Ching; Kai-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ching; Kai-Ming.The latest application filed is for "semiconductor package and method of manufacturing the same".
Company Profile
0.51.41
- Ching; Kai-Ming - Hsinchu County TW
- Ching; Kai-Ming - Jhudong Township TW
- Ching; Kai-Ming - Jhudong Township, Hsinchu County N/A TW
- Ching; Kai-Ming - Hsin-Chu N/A TW
- Ching; Kai-Ming - Taiping N/A TW
- Ching; Kai-Ming - Jhudong TW
- Ching; Kai-Ming - Hsinchu TW
- Ching; Kai-Ming - Taichung TW
- Ching; Kai-Ming - Taiping City TW
- Ching, Kai-Ming - Taipei City TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Package And Method Of Manufacturing The Same App 20220148979 - Ching; Kai-Ming ; et al. | 2022-05-12 |
| Cooling channels in 3DIC stacks Grant 9,859,252 - Ching , et al. January 2, 2 | 2018-01-02 |
| Through silicon via bonding structure Grant 9,673,174 - Wang , et al. June 6, 2 | 2017-06-06 |
| Cooling Channels in 3DIC Stacks App 20160276314 - Ching; Kai-Ming ; et al. | 2016-09-22 |
| Cooling channels in 3DIC stacks Grant 9,355,933 - Ching , et al. May 31, 2 | 2016-05-31 |
| System and method for 3D integrated circuit stacking Grant 9,236,359 - Ching January 12, 2 | 2016-01-12 |
| System and Method for 3D Integrated Circuit Stacking App 20150214166 - Ching; Kai-Ming | 2015-07-30 |
| Through Silicon Via Bonding Structure App 20150137328 - Wang; Dean ; et al. | 2015-05-21 |
| System and method for 3D integrated circuit stacking Grant 9,006,892 - Ching April 14, 2 | 2015-04-14 |
| Through silicon via bonding structure Grant 8,932,906 - Wang , et al. January 13, 2 | 2015-01-13 |
| Through-substrate via for semiconductor device Grant 8,703,609 - Kuo , et al. April 22, 2 | 2014-04-22 |
| Cooling Channels in 3DIC Stacks App 20140103540 - Ching; Kai-Ming ; et al. | 2014-04-17 |
| Optical clock signal distribution using through-silicon vias Grant 8,670,637 - Chang , et al. March 11, 2 | 2014-03-11 |
| Cooling channels in 3DIC stacks Grant 8,624,360 - Ching , et al. January 7, 2 | 2014-01-07 |
| Method to improve bump reliability for flip chip device Grant 8,497,584 - Chen , et al. July 30, 2 | 2013-07-30 |
| Through-silicon vias and methods for forming the same Grant 8,476,769 - Chen , et al. July 2, 2 | 2013-07-02 |
| Structure and process for the formation of TSVs Grant 8,456,008 - Kuo , et al. June 4, 2 | 2013-06-04 |
| Method of forming stacked-die packages Grant 8,426,256 - Hsiao , et al. April 23, 2 | 2013-04-23 |
| System and Method for 3D Integrated Circuit Stacking App 20130062766 - Ching; Kai-Ming | 2013-03-14 |
| System and method for 3D integrated circuit stacking Grant 8,309,396 - Ching November 13, 2 | 2012-11-13 |
| Three-dimensional integrated circuit stacking-joint interface structure Grant 8,097,953 - Tseng , et al. January 17, 2 | 2012-01-17 |
| Structure and Process for the Formation of TSVs App 20120001334 - Kuo; Chen-Cheng ; et al. | 2012-01-05 |
| Optical Clock Signal Distribution Using Through-Silicon Vias App 20110299809 - Chang; Shih-Cheng ; et al. | 2011-12-08 |
| Through-substrate Via For Semiconductor Device App 20110263120 - Kuo; Chen-Cheng ; et al. | 2011-10-27 |
| Structure and process for the formation of TSVs Grant 8,034,708 - Kuo , et al. October 11, 2 | 2011-10-11 |
| Optical clock signal distribution using through-silicon vias Grant 8,005,326 - Chang , et al. August 23, 2 | 2011-08-23 |
| Through-substrate via for semiconductor device Grant 7,973,413 - Kuo , et al. July 5, 2 | 2011-07-05 |
| Fluxless bumping process Grant 7,906,425 - Su , et al. March 15, 2 | 2011-03-15 |
| Semiconductor device and fabrication methods thereof Grant 7,888,236 - Pu , et al. February 15, 2 | 2011-02-15 |
| Structure and Process for the Formation of TSVs App 20110034027 - Kuo; Chen-Cheng ; et al. | 2011-02-10 |
| Structure and process for the formation of TSVs Grant 7,843,064 - Kuo , et al. November 30, 2 | 2010-11-30 |
| Method Of Forming Stacked-die Packages App 20100279463 - Hsiao; C. W. ; et al. | 2010-11-04 |
| Tapered through-silicon via structure Grant 7,816,227 - Chen , et al. October 19, 2 | 2010-10-19 |
| Multi-die wafer level packaging Grant 7,785,927 - Chen , et al. August 31, 2 | 2010-08-31 |
| System and Method for 3D Integrated Circuit Stacking App 20100187684 - Ching; Kai-Ming | 2010-07-29 |
| Cooling Channels in 3DIC Stacks App 20100117201 - Ching; Kai-Ming ; et al. | 2010-05-13 |
| Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure App 20100102453 - Tseng; Ming-Hong ; et al. | 2010-04-29 |
| Through Silicon Via Bonding Structure App 20100047963 - Wang; Dean ; et al. | 2010-02-25 |
| Method of manufacturing a coil inductor Grant 7,666,688 - Ching , et al. February 23, 2 | 2010-02-23 |
| Optical Clock Signal Distribution Using Through-Silicon Vias App 20100008620 - Chang; Shih-Cheng ; et al. | 2010-01-14 |
| Tapered Through-Silicon Via Structure App 20090269905 - Chen; Chen-Shien ; et al. | 2009-10-29 |
| Method of Manufacturing a Coil Inductor App 20090188104 - Ching; Kai-Ming ; et al. | 2009-07-30 |
| Tapered through-silicon via structure Grant 7,564,115 - Chen , et al. July 21, 2 | 2009-07-21 |
| Semiconductor structure with a discontinuous material density for reducing eddy currents Grant 7,557,423 - Ching , et al. July 7, 2 | 2009-07-07 |
| Structure and process for the formation of TSVs App 20090160058 - Kuo; Chen-Cheng ; et al. | 2009-06-25 |
| Multi-Die Wafer Level Packaging App 20090155957 - Chen; Chen-Shien ; et al. | 2009-06-18 |
| Through-Silicon Vias and Methods for Forming the Same App 20090102021 - Chen; Chih-Hua ; et al. | 2009-04-23 |
| Multi-die wafer level packaging Grant 7,514,797 - Chen , et al. April 7, 2 | 2009-04-07 |
| Semiconductor Structure with a Discontinuous Material Density for Reducing Eddy Currents App 20090057823 - Ching; Kai Ming ; et al. | 2009-03-05 |
| Through-substrate Via For Semiconductor Device App 20090051039 - Kuo; Chen-Cheng ; et al. | 2009-02-26 |
| Application of impressed-current cathodic protection to prevent metal corrosion and oxidation Grant 7,468,321 - Ching , et al. December 23, 2 | 2008-12-23 |
| Multi-Die Wafer Level Packaging App 20080296763 - Chen; Chen-Shien ; et al. | 2008-12-04 |
| Semiconductor device and fabrication methods thereof App 20080286938 - Pu; Han-Ping ; et al. | 2008-11-20 |
| Tapered through-silicon via structure App 20080283959 - Chen; Chen-Shien ; et al. | 2008-11-20 |
| Application of impressed-current cathodic protection to prevent metal corrosion and oxidation Grant 7,276,454 - Ching , et al. October 2, 2 | 2007-10-02 |
| Fluxless bumping process App 20070028445 - Su; Chao-Yuan ; et al. | 2007-02-08 |
| Fluxless bumping process Grant 7,134,199 - Su , et al. November 14, 2 | 2006-11-14 |
| Application Of Impressed-current Cathodic Protection To Prevent Metal Corrosion And Oxidation App 20060194407 - Ching; Kai-Ming ; et al. | 2006-08-31 |
| Method of forming a solder ball using a thermally stable resinous protective layer Grant 6,974,659 - Su , et al. December 13, 2 | 2005-12-13 |
| Method to enhance the adhesion between dry film and seed metal Grant 6,926,818 - Lin , et al. August 9, 2 | 2005-08-09 |
| Flush system for dry film photoresist remover Grant 6,918,397 - Lin , et al. July 19, 2 | 2005-07-19 |
| Stencil design for solder paste printing Grant 6,802,250 - Su , et al. October 12, 2 | 2004-10-12 |
| Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication Grant 6,797,075 - Ching , et al. September 28, 2 | 2004-09-28 |
| Novel method to improve bump reliability for flip chip device App 20040180296 - Chen, Yen-Ming ; et al. | 2004-09-16 |
| Method for improving bump reliability for flip chip devices Grant 6,756,294 - Chen , et al. June 29, 2 | 2004-06-29 |
| Method of making a wafer level chip scale package Grant 6,743,660 - Lee , et al. June 1, 2 | 2004-06-01 |
| Application of impressed-current cathodic protection to prevent metal corrosion and oxidation App 20040087175 - Ching, Kai-Ming ; et al. | 2004-05-06 |
| DFR laminating and film removing system Grant 6,715,524 - Chen , et al. April 6, 2 | 2004-04-06 |
| Method of making a bump on a substrate without ribbon residue Grant 6,696,356 - Tseng , et al. February 24, 2 | 2004-02-24 |
| Fluxless bumping process using ions App 20040000580 - Lee, Hsin-Hui ; et al. | 2004-01-01 |
| Fluxless bumping process App 20030229986 - Su, Chao-Yuan ; et al. | 2003-12-18 |
| DFR laminating and film removing system App 20030226638 - Chen, Li-Chih ; et al. | 2003-12-11 |
| Stencil design for solder paste printing App 20030213384 - Su, Chao-Yuan ; et al. | 2003-11-20 |
| Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication App 20030209260 - Ching, Kai-Ming ; et al. | 2003-11-13 |
| Selective electroplating method employing annular edge ring cathode electrode contact Grant 6,638,688 - Ching , et al. October 28, 2 | 2003-10-28 |
| Flush system for dry film photoresist remover App 20030196684 - Lin, Ta-Min ; et al. | 2003-10-23 |
| Method of measuring photoresist and bump misalignment Grant 6,636,313 - Chen , et al. October 21, 2 | 2003-10-21 |
| Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist Grant 6,623,912 - Ching , et al. September 23, 2 | 2003-09-23 |
| Method to improve reliability for flip-chip device for limiting pad design Grant 6,602,775 - Chen , et al. August 5, 2 | 2003-08-05 |
| Method of measuring photoresist and bump misalignment App 20030133115 - Chen, Yen-Ming ; et al. | 2003-07-17 |
| Method of forming a solder ball using a thermally stable resinous protective layer App 20030134233 - Su, Chao-Yuan ; et al. | 2003-07-17 |
| Method of making a wafer level chip scale package App 20030134496 - Lee, Hsin-Hui ; et al. | 2003-07-17 |
| Method of making a bump on a substrate without ribbon residue App 20030124832 - Tseng, Li-Hsin ; et al. | 2003-07-03 |
| Selective electroplating method employing annular edge ring cathode electrode contact App 20020064729 - Ching, Kai-Ming ; et al. | 2002-05-30 |
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