20190246988 - Yang; Ming-Huan ; et al.	2019-08-15
Method for fabricating package structure App 20190122898 - Chiu; Chi-Hsin ; et al.	2019-04-25
Flexible Chip Package App 20190103360 - Yu; Cheng-Hung ; et al.	2019-04-04
Package structure and fabrication method thereof Grant 10,199,239 - Chiu , et al. Fe	2019-02-05
Electrical Testing Method Of Interposer App 20180254227 - Chen; Lu-Yi ; et al.	2018-09-06
Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer Grant 10,049,955 - Chang , et al. August 14, 2	2018-08-14
Interposer and electrical testing method thereof Grant 9,991,178 - Chen , et al. June 5, 2	2018-06-05
Latch Device App 20180125172 - Chien; Ke-Cheng ; et al.	2018-05-10
Semiconductor package and method of fabricating the same Grant 9,899,308 - Tseng , et al. February 20, 2	2018-02-20
Carrier, semiconductor package and fabrication method thereof Grant 9,899,237 - Chang , et al. February 20, 2	2018-02-20
Semiconductor device having conductive vias Grant 9,875,981 - Lee , et al. January 23, 2	2018-01-23
Method of fabricating semiconductor package having semiconductor element Grant 9,812,340 - Chang , et al. November 7, 2	2017-11-07
Semiconductor Package And Method Of Fabricating The Same App 20170229387 - Tseng; Wen-Tsung ; et al.	2017-08-10
Fabrication Method Of Semiconductor Package App 20170229364 - Chang; Chiang-Cheng ; et al.	2017-08-10
Method Of Fabricating Semiconductor Package App 20170148761 - Ma; Guang-Hwa ; et al.	2017-05-25
Semiconductor package having conductive pillars Grant 9,659,806 - Chang , et al. May 23, 2	2017-05-23
Semiconductor package and method of fabricating the same Grant 9,607,939 - Tseng , et al. March 28, 2	2017-03-28
Semiconductor Device Having Conductive Vias App 20170040277 - Lee; Meng-Tsung ; et al.	2017-02-09
Semiconductor package and fabrication method thereof Grant 9,520,304 - Chang , et al. December 13, 2	2016-12-13
Semiconductor device having conductive vias Grant 9,502,333 - Lee , et al. November 22, 2	2016-11-22
Fabrication method of wafer level package having a pressure sensor Grant 9,487,393 - Chang , et al. November 8, 2	2016-11-08
Package structure and fabrication method thereof Grant 9,425,119 - Chang , et al. August 23, 2	2016-08-23
Method Of Fabricating Semiconductor Package App 20160196990 - Chang; Chiang-Cheng ; et al.	2016-07-07
Semiconductor package and method of fabricating the same Grant 9,324,585 - Chang , et al. April 26, 2	2016-04-26
Package Structure And Fabrication Method Thereof App 20160079136 - Chiu; Chi-Hsin ; et al.	2016-03-17
Semiconductor Package, Carrier Structure And Fabrication Method Thereof App 20160079110 - Chuang; Kuan-Wei ; et al.	2016-03-17
Semiconductor Package And Method Of Fabricating The Same App 20160071784 - Chang; Hong-Da ; et al.	2016-03-10
Fabrication Method Of Wafer Level Package Having A Pressure Sensor App 20150344299 - Chang; Hong-Da ; et al.	2015-12-03
Wafer level package having a pressure sensor and fabrication method thereof Grant 9,133,021 - Chang , et al. September 15, 2	2015-09-15
Fabrication method of semiconductor package Grant 9,117,698 - Chen , et al. August 25, 2	2015-08-25
Package Structure And Fabrication Method Thereof App 20150162264 - Chang; Hong-Da ; et al.	2015-06-11
Semiconductor package and method of fabricating the same Grant 9,041,189 - Lee , et al. May 26, 2	2015-05-26
Semiconductor Package And Method Of Fabricating The Same App 20150069628 - Tseng; Wen-Tsung ; et al.	2015-03-12
Semiconductor Package And Fabrication Method Thereof App 20150041969 - Chang; Hong-Da ; et al.	2015-02-12
Semiconductor Package And Method Of Fabricating The Same App 20150035163 - Ma; Guang-Hwa ; et al.	2015-02-05
Semiconductor Package And Method Of Fabricating The Same App 20150035164 - Ma; Guang-Hwa ; et al.	2015-02-05
Fabrication Method Of Semiconductor Package App 20140342507 - Chen; Yan-Heng ; et al.	2014-11-20
Semiconductor Device Having A Conductive Vias App 20140252603 - Lee; Meng-Tsung ; et al.	2014-09-11
Semiconductor package, package structure and fabrication method thereof Grant 8,829,672 - Chen , et al. September 9, 2	2014-09-09
Carrier, Semiconductor Package And Fabrication Method Thereof App 20140154842 - Chang; Chiang-Cheng ; et al.	2014-06-05
Method for manufacturing package structure with micro-electromechanical element Grant 8,741,693 - Huang , et al. June 3, 2	2014-06-03
Method For Fabricating Semiconductor Package App 20140134797 - Chi; Chieh-Yuan ; et al.	2014-05-15
Carrier, semiconductor package and fabrication method thereof Grant 8,680,692 - Chang , et al. March 25, 2	2014-03-25
Method For Manufacturing Package Structure With Micro-electromechanical Element App 20140080242 - Huang; Chun-An ; et al.	2014-03-20
Package having MEMS element and fabrication method thereof Grant 8,653,661 - Chan , et al. February 18, 2	2014-02-18
Semiconductor Package And Method Of Fabricating The Same App 20140021629 - Chang; Chiang-Cheng ; et al.	2014-01-23
Method for fabricating package structure having MEMS elements Grant 8,633,048 - Lin , et al. January 21, 2	2014-01-21
Semiconductor Package And Method Of Fabricating The Same App 20140015125 - Lee; Meng-Tsung ; et al.	2014-01-16
Semiconductor Package And Method Of Fabricating The Same App 20130341774 - Chang; Chiang-Cheng ; et al.	2013-12-26
Package structure with micro-electromechanical element and manufacturing method thereof Grant 8,610,272 - Huang , et al. December 17, 2	2013-12-17
Semiconductor Package, Package Structure And Fabrication Method Thereof App 20130256875 - Chen; Yan-Heng ; et al.	2013-10-03
Interposer And Electrical Testing Method Thereof App 20130249589 - Chen; Lu-Yi ; et al.	2013-09-26
Semiconductor Package And Fabrication Method Thereof App 20130228915 - Chang; Chiang-Cheng ; et al.	2013-09-05
Carrier, Semiconductor Package And Fabrication Method Thereof App 20130187285 - Chang; Chiang-Cheng ; et al.	2013-07-25
Package structure having MEMS elements and fabrication method thereof Grant 8,399,940 - Lin , et al. March 19, 2	2013-03-19
Semiconductor Package And Method Of Fabricating The Same App 20130020709 - Huang; Chun-An ; et al.	2013-01-24
Method For Fabricating Package Structure Having Mems Elements App 20130017643 - LIN; Chen-Han ; et al.	2013-01-17
Chip scale package and fabrication method thereof Grant 8,334,174 - Chang , et al. December 18, 2	2012-12-18
Chip-scale Package App 20120313243 - Chang; Chiang-Cheng ; et al.	2012-12-13
Package Structure Having Mems Elements And Fabrication Method Thereof App 20120292722 - Lin; Chen-Han ; et al.	2012-11-22
Package Having Mems Element And Fabrication Method Thereof App 20120286425 - Chan; Chang-Yueh ; et al.	2012-11-15
Package structure having MEMS element and fabrication method thereof Grant 8,288,189 - Huang , et al. October 16, 2	2012-10-16
Method for fabricating semiconductor package App 20120129315 - Hu; Yeh-Chang ; et al.	2012-05-24
Package Structure With Micro-electromechanical Element And Manufacturing Method Thereof App 20120104517 - Huang; Chun-An ; et al.	2012-05-03
Package With Embedded Chip And Method Of Fabricating The Same App 20120086117 - Chang; Chiang-Cheng ; et al.	2012-04-12
Package structure having MEMS element and fabrication method thereof Grant 8,154,115 - Chan , et al. April 10, 2	2012-04-10
Package Structure Having Mems Element And Fabrication Method Thereof App 20120056279 - Huang; Chun-An ; et al.	2012-03-08
Chip Scale Package And Fabrication Method Thereof App 20120018870 - Chang; Chiang-Cheng ; et al.	2012-01-26
Wafer Level Package Having A Pressure Sensor And Fabrication Method Thereof App 20120001274 - Chang; Hong-Da ; et al.	2012-01-05
Semiconductor device package with a heat sink and method for fabricating the same Grant 7,485,496 - Chien , et al. February 3, 2	2009-02-03
Leadframe based flip chip semiconductor package and lead frame thereof App 20080230878 - Lu; Wei-Lung ; et al.	2008-09-25
Semiconductor device package with a heat sink and method for fabricating the same App 20070235861 - Chien; Kun-Sheng ; et al.	2007-10-11
Flip-chip semiconductor device App 20060249852 - Chiu; Shih-Kuang ; et al.	2006-11-09
Semiconductor Package With Heat Sink App 20050040519 - Huang, Chien-Ping ; et al.	2005-02-24
Semiconductor package with heat sink Grant 6,856,015 - Huang , et al. February 15, 2	2005-02-15
Substrate structure of flip chip package Grant 6,787,918 - Tsai , et al. September 7, 2	2004-09-07
Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer Grant 6,692,629 - Chen , et al. February 17, 2	2004-02-17
Flip-chip semiconductor package structure and process for fabricating the same Grant 6,600,232 - Chiu , et al. July 29, 2	2003-07-29
Semiconductor package structure with a heat-dissipation stiffener and method of fabricating the same App 20030102571 - Chiu, Shih-Kuang	2003-06-05
Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same Grant 6,506,626 - Chiu January 14, 2	2003-01-14
Flip-chip packaging process utilizing no-flow underfill technique Grant 6,489,180 - Tsai , et al. December 3, 2	2002-12-03
Flip chip semiconductor package Grant 6,459,144 - Pu , et al. October 1, 2	2002-10-01
Flip-chip semiconductor package structure and process for fabricating the same App 20020127774 - Chiu, Shih-Kuang ; et al.	2002-09-12
Flip Chip Semiconductor Package App 20020121705 - Pu, Han-Ping ; et al.	2002-09-05
Flip-chip bonding structure on substrate for flip-chip package application Grant 6,404,064 - Tsai , et al. June 11, 2	2002-06-11
Flip-chip bonding structure with stress-buffering property and method for making the same Grant 6,396,156 - Tang , et al. May 28, 2	2002-05-28
Flip-chip semiconductor package structure and process for fabricating the same Grant 6,391,683 - Chiu , et al. May 21, 2	2002-05-21
Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module Grant 6,391,682 - Tsai , et al. May 21, 2	2002-05-21