loadpatents
Patent applications and USPTO patent grants for Chito; Kenta.The latest application filed is for "processing method of wafer".
Patent | Date |
---|---|
Processing method of wafer Grant 11,456,213 - Nishida , et al. September 27, 2 | 2022-09-27 |
Method of processing a wafer Grant 10,957,593 - Nishida , et al. March 23, 2 | 2021-03-23 |
Processing Method Of Wafer App 20210082763 - NISHIDA; Yoshiteru ;   et al. | 2021-03-18 |
Hold checking method and unhold checking method for wafer Grant 10,910,246 - Chito February 2, 2 | 2021-02-02 |
Electrostatic chuck Grant 10,896,836 - Chito , et al. January 19, 2 | 2021-01-19 |
Wafer processing method Grant 10,790,193 - Nishida , et al. September 29, 2 | 2020-09-29 |
Wafer processing method Grant 10,790,192 - Nishida , et al. September 29, 2 | 2020-09-29 |
Method Of Processing A Wafer App 20200176313 - NISHIDA; Yoshiteru ;   et al. | 2020-06-04 |
Wafer unloading method Grant 10,665,492 - Chito | 2020-05-26 |
Plasma etching method Grant 10,453,719 - Chito Oc | 2019-10-22 |
Wafer Processing Method App 20190311951 - NISHIDA; Yoshiteru ;   et al. | 2019-10-10 |
Wafer Processing Method App 20190311952 - NISHIDA; Yoshiteru ;   et al. | 2019-10-10 |
Electrostatic Chuck App 20190019712 - Chito; Kenta ;   et al. | 2019-01-17 |
Wafer Unloading Method App 20180301363 - Chito; Kenta | 2018-10-18 |
Plasma Etching Method App 20180240690 - Chito; Kenta | 2018-08-23 |
Hold Checking Method And Unhold Checking Method For Wafer App 20180025928 - Chito; Kenta | 2018-01-25 |
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