loadpatents
Patent applications and USPTO patent grants for CHIEN; Wei-Ming.The latest application filed is for "semiconductor device structure and semiconductor package assembly".
Patent | Date |
---|---|
Semiconductor Device Structure And Semiconductor Package Assembly App 20220216131 - LEE; Po-Han ;   et al. | 2022-07-07 |
Chip package and manufacturing method thereof Grant 11,355,659 - Lee , et al. June 7, 2 | 2022-06-07 |
Chip package and power module Grant 11,310,904 - Liu , et al. April 19, 2 | 2022-04-19 |
Chip Package And Manufacturing Method Thereof App 20210159350 - LEE; Po-Han ;   et al. | 2021-05-27 |
Chip Package And Power Module App 20200137879 - LIU; Tsang-Yu ;   et al. | 2020-04-30 |
Semiconductor structure and manufacturing method thereof Grant 10,096,635 - Chien , et al. October 9, 2 | 2018-10-09 |
Methods for treating and preventing cardiomyopathy with a fusion protein of tafazzin and a cellular permeability peptide Grant 10,086,040 - Chin , et al. October 2, 2 | 2018-10-02 |
Methods For Treating And Preventing Cardiomyopathy App 20170360886 - CHIN; Michael T. ;   et al. | 2017-12-21 |
Semiconductor structure and manufacturing method thereof Grant 9,780,251 - Suen , et al. October 3, 2 | 2017-10-03 |
Semiconductor Structure And Manufacturing Method Thereof App 20170179330 - SUEN; Wei-Luen ;   et al. | 2017-06-22 |
Electrical contact structure with a redistribution layer connected to a stud Grant 9,640,683 - Suen , et al. May 2, 2 | 2017-05-02 |
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20170098678 - LAI; Chaung-Lin ;   et al. | 2017-04-06 |
Chip package and method for forming the same Grant 9,613,919 - Liu , et al. April 4, 2 | 2017-04-04 |
Modified tafazzin proteins and methods of making and using the same Grant 9,550,981 - Chin , et al. January 24, 2 | 2017-01-24 |
Manufacturing method of semiconductor structure Grant 9,450,015 - Chien , et al. September 20, 2 | 2016-09-20 |
Manufacturing Method Of Semiconductor Structure App 20160218140 - CHIEN; Wei-Ming ;   et al. | 2016-07-28 |
Chip Package And Method For Forming The Same App 20160181212 - LIU; Tsang-Yu ;   et al. | 2016-06-23 |
Semiconductor structure with sensor chip and landing pads Grant 9,331,256 - Chien , et al. May 3, 2 | 2016-05-03 |
Semiconductor Structure And Manufacturing Method Thereof App 20160043123 - CHIEN; Wei-Ming ;   et al. | 2016-02-11 |
Electrical contact structure with a redistribution layer connected to a stud Grant 9,214,579 - Chien , et al. December 15, 2 | 2015-12-15 |
Modified Tafazzin Proteins And Methods Of Making And Using The Same App 20150203827 - Chin; Michael T. ;   et al. | 2015-07-23 |
Semiconductor Structure And Manufacturing Method Thereof App 20150179831 - SUEN; Wei-Luen ;   et al. | 2015-06-25 |
Semiconductor Structure And Manufacturing Method Thereof App 20150123231 - CHIEN; Wei-Ming ;   et al. | 2015-05-07 |
Semiconductor Structure And Manufacturing Method Thereof App 20150054002 - CHIEN; Wei-Ming ;   et al. | 2015-02-26 |
Interface Card Apparatus App 20140342609 - Sung; Yung-Chi ;   et al. | 2014-11-20 |
Interface card apparatus Grant 8,886,864 - Sung , et al. November 11, 2 | 2014-11-11 |
Connection Interface and Cable App 20130178112 - Su; Shu-Te ;   et al. | 2013-07-11 |
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