CHIEN; Feng-Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHIEN; Feng-Lung.The latest application filed is for "coil module".
- CHIEN; Feng-Lung - Taoyuan City TW
- Chien; Feng-Lung - Taoyuan TW
- CHIEN; Feng-Lung - Yangmei Taoyuan TW
- Chien; Feng-Lung - Taichung TW
- Chien; Feng-Lung - Taiwan N/A TW
- Chien; Feng-Lung - Taichung Hsien TW
| Patent | Date |
|---|---|
| Coil Module App 20220277886 - CHIEN; Feng-Lung ; et al. | 2022-09-01 |
| Coil Module App 20210281113 - CHIEN; Feng-Lung ; et al. | 2021-09-09 |
| Wireless device Grant 11,050,298 - Chien , et al. June 29, 2 | 2021-06-29 |
| Wireless device Grant 10,855,108 - Chien , et al. December 1, 2 | 2020-12-01 |
| Wireless device Grant 10,840,738 - Chien , et al. November 17, 2 | 2020-11-17 |
| Coil module App 20200350113 - CHIEN; Feng-Lung ; et al. | 2020-11-05 |
| Wireless device Grant 10,615,629 - Chien , et al. | 2020-04-07 |
| Magnetic Conductive Substrate And Coil Assembly App 20200075234 - CHIEN; Feng-Lung ; et al. | 2020-03-05 |
| Wireless Device App 20190156996 - CHIEN; Feng-Lung ; et al. | 2019-05-23 |
| Wireless Device App 20190156997 - CHIEN; Feng-Lung ; et al. | 2019-05-23 |
| Wireless Device App 20190089196 - CHIEN; Feng-Lung ; et al. | 2019-03-21 |
| Wireless Device App 20190089188 - CHIEN; Feng-Lung ; et al. | 2019-03-21 |
| Wireless charging device for charging a plurality of wireless power receiving apparatus and charging method thereof Grant 9,793,743 - Chien , et al. October 17, 2 | 2017-10-17 |
| Wireless charging coil PCB structure Grant 9,595,383 - Chien , et al. March 14, 2 | 2017-03-14 |
| Wireless Charging Device And Charging Method Thereof App 20170018947 - Chien; Feng-Lung ; et al. | 2017-01-19 |
| Wireless Charging Coil Pcb Structure App 20160126009 - CHIEN; Feng-Lung ; et al. | 2016-05-05 |
| Wireless Charging Coil Pcb Structure With Slit App 20160126001 - CHIEN; Feng-Lung ; et al. | 2016-05-05 |
| Wireless Charging and Near Field Communication Dual Coils PCB Structure App 20160126002 - CHIEN; Feng-Lung ; et al. | 2016-05-05 |
| Fabrication Method Of Semiconductor Structure App 20150072517 - Lin; Yi-Hung ; et al. | 2015-03-12 |
| Semiconductor structure and fabrication method thereof Grant 8,866,293 - Lin , et al. October 21, 2 | 2014-10-21 |
| Conductive bump structure on substrate and fabrication method thereof Grant 8,569,162 - Chien , et al. October 29, 2 | 2013-10-29 |
| Conductive Bump Structure On Substrate And Fabrication Method Thereof App 20130249082 - Chien; Feng-Lung ; et al. | 2013-09-26 |
| Semiconductor Structure And Fabrication Method Thereof App 20120280384 - Lin; Yi-Hung ; et al. | 2012-11-08 |
| Semiconductor Substrate And Method Thereof App 20120126397 - Chien; Feng-Lung ; et al. | 2012-05-24 |
| Semiconductor device and fabrication method thereof Grant 7,489,037 - Chien , et al. February 10, 2 | 2009-02-10 |
| Process for forming lead-free bump on electronic component Grant 7,341,949 - Chien , et al. March 11, 2 | 2008-03-11 |
| Semiconductor device and fabrication method thereof App 20060226542 - Chien; Feng-Lung ; et al. | 2006-10-12 |
| Process for forming lead-free bump on electronic component App 20050042872 - Chien, Feng-Lung ; et al. | 2005-02-24 |
| Circuit probing contact pad formed on a bond pad in a flip chip package Grant 6,753,609 - Chien , et al. June 22, 2 | 2004-06-22 |
| Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer Grant 6,692,629 - Chen , et al. February 17, 2 | 2004-02-17 |
| Circuit Probing Contact Pad Formed On A Bond Pad In A Flip Chip Package App 20020031880 - Chien, Feng-Lung ; et al. | 2002-03-14 |
| Method of fabricating solder bumps with high coplanarity for flip-chip application Grant 6,348,401 - Chen , et al. February 19, 2 | 2002-02-19 |
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