loadpatents
name:-0.010222911834717
name:-0.0076589584350586
name:-0.0046839714050293
Chiu; Anthony Patent Filings

Chiu; Anthony

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Anthony.The latest application filed is for "integrated circuit die stacked with backer die including capacitors and thermal vias".

Company Profile
3.7.7
  • Chiu; Anthony - Richardson TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated Circuit Die Stacked With Backer Die Including Capacitors And Thermal Vias
App 20220310471 - Chiu; Anthony ;   et al.
2022-09-29
Packages for advanced antenna systems
Grant 11,303,009 - Chiu , et al. April 12, 2
2022-04-12
Packages For Advanced Antenna Systems
App 20210050650 - Chiu; Anthony ;   et al.
2021-02-18
Air cavity package
Grant 10,177,064 - Anderson , et al. J
2019-01-08
Method of fabricating a multi-channel modulator driver with enclosure
Grant 9,936,587 - Steinbeiser , et al. April 3, 2
2018-04-03
Air Cavity Package
App 20180061730 - Anderson; Kevin J. ;   et al.
2018-03-01
Top-side cooling of RF products in air cavity composite packages
Grant 9,899,292 - Chiu , et al. February 20, 2
2018-02-20
Top-side Cooling Of Rf Products In Air Cavity Composite Packages
App 20170229368 - Chiu; Anthony ;   et al.
2017-08-10
Enclosure For A Multi-channel Modulator Driver
App 20150334848 - Steinbeiser; Craig ;   et al.
2015-11-19
Enclosure for a multi-channel modulator driver
Grant 9,113,549 - Steinbeiser , et al. August 18, 2
2015-08-18
Enclosure For A Multi-channel Modulator Driver
App 20130141883 - Steinbeiser; Craig ;   et al.
2013-06-06
Stress reduction for flip chip package
Grant 6,011,301 - Chiu January 4, 2
2000-01-04

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