loadpatents
name:-0.041538000106812
name:-0.4267098903656
name:-0.41767692565918
Chien; Chun-Hsien Patent Filings

Chien; Chun-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chien; Chun-Hsien.The latest application filed is for "embedded component structure and manufacturing method thereof".

Company Profile
31.22.30
  • Chien; Chun-Hsien - New Taipei City TW
  • Chien; Chun-Hsien - New Taipei TW
  • Chien; Chun-Hsien - Hsinchu City TW
  • Chien; Chun-Hsien - Hsinchu TW
  • CHIEN; Chun-Hsien - Taoyuan TW
  • Chien; Chun-Hsien - Taipei County TW
  • Chien; Chun-Hsien - Sinjhuang City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Embedded Component Structure And Manufacturing Method Thereof
App 20220287182 - Tseng; Tzyy-Jang ;   et al.
2022-09-08
Method of manufacturing chip packaging structure
Grant 11,348,869 - Chen , et al. May 31, 2
2022-05-31
Light-emitting diode package and manufacturing method thereof
Grant 11,251,350 - Lin , et al. February 15, 2
2022-02-15
Package Carrier And Manufacturing Method Thereof
App 20220022316 - Chen; Po-Wei ;   et al.
2022-01-20
Manufacturing Method Of Package Carrier
App 20210398894 - Lin; Wei-Ti ;   et al.
2021-12-23
Substrate structure and manufacturing method thereof
Grant 11,201,123 - Chien , et al. December 14, 2
2021-12-14
Package carrier and manufacturing method thereof
Grant 11,139,234 - Lin , et al. October 5, 2
2021-10-05
Manufacturing Method Of Circuit Carrier Board
App 20210282277 - Lin; Wei-Ti ;   et al.
2021-09-09
Manufacturing Method Of Circuit Carrier Board
App 20210219435 - Chien; Chun-Hsien ;   et al.
2021-07-15
Circuit Board Element And Manufacturing Method Thereof
App 20210193608 - Hsieh; Yu-Chung ;   et al.
2021-06-24
Package structure and preparation method thereof
Grant 11,037,869 - Chen , et al. June 15, 2
2021-06-15
Circuit carrier board and manufacturing method thereof
Grant 11,032,917 - Lin , et al. June 8, 2
2021-06-08
Circuit carrier board and manufacturing method thereof
Grant 10,999,939 - Chien , et al. May 4, 2
2021-05-04
Manufacturing method of substrate structure
Grant 10,950,687 - Chen , et al. March 16, 2
2021-03-16
Manufacturing Method Of Circuit Carrier Board Structure
App 20210076508 - Lin; Wei-Ti ;   et al.
2021-03-11
Method Of Manufacturing Chip Packaging Structure
App 20210074633 - CHEN; Chien-Chou ;   et al.
2021-03-11
Package carrier structure having integrated circuit design and manufacturing method thereof
Grant 10,937,723 - Hsieh , et al. March 2, 2
2021-03-02
Package Structure And Preparation Method Thereof
App 20210057320 - Chen; Fu-Yang ;   et al.
2021-02-25
Circuit carrier board structure and manufacturing method thereof
Grant 10,888,001 - Lin , et al. January 5, 2
2021-01-05
Manufacturing method of light-emitting diode package structure
Grant 10,886,264 - Lin , et al. January 5, 2
2021-01-05
Chip packaging structure and manufacturing method thereof
Grant 10,879,167 - Chen , et al. December 29, 2
2020-12-29
Composite substrate structure and manufacturing method thereof
Grant 10,863,618 - Tseng , et al. December 8, 2
2020-12-08
Embedded chip package, manufacturing method thereof, and package-on-package structure
Grant 10,797,017 - Lin , et al. October 6, 2
2020-10-06
Manufacturing Method Of Substrate Structure
App 20200273948 - Chen; Yu-Hua ;   et al.
2020-08-27
Manufacturing Method Of Light-emitting Diode Package Structure
App 20200266181 - Lin; Wei-Ti ;   et al.
2020-08-20
Light-emitting diode package structure and manufacturing method thereof
Grant 10,700,049 - Lin , et al.
2020-06-30
Substrate structure and manufacturing method thereof
Grant 10,700,161 - Chen , et al.
2020-06-30
Composite Substrate Structure And Manufacturing Method Thereof
App 20200196440 - Tseng; Tzyy-Jang ;   et al.
2020-06-18
Substrate Structure And Manufacturing Method Thereof
App 20200194384 - Chien; Chun-Hsien ;   et al.
2020-06-18
Carrier Structure And Manufacturing Method Thereof
App 20200163215 - Yeh; Wen-Liang ;   et al.
2020-05-21
Light-emitting Diode Package And Manufacturing Method Thereof
App 20200161518 - Lin; Yi-Cheng ;   et al.
2020-05-21
Carrier structure and manufacturing method thereof
Grant 10,660,202 - Yeh , et al.
2020-05-19
Chip Packaging Structure And Manufacturing Method Thereof
App 20200144179 - CHEN; Chien-Chou ;   et al.
2020-05-07
Substrate Structure And Manufacturing Method Thereof
App 20200075711 - Chen; Yu-Hua ;   et al.
2020-03-05
Light-emitting Diode Package Structure And Manufacturing Method Thereof
App 20200075564 - Lin; Wei-Ti ;   et al.
2020-03-05
Circuit Board Element And Manufacturing Method Thereof
App 20200013744 - Hsieh; Yu-Chung ;   et al.
2020-01-09
Circuit Carrier Board And Manufacturing Method Thereof
App 20190380211 - Lin; Wei-Ti ;   et al.
2019-12-12
Circuit Carrier Board And Manufacturing Method Thereof
App 20190380212 - Chien; Chun-Hsien ;   et al.
2019-12-12
Circuit Carrier Board Structure And Manufacturing Method Thereof
App 20190380210 - Lin; Wei-Ti ;   et al.
2019-12-12
Embedded Component Structure And Manufacturing Method Thereof
App 20190380200 - Tseng; Tzyy-Jang ;   et al.
2019-12-12
Package Carrier Structure And Manufacturing Method Thereof
App 20190348356 - Hsieh; Yu-Chung ;   et al.
2019-11-14
Package structure and manufacturing method thereof
Grant 10,461,146 - Yeh , et al. Oc
2019-10-29
Embedded Chip Package, Manufacturing Method Thereof, And Package-on-package Structure
App 20190295984 - Lin; Po-Chen ;   et al.
2019-09-26
Circuit board structure and manufacturing method thereof
Grant 10,123,418 - Lin , et al. November 6, 2
2018-11-06
Method for producing glass substrate
Grant 9,969,152 - Yamazaki , et al. May 15, 2
2018-05-15
Circuit Board Element
App 20180014404 - HSIEH; Yu-Chung ;   et al.
2018-01-11
Circuit board element
Grant 9,860,980 - Hsieh , et al. January 2, 2
2018-01-02
Circuit board and method of manufacturing the same
Grant 9,854,671 - Lin , et al. December 26, 2
2017-12-26
Method For Producing Glass Substrate
App 20160276631 - YAMAZAKI; Yasuo ;   et al.
2016-09-22
Filled Through-silicon Via And The Fabrication Method Thereof
App 20130234325 - Dai; Ming-Ji ;   et al.
2013-09-12
Semiconductor Structure And Process Thereof
App 20120133046 - Chien; Chun-Hsien ;   et al.
2012-05-31
Plasma etching method with reduced particles production
App 20060138085 - Chien; Chun-Hsien ;   et al.
2006-06-29

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