CHIN; Ian En Yoon
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHIN; Ian En Yoon.The latest application filed is for "control of warpage using abf gc cavity for embedded die package".
- CHIN; Ian En Yoon - Batu Ferringhi MY
- Chin; Ian En Yoon - Georgetown MY
- Chin; Ian En Yoon - Betu Ferringhi MY
- CHIN; Ian En Yoon - Tanjung Bunga MY
| Patent | Date |
|---|---|
| Control Of Warpage Using Abf Gc Cavity For Embedded Die Package App 20220230972 - RAORANE; Digvijay A. ; et al. | 2022-07-21 |
| Control of warpage using ABF GC cavity for embedded die package Grant 11,322,457 - Raorane , et al. May 3, 2 | 2022-05-03 |
| Control Of Warpage Using Abf Gc Cavity For Embedded Die Package App 20200251426 - Kind Code | 2020-08-06 |
| Control of warpage using ABF GC cavity for embedded die package Grant 10,658,307 - Rorane , et al. | 2020-05-19 |
| Control Of Warpage Using Abf Gc Cavity For Embedded Die Package App 20180301423 - RORANE; Digvijay A. ; et al. | 2018-10-18 |
| Control of warpage using ABF GC cavity for embedded die package Grant 9,941,219 - Rorane , et al. April 10, 2 | 2018-04-10 |
| Control Of Warpage Using Abf Gc Cavity For Embedded Die Package App 20160086894 - RORANE; DIGVIJAY A. ; et al. | 2016-03-24 |
| Conductor Reinforcement For Circuit Boards App 20090016036 - WONG; Shaw Fong ; et al. | 2009-01-15 |
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