Chin; Woo-seok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chin; Woo-seok.The latest application filed is for "flexible device and operating methods thereof".

Company Profile

3.6.11

Chin; Woo-seok - Hwaseong-si KR
Chin; Woo-Seok - Daejeon KR
CHIN; Woo-Seok - Suwon-si KR
Chin, Woo Seok - Taejon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible device and operating methods thereof Grant 10,985,310 - Park , et al. April 20, 2	2021-04-20
Flexible Device And Operating Methods Thereof App 20190165249 - PARK; Jin ; et al.	2019-05-30
Flexible device and operating methods thereof Grant 10,230,039 - Park , et al.	2019-03-12
Flexible Device And Operating Methods Thereof App 20180040803 - PARK; Jin ; et al.	2018-02-08
Flexible device and operating methods thereof Grant 9,818,928 - Park , et al. November 14, 2	2017-11-14
System and method for protecting private information by using NFC tags Grant 9,247,423 - Chin , et al. January 26, 2	2016-01-26
System And Method For Protecting Private Information By Using Nfc Tags App 20140120877 - CHIN; Woo-seok ; et al.	2014-05-01
Flexible Device And Operating Methods Thereof App 20140055394 - PARK; Jin ; et al.	2014-02-27
Nondestructive reliability monitoring method for adhesively bonded structures whose sensitivity is improved by using piezoelectric or conductive materials Grant 7,589,457 - Lee , et al. September 15, 2	2009-09-15
Sliding Apparatus Of Sliding Type Portable Terminal App 20080280659 - OH; Seung-Taek ; et al.	2008-11-13
Manufacturing method of keypad for mobile phone and keypad manufactured thereby Grant 7,414,213 - Hwang , et al. August 19, 2	2008-08-19
Temperature Control System For Mold And Injection Molding Method Using The Same App 20080111280 - CHOE; Ick-Sung ; et al.	2008-05-15
Manufacturing Method Of Keypad For Mobile Phone And Keypad Manufactured Thereby App 20080035460 - HWANG; Yong-Wook ; et al.	2008-02-14
Nondestructive Reliability Monitoring Method For Adhesively Bonded Structures Whose Sensitivity Is Improved By Using Piezoelectric Or Conductive Materials App 20070214623 - LEE; DAI-GIL ; et al.	2007-09-20
Robot arm with impact absorption structure App 20050103147 - Lee, Dai Gil ; et al.	2005-05-19
Reinforcing element of underground pipe, and trenchless repairing and reinforcing method using the same App 20040173272 - Yoo, Ae Kwon ; et al.	2004-09-09
Method of repairing or reinforcing worn-out underground burried drainpipes by resin transfer molding process using both flexible tubes and bagging films App 20020009334 - Lee, Dai Gil ; et al.	2002-01-24

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.