Chin; Barry L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chin; Barry L..The latest application filed is for "method for depositing a diffusion barrier layer and a metal conductive layer".

Company Profile

0.45.32

Chin; Barry L. - Saratoga CA
Chin; Barry L. - San Jose CA
Chin; Barry L. - Sunnyvale CA
Chin; Barry L. - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for depositing a diffusion barrier layer and a metal conductive layer Grant 9,991,157 - Chiang , et al. June 5, 2	2018-06-05
Method For Depositing A Diffusion Barrier Layer And A Metal Conductive Layer App 20160322255 - CHIANG; Tony ; et al.	2016-11-03
Method for depositing a diffusion barrier layer and a metal conductive layer Grant 9,390,970 - Chiang , et al. July 12, 2	2016-07-12
Atomic layer deposition apparatus Grant 9,031,685 - Chin , et al. May 12, 2	2015-05-12
Conformal Sacrificial Film By Low Temperature Chemical Vapor Deposition Technique App 20140162194 - XU; Jingjing ; et al.	2014-06-12
Atomic Layer Deposition Apparatus App 20140130739 - CHIN; Barry L. ; et al.	2014-05-15
Atomic layer deposition apparatus Grant 8,626,330 - Chin , et al. January 7, 2	2014-01-07
Chemical planarization of copper wafer polishing Grant 8,586,481 - Wang , et al. November 19, 2	2013-11-19
Enhanced copper growth with ultrathin barrier layer for high performance interconnects Grant 8,318,266 - Chen , et al. November 27, 2	2012-11-27
Enhanced copper growth with ultrathin barrier layer for high performance interconnects Grant 8,293,328 - Chen , et al. October 23, 2	2012-10-23
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features Grant 8,158,511 - Chiang , et al. April 17, 2	2012-04-17
Atomic Layer Deposition Apparatus App 20120006265 - CHIN; BARRY L. ; et al.	2012-01-12
Chemical Planarization Of Copper Wafer Polishing App 20110294293 - Wang; You ; et al.	2011-12-01
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features App 20110256716 - Chiang; Tony ; et al.	2011-10-20
Atomic layer deposition apparatus Grant 8,027,746 - Chin , et al. September 27, 2	2011-09-27
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features Grant 7,989,343 - Chiang , et al. August 2, 2	2011-08-02
Atomic Layer Deposition Apparatus App 20110111603 - CHIN; BARRY L. ; et al.	2011-05-12
Cyclical deposition of refractory metal silicon nitride Grant 7,892,602 - Chung , et al. February 22, 2	2011-02-22
Atomic layer deposition apparatus Grant 7,860,597 - Chin , et al. December 28, 2	2010-12-28
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features App 20100255678 - Chiang; Tony ; et al.	2010-10-07
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate Grant 7,795,138 - Chiang , et al. September 14, 2	2010-09-14
Atomic Layer Deposition Apparatus App 20100099270 - Chin; Barry L. ; et al.	2010-04-22
Metal / metal nitride barrier layer for semiconductor device applications Grant 7,687,909 - Ding , et al. March 30, 2	2010-03-30
Atomic layer deposition apparatus Grant 7,660,644 - Chin , et al. February 9, 2	2010-02-09
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate App 20090269922 - Chiang; Tony ; et al.	2009-10-29
Method of depositing a sculptured copper seed layer Grant 7,589,016 - Chiang , et al. September 15, 2	2009-09-15
Method of depositing a diffusion barrier layer which provides an improved interconnect App 20090053888 - Ding; Peijun ; et al.	2009-02-26
Method of depositing a sculptured copper seed layer App 20080166869 - Chiang; Tony ; et al.	2008-07-10
Method of depositing a metal seed layer on semiconductor substrates Grant 7,381,639 - Chiang , et al. June 3, 2	2008-06-03
Metal / metal nitride barrier layer for semiconductor device applications App 20070241458 - Ding; Peijun ; et al.	2007-10-18
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system Grant 7,253,109 - Ding , et al. August 7, 2	2007-08-07
Damage-free sculptured coating deposition App 20070178682 - Chiang; Tony ; et al.	2007-08-02
Enhanced Copper Growth With Ultrathin Barrier Layer For High Performance Interconnects App 20070026147 - CHEN; LING ; et al.	2007-02-01
Method of depositing a metal seed layer on semiconductor substrates App 20070020922 - Chiang; Tony ; et al.	2007-01-25
Enhanced Copper Growth With Ultrathin Barrier Layer For High Performance Interconnects App 20070003698 - CHEN; LING ; et al.	2007-01-04
Atomic Layer Deposition Apparatus App 20060223286 - Chin; Barry L. ; et al.	2006-10-05
Cyclical Deposition Of Refractory Metal Silicon Nitride App 20060216928 - CHUNG; HUA ; et al.	2006-09-28
Atomic layer deposition apparatus Grant 7,085,616 - Chin , et al. August 1, 2	2006-08-01
Cyclical deposition of refractory metal silicon nitride Grant 7,081,271 - Chung , et al. July 25, 2	2006-07-25
Method of depositing a metal seed layer on semiconductor substrates Grant 7,074,714 - Chiang , et al. July 11, 2	2006-07-11
End point detection for sputtering and resputtering Grant 7,048,837 - Somekh , et al. May 23, 2	2006-05-23
Method of depositing low resistivity barrier layers for copper interconnects App 20050272254 - Ding, Peijun ; et al.	2005-12-08
Method of depositing a tantalum nitride / tantalum diffusion barrier layer system App 20050208767 - Ding, Peijun ; et al.	2005-09-22
End point detection for sputtering and resputtering App 20050173239 - Somekh, Sasson R. ; et al.	2005-08-11
Method of preventing diffusion of copper through a tantalum-comprising barrier layer Grant 6,919,275 - Chiang , et al. July 19, 2	2005-07-19
Tailored barrier layer which provides improved copper interconnect electromigration resistance Grant 6,887,353 - Ding , et al. May 3, 2	2005-05-03
Method of depositing a metal seed layer on semiconductor substrates App 20050085068 - Chiang, Tony ; et al.	2005-04-21
Two step method for filling holes with copper App 20050032369 - Ding, Peijun ; et al.	2005-02-10
Method of depositing a diffusion barrier layer and a metal conductive layer App 20050020080 - Chiang, Tony ; et al.	2005-01-27
Sputtering method for filling holes with copper Grant 6,793,779 - Ding , et al. September 21, 2	2004-09-21
Method of preventing diffusion of copper through a tantalum-comprising barrier layer App 20040171250 - Chiang, Tony ; et al.	2004-09-02
Damage-free sculptured coating deposition Grant 6,758,947 - Chiang , et al. July 6, 2	2004-07-06
Post metal barrier/adhesion film Grant 6,753,248 - Wood , et al. June 22, 2	2004-06-22
Sputtering method for filling holes with copper App 20030157799 - Ding, Peijun ; et al.	2003-08-21
Method of sputtering copper to fill trenches and vias Grant 6,605,197 - Ding , et al. August 12, 2	2003-08-12
Cyclical deposition of refractory metal silicon nitride App 20030108674 - Chung, Hua ; et al.	2003-06-12
Enhanced copper growth with ultrathin barrier layer for high performance interconnects App 20030082301 - Chen, Ling ; et al.	2003-05-01
Atomic layer deposition apparatus App 20030023338 - Chin, Barry L. ; et al.	2003-01-30
Stress tunable tantalum and tantalum nitride films App 20020070375 - Chiang, Tony ; et al.	2002-06-13
Damage-free sculptured coating deposition App 20020029958 - Chiang, Tony ; et al.	2002-03-14
Structure for improving low temperature copper reflow in semiconductor features Grant 6,352,926 - Ding , et al. March 5, 2	2002-03-05
Structure and method for improving low temperature copper reflow in semiconductor features Grant 6,184,137 - Ding , et al. February 6, 2	2001-02-06
Sputtering methods for depositing stress tunable tantalum and tantalum nitride films Grant 6,139,699 - Chiang , et al. October 31, 2	2000-10-31
Gas-based substrate deposition protection Grant 5,925,411 - van de Ven , et al. July 20, 1	1999-07-20
Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatus Grant 5,882,417 - van de Ven , et al. March 16, 1	1999-03-16
Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus Grant 5,843,233 - van de Ven , et al. December 1, 1	1998-12-01
Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus Grant 5,769,951 - van de Ven , et al. June 23, 1	1998-06-23
Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate Grant 5,620,525 - van de Ven , et al. April 15, 1	1997-04-15
Wafer surface protection in a gas deposition process Grant 5,578,532 - van de Ven , et al. November 26, 1	1996-11-26
Gas-based backside protection during substrate processing Grant 5,374,594 - van de Ven , et al. December 20, 1	1994-12-20
Gas-based substrate protection during processing Grant 5,238,499 - van de Ven , et al. August 24, 1	1993-08-24
Gas-based backside protection during substrate processing Grant 5,230,741 - van de Ven , et al. * July 27, 1	1993-07-27
Ion implantation of thin film CrSi.sub.2 and SiC resistors Grant 4,759,836 - Hill , et al. July 26, 1	1988-07-26
Method of making low resistance polysilicon gate transistors and low resistance interconnections therefor via gas deposited in-situ doped amorphous layer and heat-treatment Grant 4,479,831 - Sandow , et al. October 30, 1	1984-10-30

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