Chikawa; Yasunori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chikawa; Yasunori.The latest application filed is for "semiconductor device and display apparatus".

Company Profile

0.16.11

Chikawa; Yasunori - Osaka JP
Chikawa; Yasunori - Hiroshima JP
Chikawa; Yasunori - Kitakatsuragi-gun JP
Chikawa; Yasunori - Nara JP
Chikawa; Yasunori - Kita-Katsuragi JP
Chikawa; Yasunori - Kitakatsuragi JP
Chikawa; Yasunori - Wakayama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and display apparatus Grant 8,576,567 - Katoh , et al. November 5, 2	2013-11-05
Semiconductor device and display apparatus Grant 8,344,486 - Nakagawa , et al. January 1, 2	2013-01-01
Semiconductor Device And Display Apparatus App 20110108979 - Nakagawa; Tomokatsu ; et al.	2011-05-12
Semiconductor Device And Display Apparatus App 20100290192 - Katoh; Tatsuya ; et al.	2010-11-18
IC chip package, and image display apparatus using same App 20070290302 - Nakagawa; Tomokatsu ; et al.	2007-12-20
LCD connected to additional LCD through multiple flexible printed circuit boards Grant 7,233,382 - Yamaji , et al. June 19, 2	2007-06-19
Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads Grant 7,005,741 - Ono , et al. February 28, 2	2006-02-28
Semiconductor device with bumps on electrode pads oriented in given direction Grant 6,933,607 - Ono , et al. August 23, 2	2005-08-23
Tape carrier semiconductor device Grant 6,911,729 - Chikawa June 28, 2	2005-06-28
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film Grant 6,864,562 - Toyosawa , et al. March 8, 2	2005-03-08
Semiconductor device Grant 6,836,002 - Chikawa , et al. December 28, 2	2004-12-28
Liquid crystal module App 20040189926 - Yamaji, Yasuhisa ; et al.	2004-09-30
Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film Grant 6,650,002 - Toyosawa , et al. November 18, 2	2003-11-18
Connection structure for display module and printed substrate, semiconductor device, display module, and electronic component Grant 6,606,249 - Chikawa , et al. August 12, 2	2003-08-12
Semiconductor device and manufacturing method and testing method of the same App 20030067072 - Ono, Atsushi ; et al.	2003-04-10
Semiconductor device and manufacturing method and testing method of the same App 20030062623 - Ono, Atsushi ; et al.	2003-04-03
Semiconductor Device App 20020056901 - ONO, ATSUSHI ; et al.	2002-05-16
Connection structure for display module and printed substrate, semiconductor device, display module, and elecronic component App 20020024802 - Chikawa, Yasunori ; et al.	2002-02-28
A Semiconductor Device Having Active Element Connected To An Electrode Metal Pad Via A Barrier Metal Layer And Interlayer Insulating Film App 20020000659 - TOYOSAWA, KENJI ; et al.	2002-01-03
Tape carrier package and display device using the same App 20010040664 - Tajima, Naoyuki ; et al.	2001-11-15
Semiconductor device App 20010020735 - Chikawa, Yasunori ; et al.	2001-09-13
Liquid crystal panel module and tape carrier package for liquid crystal driver IC Grant 5,402,255 - Nakanishi , et al. March 28, 1	1995-03-28
Method of making tape carrier semiconductor device Grant 5,336,650 - Chikawa , et al. August 9, 1	1994-08-09
Method of manufacturing a bump electrode Grant 5,310,699 - Chikawa , et al. May 10, 1	1994-05-10
Tape carrier for semiconductor chips Grant 4,949,155 - Tajima , et al. August 14, 1	1990-08-14
Ceramic plate for supporting a semiconductor wafer Grant 4,247,590 - Hayakawa , et al. January 27, 1	1981-01-27

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