| Patent | Date |
|---|
Semiconductor Package Structure
App 20220084914 - CHIU; Chi-Tsung ; et al. | 2022-03-17 |
Semiconductor package structure and method for manufacturing the same
Grant 11,133,245 - Chiu , et al. September 28, 2 | 2021-09-28 |
Semiconductor package structure and method for manufacturing the same
Grant 11,127,707 - Chiu , et al. September 21, 2 | 2021-09-21 |
Semiconductor device package and method of manufacturing the same
Grant 11,037,868 - Lee , et al. June 15, 2 | 2021-06-15 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20210125911 - CHIU; Chi-Tsung ; et al. | 2021-04-29 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20210020594 - CHIU; Chi-Tsung ; et al. | 2021-01-21 |
Semiconductor Device Package
App 20200243427 - LEE; Hui Hua ; et al. | 2020-07-30 |
Semiconductor device package
Grant 10,707,157 - Lee , et al. | 2020-07-07 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200194356 - LEE; Hui Hua ; et al. | 2020-06-18 |
Semiconductor Device Package
App 20200194327 - CHIU; Chi-Tsung ; et al. | 2020-06-18 |
Semiconductor device package and method of manufacturing the same
Grant 10,615,105 - Lee , et al. | 2020-04-07 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20190122969 - LEE; Hui Hua ; et al. | 2019-04-25 |
Semiconductor package device and method of manufacturing the same
Grant 10,186,467 - Appelt , et al. Ja | 2019-01-22 |
Semiconductor Device Package
App 20180358276 - CHIU; Chi-Tsung ; et al. | 2018-12-13 |
Semiconductor device package
Grant 10,083,888 - Chiu , et al. September 25, 2 | 2018-09-25 |
Semiconductor device package
Grant 9,991,193 - Essig , et al. June 5, 2 | 2018-06-05 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180019221 - APPELT; Bernd Karl ; et al. | 2018-01-18 |
Semiconductor Device Package
App 20170365543 - LEE; Hui Hua ; et al. | 2017-12-21 |
Semiconductor Device Package
App 20170365542 - ESSIG; Kay Stefan ; et al. | 2017-12-21 |
Semiconductor Device Package
App 20170148746 - CHIU; Chi-Tsung ; et al. | 2017-05-25 |
Semiconductor device package and method of making the same
Grant 9,564,393 - Huang , et al. February 7, 2 | 2017-02-07 |
Semiconductor device packages having a side-by-side device arrangement and stacking functionality
Grant 9,171,792 - Sun , et al. October 27, 2 | 2015-10-27 |
Semiconductor structure having aperture antenna
Grant 9,172,131 - Chen , et al. October 27, 2 | 2015-10-27 |
Semiconductor transformer device and method for manufacturing the same
Grant 8,963,671 - Chen , et al. February 24, 2 | 2015-02-24 |
Semiconductor Structure Having Aperture Antenna
App 20140266947 - Chen; Chi-Han ; et al. | 2014-09-18 |
Semiconductor Transformer Device And Method For Manufacturing The Same
App 20140062641 - Chen; Chi-Han ; et al. | 2014-03-06 |
Semiconductor device packages with electromagnetic interference shielding
Grant 8,653,633 - Liao , et al. February 18, 2 | 2014-02-18 |
EMI-shielded semiconductor devices and methods of making
Grant 8,653,634 - Chiu , et al. February 18, 2 | 2014-02-18 |
Emi-shielded Semiconductor Devices And Methods Of Making
App 20130328176 - Chiu; Chi Tsung ; et al. | 2013-12-12 |
Band pass filter
Grant 8,502,623 - Lee , et al. August 6, 2 | 2013-08-06 |
Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via
Grant 8,486,829 - Chiu , et al. July 16, 2 | 2013-07-16 |
Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via
App 20130109178 - Chiu; Chi-Tsung ; et al. | 2013-05-02 |
Wafer-level semiconductor device packages with electromagnetic interference shielding
Grant 8,378,466 - Chiu , et al. February 19, 2 | 2013-02-19 |
Semiconductor device and semiconductor package having the same
Grant 8,368,202 - Chiu February 5, 2 | 2013-02-05 |
Semiconductor device packages with electromagnetic interference shielding
Grant 8,350,367 - Chiu , et al. January 8, 2 | 2013-01-08 |
Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via
Grant 8,350,361 - Chiu , et al. January 8, 2 | 2013-01-08 |
Semiconductor Device Packages Having A Side-by-side Device Arrangement And Stacking Functionality
App 20120217642 - Sun; Yu-Ching ; et al. | 2012-08-30 |
Semiconductor device packages with electromagnetic interference shielding
Grant 8,212,339 - Liao , et al. July 3, 2 | 2012-07-03 |
Semiconductor Device And Semiconductor Package Having The Same
App 20120126417 - Chiu; Chi-Tsung | 2012-05-24 |
Circuit substrate and method for fabricating inductive circuit
Grant 8,049,116 - Lee , et al. November 1, 2 | 2011-11-01 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20110260301 - Liao; Kuo-Hsien ; et al. | 2011-10-27 |
Semiconductor device packages with electromagnetic interference shielding
Grant 8,022,511 - Chiu , et al. September 20, 2 | 2011-09-20 |
Semiconductor device packages with electromagnetic interference shielding
Grant 7,989,928 - Liao , et al. August 2, 2 | 2011-08-02 |
Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding
App 20110115060 - Chiu; Chi-Tsung ; et al. | 2011-05-19 |
Semiconductor package having an antenna on the molding compound thereof
Grant 7,944,038 - Chiu , et al. May 17, 2 | 2011-05-17 |
Stacked semiconductor package having flexible circuit board therein
Grant 7,932,591 - Chiu April 26, 2 | 2011-04-26 |
Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via
App 20110068437 - Chiu; Chi-Tsung ; et al. | 2011-03-24 |
Stacked Lc Resonator And Bandpass Filter Of Using The Same
App 20100265009 - Horng; Tzyy-Sheng ; et al. | 2010-10-21 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20100207259 - Liao; Kuo-Hsien ; et al. | 2010-08-19 |
Substrate of window ball grid array package
App 20100071939 - Cheng; Hung-Hsiang ; et al. | 2010-03-25 |
Band Pass Filter
App 20100007438 - Lee; Pao-Nan ; et al. | 2010-01-14 |
Semiconductor package having an antenna
App 20090289343 - Chiu; Chi-Tsung ; et al. | 2009-11-26 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20090256244 - Liao; Kuo-Hsien ; et al. | 2009-10-15 |
Electronic package
Grant 7,586,184 - Hung , et al. September 8, 2 | 2009-09-08 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20090194851 - Chiu; Chi-Tsung ; et al. | 2009-08-06 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20090194852 - Chiu; Chi-Tsung ; et al. | 2009-08-06 |
Structure of package on package and method for fabricating the same
Grant 7,550,836 - Chou , et al. June 23, 2 | 2009-06-23 |
Circuit Substrate And Method For Fabricating Inductive Circuit
App 20090025964 - Lee; Pao-Nan ; et al. | 2009-01-29 |
Electronic Package
App 20080145589 - Hung; Chih Pin ; et al. | 2008-06-19 |
Package structure having through hole in spacer thereof
App 20080116556 - Chou; Che-Ya ; et al. | 2008-05-22 |
Structure of package on package and method for fabricating the same
App 20080099904 - Chou; Che-Ya ; et al. | 2008-05-01 |
Chip Package Structure And Heat Sink For Chip Package
App 20080054450 - Chiu; Chi-Tsung ; et al. | 2008-03-06 |
Stacked Semiconductor Package Having Flexible Circuit Board Therein
App 20070291458 - Chiu; Chi-Tsung | 2007-12-20 |
Semiconductor Package
App 20070267758 - TAO; Su ; et al. | 2007-11-22 |
Substrate with micro-via structures by laser technique
Grant 7,297,877 - Chiu November 20, 2 | 2007-11-20 |
Inductor and capacitor formed of build-up vias
Grant 7,248,134 - Wu , et al. July 24, 2 | 2007-07-24 |
Circuit substrate
Grant 7,145,428 - Chiu December 5, 2 | 2006-12-05 |
Impedance standard substrate and method for calibrating vector network analyzer
Grant 7,084,639 - Wu , et al. August 1, 2 | 2006-08-01 |
Impedance standard substrate and correction method for vector network analyzer
Grant 7,072,780 - Wu , et al. July 4, 2 | 2006-07-04 |
Impedance standard substrate and method for calibrating vector network analyzer
Grant 7,053,627 - Wu , et al. May 30, 2 | 2006-05-30 |
Circuit board with reduced simultaneous switching noise
App 20060108690 - Wu; Sung-Mao ; et al. | 2006-05-25 |
Inductor and capacitor formed of build-up vias
App 20060103483 - Wu; Sung-Mao ; et al. | 2006-05-18 |
Semiconductor package
App 20050189641 - Tao, Su ; et al. | 2005-09-01 |
Semiconductor package
Grant 6,933,605 - Tao , et al. August 23, 2 | 2005-08-23 |
Circuit substrate
App 20050152184 - Chiu, Chi-Tsung | 2005-07-14 |
Substrate with micro-via structures by laser technique
App 20050133251 - Chiu, Chi-Tsung | 2005-06-23 |
Impedance standard substrate and method for calibrating vector network analyzer
App 20050127923 - Wu, Sung Mao ; et al. | 2005-06-16 |
Semiconductor package structure and method for manufacturing the same
App 20050046046 - Chiu, Chi-Tsung ; et al. | 2005-03-03 |
Semiconductor package and substrate thereof
Grant 6,770,979 - Chiu , et al. August 3, 2 | 2004-08-03 |
Impedance standard substrate and correction method for vector network analyzer
App 20040138844 - Wu, Sung-Mao ; et al. | 2004-07-15 |
Semiconductor package
App 20040104462 - Tao, Su ; et al. | 2004-06-03 |
Semiconductor package structure and method for manufacturing the same
App 20040089929 - Chiu, Chi-Tsung ; et al. | 2004-05-13 |
Impedance standard substrate and method for calibrating vector network analyzer
App 20040070405 - Wu, Sung Mao ; et al. | 2004-04-15 |
Semiconductor package and substrate thereof
App 20040017007 - Chiu, Chi Tsung ; et al. | 2004-01-29 |
Ball grid array semiconductor package structure to avoid high frequency interference
App 20020125570 - Wu, Yu-Chun ; et al. | 2002-09-12 |
Substrate having specific pad distribution
Grant 6,403,896 - Ma , et al. June 11, 2 | 2002-06-11 |
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