Chien; Hung-Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chien; Hung-Ju.The latest application filed is for "semiconductor devices having post passivation interconnections with a second connection pattern".

Company Profile

0.5.3

Chien; Hung-Ju - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor devices having post passivation interconnections and a buffer layer Grant 7,528,478 - Cheng , et al. May 5, 2	2009-05-05
Semiconductor devices having post passivation interconnections with a second connection pattern App 20060145332 - Cheng; Hsi-Kuei ; et al.	2006-07-06
Method for reducing defects in post passivation interconnect process Grant 7,026,233 - Cheng , et al. April 11, 2	2006-04-11
Method for reducing defects in post passivation interconnect process App 20050032353 - Cheng, Hsi-Kuei ; et al.	2005-02-10
Method of unloading substrates in chemical-mechanical polishing apparatus Grant 6,558,228 - Cheng , et al. May 6, 2	2003-05-06
Low temperature process for forming intermetal gap-filling insulating layers in silicon wafer integrated circuitry App 20010030351 - Wang, Ying-Lang ; et al.	2001-10-18
Low temperature process for forming inter-metal gap-filling insulating layers in silicon wafer integrated circuitry Grant 6,268,274 - Wang , et al. July 31, 2	2001-07-31
Method of improving metal stack reliability Grant 6,211,075 - Liu , et al. April 3, 2	2001-04-03

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