Chillara; Satya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chillara; Satya.The latest application filed is for "high density integrated circuit package assembly with a heatsink between stacked dies".
- Chillara; Satya - San Jose CA
| Patent | Date |
|---|---|
| High density integrated circuit package assembly with a heatsink between stacked dies Grant 5,739,581 - Chillara , et al. April 14, 1 | 1998-04-14 |
| Thermal ball lead integrated package Grant 5,705,851 - Mostafazadeh , et al. January 6, 1 | 1998-01-06 |
| Semiconductor component package assembly including an integral RF/EMI shield Grant 5,650,659 - Mostafazadeh , et al. July 22, 1 | 1997-07-22 |
| Tape ball lead integrated circuit package Grant 5,648,679 - Chillara , et al. July 15, 1 | 1997-07-15 |
| Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer Grant 5,627,405 - Chillara May 6, 1 | 1997-05-06 |
| Lead frame having layered conductive planes Grant 5,498,901 - Chillara , et al. March 12, 1 | 1996-03-12 |
| High density integrated circuit assembly combining leadframe leads with conductive traces Grant 5,442,230 - Chillara , et al. August 15, 1 | 1995-08-15 |
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