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name:-0.008357048034668
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Chiu; Shih-Feng Patent Filings

Chiu; Shih-Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Shih-Feng.The latest application filed is for "led-illuminated water spraying gun".

Company Profile
1.9.11
  • Chiu; Shih-Feng - Taipei TW
  • Chiu; Shih-Feng - Taoyuan Hsien TW
  • Chiu; Shih-Feng - Changhua TW
  • Chiu; Shih-Feng - Kaohsiung TW
  • Chiu; Shih Feng - Tainan TW
  • Chiu; Shih-Feng - Pingtung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tricyclodecane dimethanol composition and uses thereof
Grant 10,767,004 - Chiu , et al. Sep
2020-09-08
Extraction process for high-boiling aldehyde product separation and catalyst recovery
Grant 10,538,472 - Chou , et al. Ja
2020-01-21
Drill bit structure
Grant 9,630,261 - Chiu , et al. April 25, 2
2017-04-25
LED-illuminated water spraying gun
Grant 9,427,760 - Chiu August 30, 2
2016-08-30
LED-illuminated water spraying gun
Grant 9,427,759 - Chiu August 30, 2
2016-08-30
Led-illuminated Water Spraying Gun
App 20160167070 - Chiu; Shih-Feng
2016-06-16
Led-illuminated Water Spraying Gun
App 20160167069 - Chiu; Shih-Feng
2016-06-16
Drill Bit Structure
App 20150298219 - CHIU; Shih-Feng ;   et al.
2015-10-22
Operating Panel For An Uninterruptible Power System And Operating Method Thereof
App 20130132879 - HSU; PO-CHIANG ;   et al.
2013-05-23
Diindenothiophene derivatives and use thereof
Grant 8,236,967 - Chen , et al. August 7, 2
2012-08-07
Diindenothiophene Derivatives And Use Thereof
App 20100168444 - CHEN; SHINN-HORNG ;   et al.
2010-07-01
High frequency IC package and method for fabricating the same
Grant 7,554,197 - Huang , et al. June 30, 2
2009-06-30
Carbazole-based Compounds and Their Application
App 20070262704 - Tsai; Ming-Han ;   et al.
2007-11-15
High frequency IC package and method for fabricating the same
App 20070235871 - Huang; Hsiang-Ming ;   et al.
2007-10-11
Thin IC package for improving heat dissipation from chip backside
App 20070035008 - Wu; Cheng-Ting ;   et al.
2007-02-15

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