Chiu; Anthony M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Anthony M..The latest application filed is for "system and method for improving solder joint reliability in an integrated circuit package".

Company Profile

0.61.34

Chiu; Anthony M. - Richardson TX
CHIU, ANTHONY M - RICHARDSON TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System and method for improving solder joint reliability in an integrated circuit package Grant 8,524,531 - Chiu , et al. September 3, 2	2013-09-03
System And Method For Improving Solder Joint Reliability In An Integrated Circuit Package App 20130130492 - Chiu; Anthony M. ; et al.	2013-05-23
Fuel cell device Grant 8,367,271 - Chiu February 5, 2	2013-02-05
System and method for improving solder joint reliability in an integrated circuit package Grant 8,330,258 - Chiu , et al. December 11, 2	2012-12-11
Fuel cell device Grant 8,202,668 - Chiu June 19, 2	2012-06-19
Fuel cell device Grant 8,202,667 - Chiu June 19, 2	2012-06-19
Fuel cell device Grant 8,178,250 - Chiu May 15, 2	2012-05-15
Method for providing a redistribution metal layer in an integrated circuit Grant 8,163,645 - Thomas , et al. April 24, 2	2012-04-24
Method for providing a redistribution metal layer in an integrated circuit App 20100297841 - Thomas; Danielle A. ; et al.	2010-11-25
System for providing a redistribution metal layer in an integrated circuit Grant 7,786,582 - Thomas , et al. August 31, 2	2010-08-31
Method for using a pre-formed film in a transfer molding process for an integrated circuit Grant 7,595,017 - Siegel , et al. September 29, 2	2009-09-29
Fuel Cell Device App 20090208794 - Chiu; Anthony M.	2009-08-20
Fuel Cell Device App 20090208792 - CHIU; Anthony M.	2009-08-20
Fuel Cell Device App 20090208802 - Chiu; Anthony M.	2009-08-20
Fuel Cell Device App 20090208791 - CHIU; Anthony M.	2009-08-20
Fuel cell device Grant 7,547,483 - Chiu June 16, 2	2009-06-16
System and method for venting pressure from an integrated circuit package sealed with a lid Grant 7,534,716 - Chiu , et al. May 19, 2	2009-05-19
System and method for increasing the strength of a bond made by a small diameter wire in ball bonding Grant 7,482,260 - Chiu January 27, 2	2009-01-27
Integrated passive devices Grant 7,382,056 - Chiu , et al. June 3, 2	2008-06-03
System and method for increasing the strength of a bond made by a small diameter wire in ball bonding App 20080064208 - Chiu; Anthony M.	2008-03-13
Method of making optical elements for an optical disc system Grant 7,323,114 - Chiu , et al. January 29, 2	2008-01-29
System and method for increasing the strength of a bond made by a small diameter wire in ball bonding Grant 7,265,452 - Chiu September 4, 2	2007-09-04
Embedded flat film molding Grant 7,202,110 - Chiu , et al. April 10, 2	2007-04-10
Copper interposer for reducing warping of integrated circuit packages and method of making IC packages Grant 7,196,425 - Chiu , et al. March 27, 2	2007-03-27
System and method for venting pressure from an integrated circuit package sealed with a lid App 20070001286 - Chiu; Anthony M. ; et al.	2007-01-04
Leadframeless package structure and method App 20060261450 - Siegel; Harry M. ; et al.	2006-11-23
System and method for venting pressure from an integrated circuit package sealed with a lid Grant 7,126,210 - Chiu , et al. October 24, 2	2006-10-24
System for providing a redistribution metal layer in an integrated circuit App 20060234423 - Thomas; Danielle A. ; et al.	2006-10-19
Integrated circuit package with exposed die surfaces and auxiliary attachment Grant 7,109,574 - Chiu , et al. September 19, 2	2006-09-19
Method for providing a redistribution metal layer in an integrated circuit Grant 7,096,581 - Thomas , et al. August 29, 2	2006-08-29
Integrated lid formed on MEMS device Grant 7,098,065 - Chiu , et al. August 29, 2	2006-08-29
Method of making optical elements for an optical disc system App 20060144813 - Chiu; Anthony M. ; et al.	2006-07-06
Design of integrated circuit package using parametric solids modeller Grant 7,068,270 - Chiu June 27, 2	2006-06-27
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device Grant 7,061,091 - Chiu June 13, 2	2006-06-13
Fuel cell device App 20060073368 - Chiu; Anthony M.	2006-04-06
Copper interposer for reducing warping of integrated circuit packages and method of making IC packages App 20060071345 - Chiu; Anthony M. ; et al.	2006-04-06
Integrated Lid Formed On Mems Device App 20060065961 - Chiu; Anthony M. ; et al.	2006-03-30
Integrated optical unit for use with miniature optical discs Grant 7,006,426 - Chiu , et al. February 28, 2	2006-02-28
Integrated passive devices App 20050253257 - Chiu, Anthony M. ; et al.	2005-11-17
System and method for aligning an integrated circuit die on an integrated circuit substrate Grant 6,951,125 - Siegel , et al. October 4, 2	2005-10-04
Embedded flat film molding App 20050161784 - Chiu, Anthony M. ; et al.	2005-07-28
Method of eliminating uncontrolled voids in sheet adhesive layer Grant 6,919,230 - Chiu July 19, 2	2005-07-19
System and method for increasing the strength of a bond made by a small diameter wire in ball bonding App 20050150933 - Chiu, Anthony M.	2005-07-14
System and method for improving solder joint reliability in an integrated circuit package App 20050139972 - Chiu, Anthony M. ; et al.	2005-06-30
System and method for increasing the strength of a bond made by a small diameter wire in ball bonding Grant 6,908,787 - Chiu June 21, 2	2005-06-21
Embedded flat film molding Grant 6,900,508 - Chiu , et al. May 31, 2	2005-05-31
System and method for increasing the strength of a bond made by a small diameter wire in ball bonding App 20050003584 - Chiu, Anthony M.	2005-01-06
Surface mount package for linear array sensors Grant 6,818,963 - Chiu November 16, 2	2004-11-16
Leadframeless package structure and method App 20040200062 - Siegel, Harry M. ; et al.	2004-10-14
System and method for venting pressure from an integrated circuit package sealed with a lid App 20040195685 - Chiu, Anthony M. ; et al.	2004-10-07
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device App 20040195664 - Chiu, Anthony M.	2004-10-07
Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device Grant 6,787,388 - Chiu September 7, 2	2004-09-07
Leadframeless package structure and method Grant 6,769,174 - Siegel , et al. August 3, 2	2004-08-03
System and method for direct convective cooling of an exposed integrated circuit die surface Grant 6,771,500 - Siegel , et al. August 3, 2	2004-08-03
Method of eliminating uncontrolled voids in sheet adhesive layer App 20040140574 - Chiu, Anthony M.	2004-07-22
Method of eliminating uncontrolled voids in sheet adhesive layer Grant 6,707,163 - Chiu March 16, 2	2004-03-16
Integrated circuit device with exposed upper and lower die surfaces Grant 6,700,190 - Siegel , et al. March 2, 2	2004-03-02
Static charge dissipation for an active circuit surface Grant 6,686,546 - Chiu February 3, 2	2004-02-03
Integrated Circuit Device With Exposed Upper And Lower Die Surfaces App 20040017002 - Siegel, Harry M. ; et al.	2004-01-29
Leadframeless package structure and method App 20040017668 - Siegel, Harry M. ; et al.	2004-01-29
Integrated circuit package with exposed die surfaces and auxiliary attachment App 20040017000 - Chiu, Anthony M. ; et al.	2004-01-29
Embedded flat film molding App 20030193072 - Chiu, Anthony M. ; et al.	2003-10-16
System and method for providing a redistribution metal layer in an integrated circuit App 20030167632 - Thomas, Danielle A. ; et al.	2003-09-11
System and method for aligning an integrated circuit die on an integrated circuit substrate App 20030140678 - Siegel, Harry Michael ; et al.	2003-07-31
System and method for using a pre-formed film in a transfer molding process for an integrated circuit App 20030143406 - Siegel, Harry Michael ; et al.	2003-07-31
System And Method For Providing Mechanical Planarization Of A Sequential Build Up Substrate For An Integrated Circuit Package App 20030141595 - Chiu, Anthony M. ; et al.	2003-07-31
System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package Grant 6,600,227 - Chiu , et al. July 29, 2	2003-07-29
Integrated optical unit for use with miniature optical discs App 20030112488 - Chiu, Anthony M. ; et al.	2003-06-19
Method of eliminating uncontrolled voids in sheet adhesive layer App 20020149106 - Chiu, Anthony M.	2002-10-17
Thermally enhanced chip scale package Grant 6,437,984 - Chiu , et al. August 20, 2	2002-08-20
Low stress and low profile cavity down flip chip and wire bond BGA package Grant 6,414,849 - Chiu July 2, 2	2002-07-02
Static Charge Dissipation For An Active Circuit Surface App 20020067344 - CHIU, ANTHONY M	2002-06-06
Packaging and mounting of spherical semiconductor devices Grant 6,326,647 - Chiu December 4, 2	2001-12-04
Apparatus and method for automating the underfill of flip-chip devices Grant 6,228,679 - Chiu May 8, 2	2001-05-08
Silver metallization by damascene method Grant 6,100,194 - Chan , et al. August 8, 2	2000-08-08
Apparatus and method for detecting the height above a silicon surface Grant 6,067,025 - Chiu , et al. May 23, 2	2000-05-23
Apparatus and method for automating the underfill of flip-chip devices Grant 5,942,798 - Chiu August 24, 1	1999-08-24
Ball contact for flip-chip devices Grant 5,849,132 - Chiu December 15, 1	1998-12-15
Low-profile socketed packaging system with land-grid array and thermally conductive slug Grant 5,805,419 - Hundt , et al. September 8, 1	1998-09-08
Process for manufacturing a lead frame Grant 5,696,029 - Alvarez , et al. December 9, 1	1997-12-09
Low-profile socketed packaging system with land-grid array and thermally conductive slug Grant 5,677,247 - Hundt , et al. October 14, 1	1997-10-14
Integrated circuit device having improved post for surface-mount package Grant 5,555,488 - McLellan , et al. September 10, 1	1996-09-10
Wafer burn-in and test system Grant 5,532,614 - Chiu July 2, 1	1996-07-02
Wafer burn-in and test system Grant 5,444,366 - Chiu August 22, 1	1995-08-22
Folded bus bar leadframe and method of making Grant 5,358,598 - Chiu October 25, 1	1994-10-25
Semiconductor device having die pad locking to substantially reduce package cracking Grant 5,358,905 - Chiu October 25, 1	1994-10-25
Three dimensional multi-chip module with integral heat sink Grant 5,359,493 - Chiu October 25, 1	1994-10-25
Wafer burn-in and test system Grant 5,307,010 - Chiu April 26, 1	1994-04-26
Folded bus bar leadframe Grant 5,286,999 - Chiu February 15, 1	1994-02-15
Chip on board assembly Grant 5,243,497 - Chiu September 7, 1	1993-09-07
Low cost erasable programmable read only memory package Grant 5,192,681 - Chiu March 9, 1	1993-03-09
Semiconductor lead planarity checker Grant 5,163,232 - Gonzales, Jr. , et al. November 17, 1	1992-11-17
Low cost erasable programmable read only memory package Grant 5,136,367 - Chiu August 4, 1	1992-08-04
Apparatus for testing a plurality of integrated circuits in parallel Grant 4,639,664 - Chiu , et al. January 27, 1	1987-01-27

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