| Patent | Date |
|---|
Semiconductor Package And Manufacturing Method Thereof
App 20220293508 - Huang; Chi-Ming ; et al. | 2022-09-15 |
Semiconductor package and manufacturing method thereof
Grant 11,373,946 - Huang , et al. June 28, 2 | 2022-06-28 |
Semiconductor Device And Manufacturing Method Thereof
App 20220189844 - Hung; Wensen ; et al. | 2022-06-16 |
Semiconductor device and manufacturing method thereof
Grant 11,302,600 - Hung , et al. April 12, 2 | 2022-04-12 |
Package Structure And Method Of Manufacturing The Same
App 20210407963 - Lin; Wei-Ting ; et al. | 2021-12-30 |
Fan-Out Package Structure and Method
App 20210391242 - Chiu; Tzu-Wei ; et al. | 2021-12-16 |
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
App 20210366814 - Hou; Shang-Yun ; et al. | 2021-11-25 |
Semicondutor Packages And Methods Of Forming Same
App 20210327723 - Lu; Chung-Yu ; et al. | 2021-10-21 |
Packages with interposers and methods for forming the same
Grant 11,152,312 - Chiu , et al. October 19, 2 | 2021-10-19 |
Semiconductor Package And Manufacturing Method Thereof
App 20210305145 - Huang; Chi-Ming ; et al. | 2021-09-30 |
Fan-out package structure and method
Grant 11,107,758 - Chiu , et al. August 31, 2 | 2021-08-31 |
Semiconductor Structure And Method For Fabricating Semiconductor Structure
App 20210233863 - LU; Chung-Yu ; et al. | 2021-07-29 |
Semiconductor Packages And Methods Of Forming The Same
App 20210202389 - Hsieh; Cheng-Yen ; et al. | 2021-07-01 |
Semiconductor Device And Manufacturing Method Thereof
App 20210193550 - Hung; Wensen ; et al. | 2021-06-24 |
Conductive vias in semiconductor packages and methods of forming same
Grant 10,978,346 - Huang , et al. April 13, 2 | 2021-04-13 |
Semiconductor structure and method for fabricating semiconductor structure
Grant 10,978,404 - Lu , et al. April 13, 2 | 2021-04-13 |
Semiconductor Structure And Method For Fabricating Semiconductor Structure
App 20210057350 - LU; Chung-Yu ; et al. | 2021-02-25 |
3D packages and methods for forming the same
Grant 10,854,567 - Hou , et al. December 1, 2 | 2020-12-01 |
Board Substrates, Three-dimensional Integrated Circuit Structures And Methods Of Forming The Same
App 20200312770 - Lu; Chung-Yu ; et al. | 2020-10-01 |
3D Packages and Methods for Forming the Same
App 20200126938 - Hou; Shang-Yun ; et al. | 2020-04-23 |
Fan-Out Package Structure and Method
App 20200051900 - Chiu; Tzu-Wei ; et al. | 2020-02-13 |
3D packages and methods for forming the same
Grant 10,529,679 - Hou , et al. J | 2020-01-07 |
Conductive Vias In Semiconductor Packages And Methods Of Forming Same
App 20200006143 - Huang; Sung-Hui ; et al. | 2020-01-02 |
Conductive vias in semiconductor packages and methods of forming same
Grant 10,510,603 - Huang , et al. Dec | 2019-12-17 |
Fan-out package structure and method
Grant 10,510,648 - Chiu , et al. Dec | 2019-12-17 |
Fan-Out Package Structure and Method
App 20190148277 - Chiu; Tzu-Wei ; et al. | 2019-05-16 |
Conductive Vias In Semiconductor Packages And Methods Of Forming Same
App 20190067104 - Huang; Sung-Hui ; et al. | 2019-02-28 |
Fan-out package structure and method
Grant 10,163,770 - Chiu , et al. Dec | 2018-12-25 |
Packages with Interposers and Methods for Forming the Same
App 20180277495 - Chiu; Sao-Ling ; et al. | 2018-09-27 |
Fan-Out Package Structure and Method
App 20180190578 - Chiu; Tzu-Wei ; et al. | 2018-07-05 |
Packages with interposers and methods for forming the same
Grant 9,984,981 - Chiu , et al. May 29, 2 | 2018-05-29 |
Fan-out package structure and method
Grant 9,953,911 - Chiu , et al. April 24, 2 | 2018-04-24 |
Fan-out Package Structure And Method
App 20180005930 - Chiu; Tzu-Wei ; et al. | 2018-01-04 |
Integrated fan-out package and method of fabricating the same
Grant 9,824,902 - Hou , et al. November 21, 2 | 2017-11-21 |
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
Grant 9,786,567 - Wu , et al. October 10, 2 | 2017-10-10 |
Packages with Interposers and Methods for Forming the Same
App 20170229401 - Chiu; Sao-Ling ; et al. | 2017-08-10 |
Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages
App 20170133282 - Wu; Wei-Cheng ; et al. | 2017-05-11 |
Packages with interposers and methods for forming the same
Grant 9,633,869 - Chiu , et al. April 25, 2 | 2017-04-25 |
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
Grant 9,581,638 - Wu , et al. February 28, 2 | 2017-02-28 |
3D Packages and Methods for Forming the Same
App 20150262958 - Hou; Shang-Yun ; et al. | 2015-09-17 |
3D packages and methods for forming the same
Grant 9,048,231 - Hou , et al. June 2, 2 | 2015-06-02 |
Flip-chip BGA assembly process
Grant 8,993,378 - Liu , et al. March 31, 2 | 2015-03-31 |
Packages with Interposers and Methods for Forming the Same
App 20150048503 - Chiu; Sao-Ling ; et al. | 2015-02-19 |
3D Packages and Methods for Forming the Same
App 20140306341 - Hou; Shang-Yun ; et al. | 2014-10-16 |
Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages
App 20140266283 - Wu; Wei-Cheng ; et al. | 2014-09-18 |
Package Device Including An Opening In A Flexible Substrate And Methods Of Forming The Same
App 20140264803 - Lin; Tsung-Shu ; et al. | 2014-09-18 |
Package device including an opening in a flexible substrate and methods of forming the same
Grant 8,836,094 - Lin , et al. September 16, 2 | 2014-09-16 |
3D packages and methods for forming the same
Grant 8,802,504 - Hou , et al. August 12, 2 | 2014-08-12 |
Methods and Apparatus for Direct Connections to Through Vias
App 20130241057 - Yu; Chen-Hua ; et al. | 2013-09-19 |
Flip-chip Bga Assembly Process
App 20130059416 - LIU; Yu-Chih ; et al. | 2013-03-07 |
Apparatus and methods for semiconductor packages with improved warpage
Grant 8,288,208 - Liu , et al. October 16, 2 | 2012-10-16 |
Electronic devices including offset conductive bumps
Grant 7,579,694 - Jan , et al. August 25, 2 | 2009-08-25 |
Electronic devices including offset conductive bumps
App 20060231951 - Jan; Jong-Rong ; et al. | 2006-10-19 |
Methods of selectively bumping integrated circuit substrates and related structures
Grant 7,081,404 - Jan , et al. July 25, 2 | 2006-07-25 |
Methods of selectively bumping integrated circuit substrates and related structures
App 20040209406 - Jan, Jong-Rong ; et al. | 2004-10-21 |
| 