loadpatents
name:-0.016624927520752
name:-0.014081954956055
name:-0.0022449493408203
CHIEN; Wei-Ming Patent Filings

CHIEN; Wei-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHIEN; Wei-Ming.The latest application filed is for "semiconductor device structure and semiconductor package assembly".

Company Profile
2.12.16
  • CHIEN; Wei-Ming - Taoyuan City TW
  • Chien; Wei-Ming - Taoyuan TW
  • Chien; Wei-Ming - Seattle WA
  • Chien; Wei-Ming - Yangmei TW
  • CHIEN; Wei-Ming - Yangmei City TW
  • Chien; Wei-Ming - New Taipei City TW
  • Chien; Wei-Ming - New Taipei TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device Structure And Semiconductor Package Assembly
App 20220216131 - LEE; Po-Han ;   et al.
2022-07-07
Chip package and manufacturing method thereof
Grant 11,355,659 - Lee , et al. June 7, 2
2022-06-07
Chip package and power module
Grant 11,310,904 - Liu , et al. April 19, 2
2022-04-19
Chip Package And Manufacturing Method Thereof
App 20210159350 - LEE; Po-Han ;   et al.
2021-05-27
Chip Package And Power Module
App 20200137879 - LIU; Tsang-Yu ;   et al.
2020-04-30
Semiconductor structure and manufacturing method thereof
Grant 10,096,635 - Chien , et al. October 9, 2
2018-10-09
Methods for treating and preventing cardiomyopathy with a fusion protein of tafazzin and a cellular permeability peptide
Grant 10,086,040 - Chin , et al. October 2, 2
2018-10-02
Methods For Treating And Preventing Cardiomyopathy
App 20170360886 - CHIN; Michael T. ;   et al.
2017-12-21
Semiconductor structure and manufacturing method thereof
Grant 9,780,251 - Suen , et al. October 3, 2
2017-10-03
Semiconductor Structure And Manufacturing Method Thereof
App 20170179330 - SUEN; Wei-Luen ;   et al.
2017-06-22
Electrical contact structure with a redistribution layer connected to a stud
Grant 9,640,683 - Suen , et al. May 2, 2
2017-05-02
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof
App 20170098678 - LAI; Chaung-Lin ;   et al.
2017-04-06
Chip package and method for forming the same
Grant 9,613,919 - Liu , et al. April 4, 2
2017-04-04
Modified tafazzin proteins and methods of making and using the same
Grant 9,550,981 - Chin , et al. January 24, 2
2017-01-24
Manufacturing method of semiconductor structure
Grant 9,450,015 - Chien , et al. September 20, 2
2016-09-20
Manufacturing Method Of Semiconductor Structure
App 20160218140 - CHIEN; Wei-Ming ;   et al.
2016-07-28
Chip Package And Method For Forming The Same
App 20160181212 - LIU; Tsang-Yu ;   et al.
2016-06-23
Semiconductor structure with sensor chip and landing pads
Grant 9,331,256 - Chien , et al. May 3, 2
2016-05-03
Semiconductor Structure And Manufacturing Method Thereof
App 20160043123 - CHIEN; Wei-Ming ;   et al.
2016-02-11
Electrical contact structure with a redistribution layer connected to a stud
Grant 9,214,579 - Chien , et al. December 15, 2
2015-12-15
Modified Tafazzin Proteins And Methods Of Making And Using The Same
App 20150203827 - Chin; Michael T. ;   et al.
2015-07-23
Semiconductor Structure And Manufacturing Method Thereof
App 20150179831 - SUEN; Wei-Luen ;   et al.
2015-06-25
Semiconductor Structure And Manufacturing Method Thereof
App 20150123231 - CHIEN; Wei-Ming ;   et al.
2015-05-07
Semiconductor Structure And Manufacturing Method Thereof
App 20150054002 - CHIEN; Wei-Ming ;   et al.
2015-02-26
Interface Card Apparatus
App 20140342609 - Sung; Yung-Chi ;   et al.
2014-11-20
Interface card apparatus
Grant 8,886,864 - Sung , et al. November 11, 2
2014-11-11
Connection Interface and Cable
App 20130178112 - Su; Shu-Te ;   et al.
2013-07-11

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