| Patent | Date |
|---|
Method for making solid electrolytic capacitor package structure with improved conductive terminals
Grant 9,824,827 - Chiu , et al. November 21, 2 | 2017-11-21 |
Solid-state electrolytic capacitor with improved metallic anode and method for manufacturing the same
Grant 9,754,729 - Chiu , et al. September 5, 2 | 2017-09-05 |
Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same
Grant 9,741,496 - Chiu , et al. August 22, 2 | 2017-08-22 |
Stacked-type Solid Electrolytic Capacitor Package Structure And Method Of Manufacturing The Same
App 20170025228 - CHIU; CHI-HAO ; et al. | 2017-01-26 |
Matrix Arrangement Stacked-type Solid Electrolytic Capacitor Package Structure And Method Of Manufacturing The Same
App 20160343512 - CHIU; CHI-HAO ; et al. | 2016-11-24 |
Capacitor Unit With High-energy Storage
App 20160240327 - LIN; CHING-FENG ; et al. | 2016-08-18 |
Method For Making Solid Electrolytic Capacitor Package Structure With Improved Conductive Terminals
App 20160118197 - CHIU; CHI-HAO ; et al. | 2016-04-28 |
Solid-state Electrolytic Capacitor With Improved Metallic Anode And Method For Manufacturing The Same
App 20160118195 - CHIU; CHI-HAO ; et al. | 2016-04-28 |
Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit
Grant 9,159,490 - Chiu , et al. October 13, 2 | 2015-10-13 |
Method of manufacturing a stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins
Grant 9,105,398 - Chiu , et al. August 11, 2 | 2015-08-11 |
Solid Electrolytic Capacitor Package Structure And Method Of Manufacturing The Same, And Conductive Unit
App 20150194262 - CHIU; CHI-HAO ; et al. | 2015-07-09 |
Method Of Manufacturing A Stacked-type Solid Electrolytic Capacitor Package Structure Having A Plurality Of Negative Lead Pins
App 20150121672 - CHIU; CHI-HAO ; et al. | 2015-05-07 |
Solid Electrolytic Capacitor Package Structure For Decreasing Equivalent Series Resistance And Method Of Manufacturing The Same
App 20140307365 - CHIU; CHI-HAO ; et al. | 2014-10-16 |
Winding-type solid electrolytic capacitor package structure
Grant 8,787,002 - Lin , et al. July 22, 2 | 2014-07-22 |
Stacked-type solid electrolytic capacitor package structure
Grant 8,755,171 - Lin , et al. June 17, 2 | 2014-06-17 |
Stacked-type Solid Electrolytic Capacitor Package Structure Having A Plurality Of Negative Lead Pins And Method Of Manufacturing The Same
App 20140078647 - CHIU; Chi-Hao ; et al. | 2014-03-20 |
Stacked-type Solid Electrolytic Capacitor Package Structure
App 20140071590 - LIN; Ching-Feng ; et al. | 2014-03-13 |
Winding-type Solid Electrolytic Capacitor Package Structure
App 20140071589 - LIN; CHING-FENG ; et al. | 2014-03-13 |
Capacitance unit and stacked solid electrolytic capacitor
Grant 8,654,511 - Chiu , et al. February 18, 2 | 2014-02-18 |
Capacitor Unit And Stacked Solid Electrolytic Capacitor Having The Same
App 20130258555 - CHIU; CHI-HAO ; et al. | 2013-10-03 |
Stacked solid-state electrolytic capacitor with multi-directional product lead frame structure
Grant 8,390,991 - Chiu , et al. March 5, 2 | 2013-03-05 |
Solid electrolytic capacitor having a protective structure and method for manufacturing the same
Grant 8,373,972 - Lin , et al. February 12, 2 | 2013-02-12 |
Lamellar stacked solid electrolytic capacitor
Grant 8,369,066 - Lin , et al. February 5, 2 | 2013-02-05 |
Capacitance Unit And Stacked Solid Electrolytic Capacitor
App 20130010404 - CHIU; CHI-HAO ; et al. | 2013-01-10 |
Stacked capacitor with positive multi-pin structure
Grant 8,310,814 - Chiu , et al. November 13, 2 | 2012-11-13 |
Insulating encapsulation structure for solid chip electrolytic capacitor
Grant 8,305,734 - Chiu , et al. November 6, 2 | 2012-11-06 |
Stacked solid electrolytic capacitor with multi-pin structure
Grant 8,305,735 - Fran , et al. November 6, 2 | 2012-11-06 |
Solid Electrolytic Capacitor Having A Protective Structure And Method For Manufacturing The Same
App 20120099247 - LIN; CHING-FENG ; et al. | 2012-04-26 |
Stacked solid electrolytic capacitor and a method for manufacturing the same
Grant 8,164,883 - Chiu , et al. April 24, 2 | 2012-04-24 |
Insulating Encapsulation Structure For Solid Chip Electrolytic Capacitor
App 20120092810 - CHIU; CHI-HAO ; et al. | 2012-04-19 |
Stacked Solid-state Electrolytic Capacitor With Multi-directional Product Lead Frame Structure
App 20110216475 - Chiu; Chi-Hao ; et al. | 2011-09-08 |
Stacked Solid Electrolytic Capacitor And A Method For Manufacturing The Same
App 20110122544 - CHIU; Chi-Hao ; et al. | 2011-05-26 |
Stacked Solid Electrolytic Capacitor With Multi-pin Structure
App 20110007451 - Fran; Yui-Shin ; et al. | 2011-01-13 |
Lamellar Stacked Solid Electrolytic Capacitor
App 20110007452 - Lin; Ching-Feng ; et al. | 2011-01-13 |
Stacked capacitor with positive multi-pin structure
App 20110002087 - Chiu; Chi-Hao ; et al. | 2011-01-06 |
Backlight module
Grant 7,404,663 - Chiu , et al. July 29, 2 | 2008-07-29 |
Semiconductor package with a flip chip on a solder-resist leadframe
Grant 7,253,508 - Liu , et al. August 7, 2 | 2007-08-07 |
Flip Chip Package
App 20070085218 - Chen; Yu-Wen ; et al. | 2007-04-19 |
Flip chip package and manufacturing method thereof
Grant 7,163,840 - Chen , et al. January 16, 2 | 2007-01-16 |
Quad flat flip chip package and leadframe thereof
Grant 7,164,202 - Wang , et al. January 16, 2 | 2007-01-16 |
Resetable over-current protection device and method of making the same
Grant 7,138,900 - Liu , et al. November 21, 2 | 2006-11-21 |
Backlight module
App 20060227544 - Chiu; Chi-Hao ; et al. | 2006-10-12 |
Flip-chip type quad flat package and leadframe
Grant 7,067,904 - Wang , et al. June 27, 2 | 2006-06-27 |
Quad flat flip chip packaging process and leadframe therefor
Grant 7,022,551 - Wang , et al. April 4, 2 | 2006-04-04 |
Package structure with a heat spreader and manufacturing method thereof
Grant 6,967,403 - Chuang , et al. November 22, 2 | 2005-11-22 |
Manufacturing method of flip chip package
Grant 6,929,980 - Chiu , et al. August 16, 2 | 2005-08-16 |
Quad Flat Flip Chip Package And Leadframe Thereof
App 20050156296 - Wang, Hsueh-Te ; et al. | 2005-07-21 |
Flip Chip Package Structure And Chip Structure Thereof
App 20050146050 - Chen, Yu-Wen ; et al. | 2005-07-07 |
Semiconductor package with a flip chip on a solder-resist leadframe
App 20050133896 - Liu, Chien ; et al. | 2005-06-23 |
Flip-chip type quad flat package and leadframe
App 20050104167 - Wang, Hsueh-Te ; et al. | 2005-05-19 |
Quad flat flip chip packaging process and leadframe therefor
App 20050101053 - Wang, Hsueh-Te ; et al. | 2005-05-12 |
Manufacturing method of flip chip package
App 20040266061 - Chiu, Chi-Hao ; et al. | 2004-12-30 |
Pakage structure with a heat spreader and manufacturing method thereof
App 20040256643 - Chuang, Chi-Ta ; et al. | 2004-12-23 |
Resetable over-current protection device and method of making the same
App 20040252433 - Liu, Wen-Lung ; et al. | 2004-12-16 |
[flip Chip Package And Manufacturing Method Thereof]
App 20040229399 - Chen, Yu-Wen ; et al. | 2004-11-18 |
Multi-chips stacked package
App 20040212069 - Chen, Yu-Wen ; et al. | 2004-10-28 |
Flip chip package
App 20040212097 - Chen, Yu-Wen ; et al. | 2004-10-28 |
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