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Chin; Hock Chun Patent Filings

Chin; Hock Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chin; Hock Chun.The latest application filed is for "three-dimensional memory device".

Company Profile
0.2.3
  • Chin; Hock Chun - Singapore SG
  • Chin; Hock-Chun - Hwaseong-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Three-dimensional Memory Device
App 20220077179 - Chin; Hock Chun
2022-03-10
Non-volatile memory device
Grant 9,966,465 - Chin , et al. May 8, 2
2018-05-08
Non-volatile memory device and manufacturing method thereof
Grant 9,911,847 - Chin , et al. March 6, 2
2018-03-06
Semiconductor Device And Method For Manufacturing The Same
App 20170033107 - HONG; Byoung Hak ;   et al.
2017-02-02
Method For Fabricating Semiconductor Device Improving The Process Speed
App 20160056268 - CHIN; Hock-Chun ;   et al.
2016-02-25

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