| Patent | Date |
|---|
Integrated Fan-out Package
App 20220278050 - Chiu; Ming-Yen ; et al. | 2022-09-01 |
Package structure having integrated circuit component with conductive terminals of different dimensions
Grant 11,417,569 - Chiu August 16, 2 | 2022-08-16 |
Package with Tilted Interface Between Device Die and Encapsulating Material
App 20220238404 - Chiu; Ming-Yen ; et al. | 2022-07-28 |
Integrated fan-out package
Grant 11,362,037 - Chiu , et al. June 14, 2 | 2022-06-14 |
Package with tilted interface between device die and encapsulating material
Grant 11,322,419 - Chiu , et al. May 3, 2 | 2022-05-03 |
Integrated fan-out package and method of fabricating the same
Grant 11,282,796 - Chiu , et al. March 22, 2 | 2022-03-22 |
Package Structure With Bump
App 20210118804 - CHIU; Ming-Yen ; et al. | 2021-04-22 |
Semiconductor Package for Thermal Dissipation
App 20210057387 - Yu; Chen-Hua ; et al. | 2021-02-25 |
Package structure with bump
Grant 10,879,185 - Chiu , et al. December 29, 2 | 2020-12-29 |
Semiconductor package for wafer level packaging and manufacturing method thereof
Grant 10,879,201 - Chiu , et al. December 29, 2 | 2020-12-29 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20200388574 - Chiu; Ming-Yen ; et al. | 2020-12-10 |
Semiconductor Package And Manufacturing Method Thereof
App 20200381382 - Chiu; Ming-Yen ; et al. | 2020-12-03 |
Integrated Fan-out Package
App 20200373245 - Chiu; Ming-Yen ; et al. | 2020-11-26 |
Package with Tilted Interface Between Device Die and Encapsulating Material
App 20200365479 - Chiu; Ming-Yen ; et al. | 2020-11-19 |
Semiconductor package for thermal dissipation
Grant 10,811,389 - Yu , et al. October 20, 2 | 2020-10-20 |
Integrated fan-out package and method of fabricating the same
Grant 10,790,235 - Chiu , et al. September 29, 2 | 2020-09-29 |
Integrated fan-out package
Grant 10,770,402 - Chiu , et al. Sep | 2020-09-08 |
Semiconductor Package And Manufacturing Method Thereof
App 20200273828 - Chiu; Ming-Yen ; et al. | 2020-08-27 |
Semiconductor package and manufacturing method thereof
Grant 10,756,038 - Chiu , et al. A | 2020-08-25 |
Package with tilted interface between device die and encapsulating material
Grant 10,734,299 - Chiu , et al. | 2020-08-04 |
Package Structure With Bump
App 20200135651 - CHIU; Ming-Yen ; et al. | 2020-04-30 |
Integrated circuit component package and method of fabricating the same
Grant 10,636,757 - Yang , et al. | 2020-04-28 |
Package structure with bump
Grant 10,515,899 - Chiu , et al. Dec | 2019-12-24 |
Integrated Fan-out Package
App 20190252323 - Chiu; Ming-Yen ; et al. | 2019-08-15 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190131243 - Chiu; Ming-Yen ; et al. | 2019-05-02 |
Semiconductor Package for Thermal Dissipation
App 20190131280 - Yu; Chen-Hua ; et al. | 2019-05-02 |
Integrated fan-out package
Grant 10,276,506 - Chiu , et al. | 2019-04-30 |
Package with Tilted Interface Between Device Die and Encapsulating Material
App 20190122948 - Chiu; Ming-Yen ; et al. | 2019-04-25 |
Integrated Circuit Component And Package Structure Having The Same
App 20190088547 - Chiu; Ming-Yen | 2019-03-21 |
Integrated Circuit Component Package And Method Of Fabricating The Same
App 20190067226 - Yang; Ching-Jung ; et al. | 2019-02-28 |
Integrated fan-out package and method of fabricating the same
Grant 10,170,430 - Chiu , et al. J | 2019-01-01 |
Semiconductor package for thermal dissipation
Grant 10,163,861 - Yu , et al. Dec | 2018-12-25 |
Package with tilted interface between device die and encapsulating material
Grant 10,163,745 - Chiu , et al. Dec | 2018-12-25 |
Integrated fan-out package and method of fabricating the same
Grant 10,109,589 - Chiu , et al. October 23, 2 | 2018-10-23 |
Post-passivation interconnect structure and methods thereof
Grant 10,068,867 - Chiu , et al. September 4, 2 | 2018-09-04 |
Integrated fan-out structure and method of forming
Grant 10,068,844 - Chiu , et al. September 4, 2 | 2018-09-04 |
Integrated fan-out package and method of fabricating the same
Grant 10,037,961 - Chiu , et al. July 31, 2 | 2018-07-31 |
Package with Tilted Interface between Device Die and Encapsulating Material
App 20180204780 - Chiu; Ming-Yen ; et al. | 2018-07-19 |
Conductive pattern and integrated fan-out package having the same
Grant 9,941,216 - Chiu , et al. April 10, 2 | 2018-04-10 |
Package Structure With Bump
App 20180096939 - CHIU; Ming-Yen ; et al. | 2018-04-05 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180096943 - Chiu; Ming-Yen ; et al. | 2018-04-05 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180096942 - Chiu; Ming-Yen ; et al. | 2018-04-05 |
Package with tilted interface between device die and encapsulating material
Grant 9,922,895 - Chiu , et al. March 20, 2 | 2018-03-20 |
Post-Passivation Interconnect Structure and Methods Thereof
App 20180068968 - Chiu; Chien-Chia ; et al. | 2018-03-08 |
Integrated Fan-out Package
App 20180025986 - Chiu; Ming-Yen ; et al. | 2018-01-25 |
Integrated fan-out package and method of fabricating the same
Grant 9,837,359 - Chiu , et al. December 5, 2 | 2017-12-05 |
Conductive Pattern And Integrated Fan-out Package Having The Same
App 20170345762 - Chiu; Ming-Yen ; et al. | 2017-11-30 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20170338196 - Chiu; Ming-Yen ; et al. | 2017-11-23 |
Post-passivation interconnect structure and methods thereof
Grant 9,818,711 - Chiu , et al. November 14, 2 | 2017-11-14 |
Package with Tilted Interface between Device Die and Encapsulating Material
App 20170323840 - Chiu; Ming-Yen ; et al. | 2017-11-09 |
SMD, IPD, and/or wire mount in a package
Grant 9,754,928 - Chen , et al. September 5, 2 | 2017-09-05 |
Integrated Fan-Out Structure and Method of Forming
App 20170092581 - Chiu; Ming-Yen ; et al. | 2017-03-30 |
Post-passivation Interconnect Structure And Methods Thereof
App 20170005054 - Chiu; Chien-Chia ; et al. | 2017-01-05 |
Semiconductor Package for Thermal Dissipation
App 20160358894 - Yu; Chen-Hua ; et al. | 2016-12-08 |
Semiconductor package including an embedded surface mount device and method of forming the same
Grant 9,461,020 - Yeh , et al. October 4, 2 | 2016-10-04 |
Semiconductor package for thermal dissipation
Grant 9,449,947 - Yu , et al. September 20, 2 | 2016-09-20 |
Semiconductor Package Including An Embedded Surface Mount Device And Method Of Forming The Same
App 20160079171 - Yeh; Der-Chyang ; et al. | 2016-03-17 |
Smd, Ipd, And/or Wire Mount In A Package
App 20160021754 - Chen; Hsien-Wei ; et al. | 2016-01-21 |
Semiconductor Package and Method
App 20160005716 - Yu; Chen-Hua ; et al. | 2016-01-07 |
Semiconductor package including an embedded surface mount device and method of forming the same
Grant 9,196,586 - Chen , et al. November 24, 2 | 2015-11-24 |
Semiconductor Package Including An Embedded Surface Mount Device And Method Of Forming The Same
App 20150228580 - Chen; Hsien-Wei ; et al. | 2015-08-13 |
Structure for integrated circuit alignment
Grant 8,786,054 - Harn , et al. July 22, 2 | 2014-07-22 |
Scribe line metal structure
Grant 8,368,180 - Yu , et al. February 5, 2 | 2013-02-05 |
Dummy pattern in wafer backside routing
Grant 8,174,124 - Chiu , et al. May 8, 2 | 2012-05-08 |
Dummy Pattern in Wafer Backside Routing
App 20110248404 - Chiu; Ming-Yen ; et al. | 2011-10-13 |
Design Structure For Integrated Circuit Alignment
App 20110115057 - Harn; Yu-Chyi ; et al. | 2011-05-19 |
Scribe Line Metal Structure
App 20100207251 - Yu; Chen-Hua ; et al. | 2010-08-19 |
Method for wafer level packaging and fabricating cap structures
Grant 7,598,125 - Shao , et al. October 6, 2 | 2009-10-06 |
Method for wafer level packaging and fabricating cap structures
Grant 7,510,947 - Shao , et al. March 31, 2 | 2009-03-31 |
Method Of Fabricating Micro Connectors
App 20080200023 - Chiu; Ming-Yen | 2008-08-21 |
Method of fabricating microconnectors
Grant 7,393,774 - Chiu July 1, 2 | 2008-07-01 |
Method Of Fabricating Microconnectors
App 20070259508 - Chiu; Ming-Yen | 2007-11-08 |
Method For Wafer Level Packaging And Fabricating Cap Structures
App 20070161210 - Shao; Shih-Feng ; et al. | 2007-07-12 |
Method For Wafer Level Packaging And Fabricating Cap Structures
App 20070161158 - Shao; Shih-Feng ; et al. | 2007-07-12 |
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