loadpatents
name:-0.0035459995269775
name:-0.0053529739379883
name:-0.00047397613525391
Chirayarikathuveedu Sankarapillai; Premachandran Patent Filings

Chirayarikathuveedu Sankarapillai; Premachandran

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chirayarikathuveedu Sankarapillai; Premachandran.The latest application filed is for "bonding method using porosified surfaces for making stacked structures".

Company Profile
0.5.4
  • Chirayarikathuveedu Sankarapillai; Premachandran - Clifton Park NY
  • Chirayarikathuveedu Sankarapillai; Premachandran - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding method using porosified surfaces for making stacked structures
Grant 9,272,899 - Kotlanka , et al. March 1, 2
2016-03-01
Bonding Method Using Porosified Surfaces For Making Stacked Structures
App 20150115453 - KOTLANKA; Rama Krishna ;   et al.
2015-04-30
Bonding method using porosified surfaces for making stacked structures
Grant 8,940,616 - Kotlanka , et al. January 27, 2
2015-01-27
Bonding Method Using Porosified Surfaces For Making Stacked Structures
App 20140030847 - KOTLANKA; Rama Krishna ;   et al.
2014-01-30
Package interconnects
Grant 8,513,767 - Kotlanka , et al. August 20, 2
2013-08-20
Package Interconnects
App 20120241901 - KOTLANKA; Rama Krishna ;   et al.
2012-09-27

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