Chiang; Yung-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiang; Yung-Ping.The latest application filed is for "memory device and manufacturing method thereof".

Company Profile

15.20.24

Chiang; Yung-Ping - Hsinchu County TW
CHIANG; Yung-Ping - Zhubei City TW
Chiang; Yung-Ping - Zhubei TW
Chiang; Yung-Ping - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Memory Device And Manufacturing Method Thereof App 20220246578 - Huang; Ching-Yu ; et al.	2022-08-04
Memory device and manufacturing method thereof Grant 11,335,666 - Huang , et al. May 17, 2	2022-05-17
Memory Device And Manufacturing Method Thereof App 20220013494 - Huang; Ching-Yu ; et al.	2022-01-13
Integrated Fan-out Packages And Methods Of Forming The Same App 20210351126 - Huang; Ching-Yu ; et al.	2021-11-11
Package structure and method of manufacturing the same Grant 11,127,708 - Liu , et al. September 21, 2	2021-09-21
Chip Package With Antenna Element App 20210265289 - CHIANG; Yung-Ping ; et al.	2021-08-26
Semiconductor Packages And Manufacturing Mehtods Thereof App 20210257717 - Chiang; Yung-Ping ; et al.	2021-08-19
Integrated fan-out packages and methods of forming the same Grant 11,075,159 - Huang , et al. July 27, 2	2021-07-27
Chip package with antenna element Grant 11,004,809 - Chiang , et al. May 11, 2	2021-05-11
Semiconductor packages and manufacturing methods thereof Grant 10,978,782 - Chiang , et al. April 13, 2	2021-04-13
Package structure and method of fabricating the same Grant 10,937,719 - Chiang , et al. March 2, 2	2021-03-02
Semiconductor package and manufacturing method thereof Grant 10,879,170 - Chiang , et al. December 29, 2	2020-12-29
Semiconductor Package And Manufacturing Method Thereof App 20200335439 - Chiang; Yung-Ping ; et al.	2020-10-22
Semiconductor Packages And Manufacturing Mehtods Thereof App 20200258799 - A1	2020-08-13
Semiconductor packages and manufacturing methods thereof Grant 10,636,713 - Chiang , et al.	2020-04-28
Package Structure And Method Of Manufacturing The Same App 20200075526 - Liu; Ming-Kai ; et al.	2020-03-05
Integrated Fan-out Packages And Methods Of Forming The Same App 20200020628 - Huang; Ching-Yu ; et al.	2020-01-16
Package structure and method of manufacturing the same Grant 10,504,865 - Liu , et al. Dec	2019-12-10
Chip Package With Antenna Element App 20190279951 - CHIANG; Yung-Ping ; et al.	2019-09-12
Semiconductor structure and manufacturing method thereof Grant 10,319,692 - Chiang , et al.	2019-06-11
Structure and formation method of chip package with antenna element Grant 10,312,203 - Chiang , et al.	2019-06-04
Semiconductor Packages And Manufacturing Mehtods Thereof App 20190115271 - Chiang; Yung-Ping ; et al.	2019-04-18
Package Structure And Method Of Manufacturing The Same App 20190096841 - Liu; Ming-Kai ; et al.	2019-03-28
Sensor packages and manufacturing mehtods thereof Grant 10,157,807 - Chiang , et al. Dec	2018-12-18
Package Structure And Method Of Fabricating The Same App 20180269139 - Chiang; Yung-Ping ; et al.	2018-09-20
Structure And Formation Method Of Chip Package With Antenna Element App 20180166405 - CHIANG; Yung-Ping ; et al.	2018-06-14
Sensor Packages And Manufacturing Mehtods Thereof App 20170345731 - Chiang; Yung-Ping ; et al.	2017-11-30
Method of manufacturing a semiconductor device having scribe lines Grant 9,728,477 - Wu , et al. August 8, 2	2017-08-08
Semiconductor Structure And Manufacturing Method Thereof App 20170103955 - CHIANG; YUNG-PING ; et al.	2017-04-13
Semiconductor structure with oval shaped conductor Grant 9,543,259 - Chiang , et al. January 10, 2	2017-01-10
Semiconductor device Grant 9,484,308 - Liu , et al. November 1, 2	2016-11-01
Semiconductor Device And Method Of Manufacturing The Same App 20160240453 - WU; NIEN-FANG ; et al.	2016-08-18
Semiconductor device having trench adjacent to receiving area and method of forming the same Grant 9,397,056 - Wang , et al. July 19, 2	2016-07-19
Semiconductor device and manufacturing method thereof Grant 9,379,076 - Hsieh , et al. June 28, 2	2016-06-28
Copper post structure for wafer level chip scale package Grant 9,343,415 - Shih , et al. May 17, 2	2016-05-17
Semiconductor device comprising a chip substrate, a mold, and a buffer layer Grant 9,343,385 - Wu , et al. May 17, 2	2016-05-17
Semiconductor Device And Manufacturing Method Thereof App 20160099223 - HSIEH; CHEN-CHIH ; et al.	2016-04-07
Semiconductor Structure And Manufacturing Method Thereof App 20160099221 - CHIANG; YUNG-PING ; et al.	2016-04-07
Semiconductor Device And Method Of Manufacturing The Same App 20160035639 - WU; NIEN-FANG ; et al.	2016-02-04
Semiconductor Device And Manufacturing Method Thereof App 20150380357 - LIU; MING-KAI ; et al.	2015-12-31
Semiconductor Device Having Trench Adjacent To Receiving Area And Method Of Forming The Same App 20150348923 - WANG; YEN-PING ; et al.	2015-12-03
Copper Post Structure For Wafer Level Chip Scale Package App 20150228597 - SHIH; Chao-Wen ; et al.	2015-08-13
Copper post structure for wafer level chip scale package Grant 9,035,468 - Shih , et al. May 19, 2	2015-05-19
Copper Post Structure for Wafer Level Chip Scale Package App 20150035139 - Shih; Chao-Wen ; et al.	2015-02-05

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