loadpatents
Patent applications and USPTO patent grants for Chiu; Anthony.The latest application filed is for "integrated circuit die stacked with backer die including capacitors and thermal vias".
Patent | Date |
---|---|
Integrated Circuit Die Stacked With Backer Die Including Capacitors And Thermal Vias App 20220310471 - Chiu; Anthony ;   et al. | 2022-09-29 |
Packages for advanced antenna systems Grant 11,303,009 - Chiu , et al. April 12, 2 | 2022-04-12 |
Packages For Advanced Antenna Systems App 20210050650 - Chiu; Anthony ;   et al. | 2021-02-18 |
Air cavity package Grant 10,177,064 - Anderson , et al. J | 2019-01-08 |
Method of fabricating a multi-channel modulator driver with enclosure Grant 9,936,587 - Steinbeiser , et al. April 3, 2 | 2018-04-03 |
Air Cavity Package App 20180061730 - Anderson; Kevin J. ;   et al. | 2018-03-01 |
Top-side cooling of RF products in air cavity composite packages Grant 9,899,292 - Chiu , et al. February 20, 2 | 2018-02-20 |
Top-side Cooling Of Rf Products In Air Cavity Composite Packages App 20170229368 - Chiu; Anthony ;   et al. | 2017-08-10 |
Enclosure For A Multi-channel Modulator Driver App 20150334848 - Steinbeiser; Craig ;   et al. | 2015-11-19 |
Enclosure for a multi-channel modulator driver Grant 9,113,549 - Steinbeiser , et al. August 18, 2 | 2015-08-18 |
Enclosure For A Multi-channel Modulator Driver App 20130141883 - Steinbeiser; Craig ;   et al. | 2013-06-06 |
Stress reduction for flip chip package Grant 6,011,301 - Chiu January 4, 2 | 2000-01-04 |
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