CHIU; Shih-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHIU; Shih-Chuan.The latest application filed is for "structure and formation method of semiconductor device with backside contact".

Company Profile

5.5.13

CHIU; Shih-Chuan - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure And Formation Method Of Semiconductor Device With Backside Contact App 20220310804 - SU; Huan-Chieh ; et al.	2022-09-29
Semiconductor Device Structure App 20220285223 - CHIU; Shih-Chuan ; et al.	2022-09-08
Contact Resistance Between Via and Conductive Line App 20220277984 - Chen; Chun-Yuan ; et al.	2022-09-01
Method for forming a semiconductor device structure having an electrical connection structure Grant 11,342,229 - Chiu , et al. May 24, 2	2022-05-24
Contact resistance between via and conductive line Grant 11,335,592 - Chen , et al. May 17, 2	2022-05-17
Backside Power Rail And Methods Of Forming The Same App 20220130823 - Su; Huan-Chieh ; et al.	2022-04-28
Semiconductor Device With Backside Power Rail And Methods Of Fabrication Thereof App 20220130991 - YU; Li-Zhen ; et al.	2022-04-28
Backside power rail and methods of forming the same Grant 11,222,892 - Su , et al. January 11, 2	2022-01-11
Backside Power Rail And Methods Of Forming The Same App 20210391325 - Su; Huan-Chieh ; et al.	2021-12-16
Interconnect Structure Having a Multi-Deck Conductive Feature and Method of Forming the Same App 20210391438 - Chiu; Shih-Chuan ; et al.	2021-12-16
Source/Drain Metal Contact and Formation Thereof App 20210313424 - Chiu; Shih-Chuan ; et al.	2021-10-07
Contact Structures With Deposited Silicide Layers App 20210280427 - WANG; Sung-Li ; et al.	2021-09-09
Source/drain metal contact and formation thereof Grant 11,043,558 - Chiu , et al. June 22, 2	2021-06-22
Contact structures with deposited silicide layers Grant 11,018,012 - Wang , et al. May 25, 2	2021-05-25
Contact Resistance Between Via and Conductive Line App 20210082742 - Chen; Chun-Yuan ; et al.	2021-03-18
Method For Forming A Semiconductor Device Structure Having An Electrical Connection Structure App 20200395251 - CHIU; Shih-Chuan ; et al.	2020-12-17
Source/Drain Metal Contact and Formation Thereof App 20200135858 - Chiu; Shih-Chuan ; et al.	2020-04-30
Contact Structures With Deposited Silicide Layers App 20200098572 - WANG; Sung-Li ; et al.	2020-03-26

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