Patent | Date |
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Permanent wafer bonding using metal alloy preform discs Grant 10,873,002 - Chitnis December 22, 2 | 2020-12-22 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate Grant 10,211,296 - Lutgen , et al. Feb | 2019-02-19 |
Wire bond free wafer level LED Grant 10,199,360 - Keller , et al. Fe | 2019-02-05 |
P-doping Of Group-iii-nitride Buffer Layer Structure On A Heterosubstrate App 20180331187 - LUTGEN; Stephan ;   et al. | 2018-11-15 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate Grant 10,026,814 - Lutgen , et al. July 17, 2 | 2018-07-17 |
P-doping Of Group-iii-nitride Buffer Layer Structure On A Heterosubstrate App 20170373156 - LUTGEN; Stephan ;   et al. | 2017-12-28 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate Grant 9,786,744 - Lutgen , et al. October 10, 2 | 2017-10-10 |
Wire Bond Free Wafer Level Led App 20170179088 - Keller; Bernd ;   et al. | 2017-06-22 |
Wire bond free wafer level LED Grant 9,634,191 - Keller , et al. April 25, 2 | 2017-04-25 |
P-doping Of Group-iii-nitride Buffer Layer Structure On A Heterosubstrate App 20170077242 - LUTGEN; Stephan ;   et al. | 2017-03-16 |
P-doping of group-III-nitride buffer layer structure on a heterosubstrate Grant 9,496,349 - Lutgen , et al. November 15, 2 | 2016-11-15 |
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management Grant 9,368,428 - Chitnis , et al. June 14, 2 | 2016-06-14 |
P-doping Of Group-iii-nitride Buffer Layer Structure On A Heterosubstrate App 20150357419 - LUTGEN; Stephan ;   et al. | 2015-12-10 |
LED chips having fluorescent substrates with microholes and methods for fabricating Grant 9,196,799 - Chitnis , et al. November 24, 2 | 2015-11-24 |
Wafer level phosphor coating method and devices fabricated utilizing method Grant 9,159,888 - Chitnis , et al. October 13, 2 | 2015-10-13 |
Wafer level phosphor coating method and devices fabricated utilizing method Grant 9,024,349 - Chitnis , et al. May 5, 2 | 2015-05-05 |
Flip-chip Phosphor Coating Method And Devices Fabricated Utilizing Method App 20150008457 - Chitnis; Ashay ;   et al. | 2015-01-08 |
Emission tuning methods and devices fabricated utilizing methods Grant 8,877,524 - Chitnis , et al. November 4, 2 | 2014-11-04 |
Flip-chip phosphor coating method and devices fabricated utilizing method Grant 8,878,219 - Chitnis , et al. November 4, 2 | 2014-11-04 |
Selective wet etching of gold-tin based solder Grant 8,617,997 - Chitnis December 31, 2 | 2013-12-31 |
Ohmic contacts to nitrogen polarity GaN Grant 8,021,904 - Chitnis September 20, 2 | 2011-09-20 |
Bulk acoustic device and method for fabricating Grant 7,982,363 - Chitnis July 19, 2 | 2011-07-19 |
Light emitting diode chip with electrical insulation element App 20100224890 - Keller; Bernd ;   et al. | 2010-09-09 |
LED chip Grant D616,839 - Edmond , et al. June 1, 2 | 2010-06-01 |
Emission Tuning Methods And Devices Fabricated Utilizing Methods App 20090261358 - CHITNIS; ASHAY ;   et al. | 2009-10-22 |
LED chip Grant D602,450 - Edmond , et al. October 20, 2 | 2009-10-20 |
Flip-chip phosphor coating method and devices fabricated utilizing method App 20090179207 - Chitnis; Ashay ;   et al. | 2009-07-16 |
LED chip Grant D593,968 - Edmond , et al. June 9, 2 | 2009-06-09 |
Wire bond free wafer level LED App 20090121241 - Keller; Bernd ;   et al. | 2009-05-14 |
LED chips having fluorescent substrates with microholes and methods for fabricating App 20090065790 - Chitnis; Ashay ;   et al. | 2009-03-12 |
Selective wet etching of gold-tin based solder App 20090050903 - Chitnis; Ashay | 2009-02-26 |
LED chip Grant D583,338 - Edmond , et al. December 23, 2 | 2008-12-23 |
LED chip Grant D582,865 - Edmond , et al. December 16, 2 | 2008-12-16 |
LED chip Grant D582,866 - Edmond , et al. December 16, 2 | 2008-12-16 |
Bulk acoustic device and method for fabricating App 20080284541 - Chitnis; Ashay | 2008-11-20 |
Ohmic contacts to nitrogen polarity GaN App 20080185608 - Chitnis; Ashay | 2008-08-07 |
Wafer level phosphor coating method and devices fabricated utilizing method App 20080179611 - Chitnis; Ashay ;   et al. | 2008-07-31 |
Wafer level phosphor coating method and devices fabricated utilizing method App 20080173884 - Chitnis; Ashay ;   et al. | 2008-07-24 |
Permanent wafer bonding using metal alloy preform discs App 20080096365 - Chitnis; Ashay | 2008-04-24 |
Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management App 20070284602 - Chitnis; Ashay ;   et al. | 2007-12-13 |