Chin; Barry

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chin; Barry.The latest application filed is for "graphene deposition".

Company Profile

0.20.19

Chin; Barry - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Graphene Deposition App 20110303899 - Padhi; Deenesh ; et al.	2011-12-15
Integration Process Of Tungsten Atomic Layer Deposition For Metallization Application App 20070099415 - Chen; Ling ; et al.	2007-05-03
Method and apparatus for forming improved metal interconnects Grant 6,992,012 - Hashim , et al. January 31, 2	2006-01-31
Integrated deposition process for copper metallization Grant 6,881,673 - Ding , et al. April 19, 2	2005-04-19
Barrier layer for electroplating processes App 20050031784 - Ding, Peijun ; et al.	2005-02-10
Barrier layer for electroplating processes Grant 6,790,776 - Ding , et al. September 14, 2	2004-09-14
Method and apparatus for forming improved metal interconnects App 20040152301 - Hashim, Imran ; et al.	2004-08-05
Method and apparatus for forming improved metal interconnects Grant 6,709,987 - Hashim , et al. March 23, 2	2004-03-23
Integrated deposition process for copper metallization App 20030194863 - Ding, Peijun ; et al.	2003-10-16
Nitrogen analogs of copper II .beta.-diketonates as source reagents for semiconductor processing Grant 6,620,956 - Chen , et al. September 16, 2	2003-09-16
Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application App 20030124262 - Chen, Ling ; et al.	2003-07-03
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Nitrogen analogs of copper II beta-diketonates as source reagents for semiconductor processing App 20030097013 - Chen, Ling ; et al.	2003-05-22
Integrated deposition process for copper metallization Grant 6,566,259 - Ding , et al. May 20, 2	2003-05-20
Method and apparatus for forming improved metal interconnects Grant 6,559,061 - Hashim , et al. May 6, 2	2003-05-06
Pressure modulation method to obtain improved step coverage of seed layer App 20030066747 - Sundarrajan, Arvind ; et al.	2003-04-10
Method for achieving copper fill of high aspect ratio interconnect features App 20030000844 - Carl, Daniel A. ; et al.	2003-01-02
Integrated barrier layer structure for copper contact level metallization App 20020192948 - Chen, Fusen ; et al.	2002-12-19
Methods Of Producing Ultra -low Resistivity Tantalum Films. App 20020162738 - Chiang, Tony ; et al.	2002-11-07
Integrated barrier layer structure for copper contact level metallization App 20020132473 - Chiang, Tony ; et al.	2002-09-19
Method and apparatus for forming improved metal interconnects App 20020115287 - Hashim, Imran ; et al.	2002-08-22
Method for achieving copper fill of high aspect ratio interconnect features Grant 6,436,267 - Carl , et al. August 20, 2	2002-08-20
Barrier layer for electroplating processes App 20020092772 - Ding, Peijun ; et al.	2002-07-18
Processes to improve electroplating fill Grant 6,399,479 - Chen , et al. June 4, 2	2002-06-04
Copper alloy seed layer for copper metallization Grant 6,387,805 - Ding , et al. May 14, 2	2002-05-14
Method and apparatus for forming improved metal interconnects App 20020028576 - Hashim, Imran ; et al.	2002-03-07
Method And Apparatus For Physical Vapor Deposition Using Modulated Power App 20010050220 - CHIANG, TONY ; et al.	2001-12-13
Barrier layer for electroplating processes Grant 6,328,871 - Ding , et al. December 11, 2	2001-12-11
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications Grant 6,313,033 - Chiang , et al. November 6, 2	2001-11-06
Copper Alloy Seed Layer For Copper Metallization App 20010034126 - DING, PEIJUN ; et al.	2001-10-25
Method and apparatus for forming improved metal interconnects Grant 6,287,977 - Hashim , et al. September 11, 2	2001-09-11
Ultra-low resistivity tantalum films and methods for their deposition App 20010018137 - Chiang, Tony ; et al.	2001-08-30
Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance Grant 6,235,163 - Angelo , et al. May 22, 2	2001-05-22
IMP technology with heavy gas sputtering Grant 6,200,433 - Ding , et al. March 13, 2	2001-03-13
Integrated deposition process for copper metallization Grant 6,174,811 - Ding , et al. January 16, 2	2001-01-16
Copper alloy via structure Grant 6,160,315 - Chiang , et al. December 12, 2	2000-12-12
High pressure copper fill at low temperature Grant 6,140,235 - Yao , et al. October 31, 2	2000-10-31
Copper alloy seed layer for copper metallization in an integrated circuit Grant 6,066,892 - Ding , et al. May 23, 2	2000-05-23
Sputter deposition and annealing of copper alloy metallization Grant 6,037,257 - Chiang , et al. March 14, 2	2000-03-14

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