Chin; Lai Nguk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chin; Lai Nguk.The latest application filed is for "tape chip on lead using paste die attach material".

Company Profile

0.8.6

Chin; Lai Nguk - Penang MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tape chip on lead using paste die attach material Grant 9,679,831 - Chin , et al. June 13, 2	2017-06-13
Tape Chip On Lead Using Paste Die Attach Material App 20170047272 - CHIN; Lai Nguk ; et al.	2017-02-16
Method of chip positioning for multi-chip packaging Grant 9,196,608 - Foong , et al. November 24, 2	2015-11-24
Chip Positioning In Multi-chip Package App 20150056726 - FOONG; Sally ; et al.	2015-02-26
Chip positioning in multi-chip package Grant 8,901,756 - Foong , et al. December 2, 2	2014-12-02
Chip Positioning in Multi-Chip Package App 20140175613 - FOONG; Sally ; et al.	2014-06-26
Method and system for thin multi chip stack package with film on wire and copper wire Grant 8,680,686 - Chin , et al. March 25, 2	2014-03-25
Stitch bump stacking design for overall package size reduction for multiple stack Grant 8,357,563 - Chin , et al. January 22, 2	2013-01-22
Stitch Bump Stacking Design For Overall Package Size Reduction For Multiple Stack App 20120038059 - CHIN; Lai Nguk ; et al.	2012-02-16
Method And System For Thin Multi Chip Stack Package With Film On Wire And Copper Wire App 20110316158 - CHIN; Lai Nguk ; et al.	2011-12-29
Reduction of package height in a stacked die configuration Grant 7,932,131 - Foong , et al. April 26, 2	2011-04-26
Reduction of package height in a stacked die configuration App 20090115033 - Foong; Sally ; et al.	2009-05-07

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