Chiniwalla; Punit P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiniwalla; Punit P..The latest application filed is for "silicon based optical vias".

Company Profile

0.8.6

Chiniwalla; Punit P. - New York NY US
Chiniwalla; Punit P. - Ann Arbor MI
Chiniwalla; Punit P. - Glenshaw PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon based optical vias Grant 8,755,644 - Budd , et al. June 17, 2	2014-06-17
Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array Grant 7,883,277 - Budd , et al. February 8, 2	2011-02-08
Silicon based optical vias App 20100322551 - Budd; Russell A. ; et al.	2010-12-23
Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types Grant 7,613,368 - Hougham , et al. November 3, 2	2009-11-03
Chip to Chip optical interconnect Grant 7,480,429 - Chiniwalla , et al. January 20, 2	2009-01-20
Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array Grant 7,474,815 - Budd , et al. January 6, 2	2009-01-06
Chip To Chip Optical Interconnect App 20090003762 - Chiniwalla; Punit P. ; et al.	2009-01-01
Interconnecting (mapping) A Two-dimensional Optoelectronic (oe) Device Array To A One-dimensional Waveguide Array App 20080205817 - Budd; Russell A. ; et al.	2008-08-28
Medium containing optical paths and electrically conducting paths for applications in high speed data links Grant 7,367,715 - Budd , et al. May 6, 2	2008-05-06
Silicon based optical vias Grant 7,352,066 - Budd , et al. April 1, 2	2008-04-01
Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array App 20070217750 - Budd; Russell A. ; et al.	2007-09-20
Silicon based optical vias App 20070085215 - Budd; Russell A. ; et al.	2007-04-19
Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types App 20060105607 - Hougham; Gareth G. ; et al.	2006-05-18

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