loadpatents
name:-0.026004791259766
name:-0.022842168807983
name:-0.020220994949341
Chito; Kenta Patent Filings

Chito; Kenta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chito; Kenta.The latest application filed is for "processing method of wafer".

Company Profile
7.8.8
  • Chito; Kenta - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Processing method of wafer
Grant 11,456,213 - Nishida , et al. September 27, 2
2022-09-27
Method of processing a wafer
Grant 10,957,593 - Nishida , et al. March 23, 2
2021-03-23
Processing Method Of Wafer
App 20210082763 - NISHIDA; Yoshiteru ;   et al.
2021-03-18
Hold checking method and unhold checking method for wafer
Grant 10,910,246 - Chito February 2, 2
2021-02-02
Electrostatic chuck
Grant 10,896,836 - Chito , et al. January 19, 2
2021-01-19
Wafer processing method
Grant 10,790,193 - Nishida , et al. September 29, 2
2020-09-29
Wafer processing method
Grant 10,790,192 - Nishida , et al. September 29, 2
2020-09-29
Method Of Processing A Wafer
App 20200176313 - NISHIDA; Yoshiteru ;   et al.
2020-06-04
Wafer unloading method
Grant 10,665,492 - Chito
2020-05-26
Plasma etching method
Grant 10,453,719 - Chito Oc
2019-10-22
Wafer Processing Method
App 20190311951 - NISHIDA; Yoshiteru ;   et al.
2019-10-10
Wafer Processing Method
App 20190311952 - NISHIDA; Yoshiteru ;   et al.
2019-10-10
Electrostatic Chuck
App 20190019712 - Chito; Kenta ;   et al.
2019-01-17
Wafer Unloading Method
App 20180301363 - Chito; Kenta
2018-10-18
Plasma Etching Method
App 20180240690 - Chito; Kenta
2018-08-23
Hold Checking Method And Unhold Checking Method For Wafer
App 20180025928 - Chito; Kenta
2018-01-25

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