Ching; Chen Yung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ching; Chen Yung.The latest application filed is for "package on package devices and methods of packaging semiconductor dies".
- Ching; Chen Yung - Dali TW
- Ching; Chen Yung - Dali City TW
| Patent | Date |
|---|---|
| Package on package devices and methods of packaging semiconductor dies Grant 9,105,552 - Yu , et al. August 11, 2 | 2015-08-11 |
| Package on Package Devices and Methods of Packaging Semiconductor Dies App 20130105979 - Yu; Chen-Hua ; et al. | 2013-05-02 |
| Multi-project wafer and method of making same Grant 8,409,881 - Cheng , et al. April 2, 2 | 2013-04-02 |
| Multi-project Wafer And Method Of Making Same App 20110049516 - CHENG; William ; et al. | 2011-03-03 |
| Multi-project wafer and method of making same Grant 7,851,272 - Cheng , et al. December 14, 2 | 2010-12-14 |
| Multi-project Wafer And Method Of Making Same App 20080296571 - Cheng; William ; et al. | 2008-12-04 |
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