Chin; Ting Soon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chin; Ting Soon.The latest application filed is for "power semiconductor package and method for fabricating a power semiconductor package".
- Chin; Ting Soon - Malacca MY
| Patent | Date |
|---|---|
| Power semiconductor package and method for fabricating a power semiconductor package Grant 11,211,356 - Lim , et al. December 28, 2 | 2021-12-28 |
| Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package App 20210057375 - Lim; Wee Aun Jason ; et al. | 2021-02-25 |
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