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Electronic Module Including A Semiconductor Package Connected To A Fluid Heatsink
App 20210225734 - Fuergut; Edward ; et al. | 2021-07-22 |
Baseplate for an electronic module
Grant 10,109,544 - Brucchi , et al. October 23, 2 | 2018-10-23 |
Merged P-i-N Schottky structure
Grant 9,865,749 - Chiola , et al. January 9, 2 | 2018-01-09 |
Baseplate for an electronic module and method of manufacturing the same
App 20170287798 - BRUCCHI; Fabio ; et al. | 2017-10-05 |
Method of manufacturing baseplate for an electronic module
Grant 9,716,018 - Brucchi , et al. July 25, 2 | 2017-07-25 |
Baseplate for an electronic module and method of manufacturing the same
App 20160196989 - BRUCCHI; Fabio ; et al. | 2016-07-07 |
Baseplate for an electronic module and method of manufacturing the same
Grant 9,305,874 - Brucchi , et al. April 5, 2 | 2016-04-05 |
Baseplate for an electronic module and method of manufacturing the same
App 20150294931 - BRUCCHI; Fabio ; et al. | 2015-10-15 |
Chip Arrangement And Chip Package
App 20140210061 - Otremba; Ralf ; et al. | 2014-07-31 |
Semiconductor modules and methods of formation thereof
Grant 8,766,430 - Otremba , et al. July 1, 2 | 2014-07-01 |
Semiconductor Modules and Methods of Formation Thereof
App 20130334677 - Otremba; Ralf ; et al. | 2013-12-19 |
Semiconductor component
Grant 8,304,305 - Chiola , et al. November 6, 2 | 2012-11-06 |
Trench schottky barrier diode with differential oxide thickness
Grant 8,143,655 - Chiola March 27, 2 | 2012-03-27 |
Semiconductor Component
App 20110233728 - CHIOLA; Davide ; et al. | 2011-09-29 |
Method for producing a semiconductor component
Grant 8,003,456 - Chiola , et al. August 23, 2 | 2011-08-23 |
Thick field oxide termination for trench schottky device
Grant 7,973,381 - Chiola July 5, 2 | 2011-07-05 |
Merged P-i-N Schottky structure
Grant 7,858,456 - Chiola , et al. December 28, 2 | 2010-12-28 |
Process for forming thick oxides on Si or SiC for semiconductor devices
Grant 7,754,550 - Chiola , et al. July 13, 2 | 2010-07-13 |
Trench IGBT for highly capacitive loads
Grant 7,655,977 - Ng , et al. February 2, 2 | 2010-02-02 |
Integrated fet and schottky device
Grant 7,510,953 - He , et al. March 31, 2 | 2009-03-31 |
Method For Producing A Semiconductor Component, And A Semiconductor Component
App 20080315363 - CHIOLA; DAVIDE ; et al. | 2008-12-25 |
Recessed termination for trench schottky device without junction curvature
Grant 7,466,005 - Chiola December 16, 2 | 2008-12-16 |
Trench Schottky barrier diode with differential oxide thickness
App 20080087896 - Chiola; Davide | 2008-04-17 |
Trench Schottky barrier diode with differential oxide thickness
Grant 7,323,402 - Chiola January 29, 2 | 2008-01-29 |
Trench IGBT for highly capacitive loads
App 20070085148 - Ng; Chiu ; et al. | 2007-04-19 |
Termination design with multiple spiral trench rings
Grant 7,196,397 - Chiola , et al. March 27, 2 | 2007-03-27 |
Merged P-i-N Schottky structure
App 20060189107 - Chiola; Davide ; et al. | 2006-08-24 |
Fast recovery diode with a single large area p/n junction
Grant 7,091,572 - Andoh , et al. August 15, 2 | 2006-08-15 |
Merged P-i-N schottky structure
Grant 7,071,525 - Chiola , et al. July 4, 2 | 2006-07-04 |
Integrated pet and schottky device
App 20060035422 - He; Donald ; et al. | 2006-02-16 |
Process for preparation of semiconductor wafer surface
Grant 6,991,943 - Andoh , et al. January 31, 2 | 2006-01-31 |
Fast recovery diode with a single large area P/N junction
App 20060017130 - Andoh; Kohji ; et al. | 2006-01-26 |
Integrated FET and schottky device
Grant 6,987,305 - He , et al. January 17, 2 | 2006-01-17 |
Schottky with thick trench bottom and termination oxide and process for manufacture
Grant 6,977,208 - Chiola December 20, 2 | 2005-12-20 |
Termination design with multiple spiral trench rings
App 20050230777 - Chiola, Davide ; et al. | 2005-10-20 |
Recessed termination for trench schottky device without junction curvature
App 20050202637 - Chiola, Davide | 2005-09-15 |
Temperature-sensing diode
Grant 6,930,371 - Necco , et al. August 16, 2 | 2005-08-16 |
Process for forming fast recovery diode with a single large area P/N junction
Grant 6,927,141 - Andoh , et al. August 9, 2 | 2005-08-09 |
Schottky with thick trench bottom and termination oxide and process for manufacture
App 20050161758 - Chiola, Davide | 2005-07-28 |
Merged P-i-N schottky structure
App 20050161759 - Chiola, Davide ; et al. | 2005-07-28 |
Trench schottky barrier diode with differential oxide thickness
App 20050127465 - Chiola, Davide | 2005-06-16 |
Process for preparation of semiconductor wafer surface
App 20050124085 - Andoh, Kohji ; et al. | 2005-06-09 |
Thick field oxide termination for trench schottky device and process for manufacture
App 20050062124 - Chiola, Davide | 2005-03-24 |
Trench Schottky barrier diode
Grant 6,855,593 - Andoh , et al. February 15, 2 | 2005-02-15 |
Integrated fet and schottky device
App 20050029585 - He, Donald ; et al. | 2005-02-10 |
Process for counter doping N-type silicon in Schottky device Ti silicide barrier
Grant 6,846,729 - Andoh , et al. January 25, 2 | 2005-01-25 |
Process for forming thick oxides on Si or SiC for semiconductor devices
App 20050009255 - Chiola, Davide ; et al. | 2005-01-13 |
Temperature-sensing diode
App 20040222430 - Necco, Fabio ; et al. | 2004-11-11 |
Process for forming fast recovery diode with a single large area P/N junction
App 20040077305 - Andoh, Kohji ; et al. | 2004-04-22 |
Trench schottky barrier diode
App 20040007723 - Andoh, Kohji ; et al. | 2004-01-15 |
Process for counter doping N-type silicon in Schottky device with Ti silicide barrier
App 20030062585 - Andoh, Kohji ; et al. | 2003-04-03 |
Low cost fast recovery diode and process of its manufacture
App 20020195613 - Andoh, Kohji ; et al. | 2002-12-26 |
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