Chiang; Steve S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiang; Steve S..The latest application filed is for "methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates".

Company Profile

0.32.17

Chiang; Steve S. - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,671,428 - Patel , et al. March 2, 2	2010-03-02
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,655,492 - Patel , et al. February 2, 2	2010-02-02
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,586,668 - Patel , et al. September 8, 2	2009-09-08
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,573,111 - Patel , et al. August 11, 2	2009-08-11
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,449,358 - Patel , et al. November 11, 2	2008-11-11
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,286,278 - Patel , et al. October 23, 2	2007-10-23
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,198,982 - Patel , et al. April 3, 2	2007-04-03
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20070001247 - Patel; Satyadev R. ; et al.	2007-01-04
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 6,995,034 - Patel , et al. February 7, 2	2006-02-07
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 6,995,040 - Patel , et al. February 7, 2	2006-02-07
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050260792 - Patel, Satyadev R. ; et al.	2005-11-24
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050260793 - Patel, Satyadev R. ; et al.	2005-11-24
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050214976 - Patel, Satyadev R. ; et al.	2005-09-29
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050191790 - Patel, Satyadev R. ; et al.	2005-09-01
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050191789 - Patel, Satyadev R. ; et al.	2005-09-01
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050179982 - Patel, Satyadev R. ; et al.	2005-08-18
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050181532 - Patel, Satyadev R. ; et al.	2005-08-18
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050180686 - Patel, Satyadev R. ; et al.	2005-08-18
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050173711 - Patel, Satyadev R. ; et al.	2005-08-11
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050170557 - Patel, Satyadev R. ; et al.	2005-08-04
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050170540 - Patel, Satyadev R. ; et al.	2005-08-04
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050170614 - Patel, Satyadev R. ; et al.	2005-08-04
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050170547 - Patel, Satyadev R. ; et al.	2005-08-04
Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates App 20050139940 - Patel, Satyadev R. ; et al.	2005-06-30
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050048688 - Patel, Satyadev R. ; et al.	2005-03-03
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050042792 - Patel, Satyadev R. ; et al.	2005-02-24
Antifuse structure suitable for VLSI application Grant 6,603,187 - Zhang , et al. August 5, 2	2003-08-05
Antifuse structure suitable for VLSI application Grant 6,111,302 - Zhang , et al. August 29, 2	2000-08-29
Ball grid array structure and method for packaging an integrated circuit chip Grant 6,034,427 - Lan , et al. March 7, 2	2000-03-07
Antifuse interconnect between two conducting layers of a printed circuit board Grant 5,962,815 - Lan , et al. October 5, 1	1999-10-05
Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect Grant 5,917,229 - Nathan , et al. June 29, 1	1999-06-29
Method and structure to interconnect traces of two conductive layers in a printed circuit board Grant 5,906,042 - Lan , et al. May 25, 1	1999-05-25
Multilayer board having insulating isolation rings Grant 5,872,338 - Lan , et al. February 16, 1	1999-02-16
Method of fabricating an antifuse Grant 5,856,234 - Chiang , et al. January 5, 1	1999-01-05
Use of conductive particles in a nonconductive body as an integrated circuit antifuse Grant 5,834,824 - Shepherd , et al. November 10, 1	1998-11-10
Programmable cable and cable adapter using fuses and antifuses Grant 5,813,881 - Nathan , et al. September 29, 1	1998-09-29
Programmable/reprogramable structure using fuses and antifuses Grant 5,808,351 - Nathan , et al. September 15, 1	1998-09-15
Ball grid array structure and method for packaging an integrated circuit chip Grant 5,767,575 - Lan , et al. June 16, 1	1998-06-16
Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board Grant 5,572,409 - Nathan , et al. November 5, 1	1996-11-05
Method and structure for programming fuses Grant 5,537,108 - Nathan , et al. July 16, 1	1996-07-16
Electrically-programmable low-impedance anti-fuse element Grant 5,412,244 - Hamdy , et al. * May 2, 1	1995-05-02
Metal-to-metal antifuse including etch stop layer Grant 5,381,035 - Chen , et al. January 10, 1	1995-01-10
Circuits for ESD protection of metal-to-metal antifuses during processing Grant 5,369,054 - Yen , et al. November 29, 1	1994-11-29
Methods for programming antifuses having at least one metal electrode Grant 5,316,971 - Chiang , et al. May 31, 1	1994-05-31
Electrically-programmable low-impedance anti-fuse element Grant 5,266,829 - Hamdy , et al. * November 30, 1	1993-11-30
Apparatus for improving antifuse programming yield and reducing antifuse programming time Grant 5,130,777 - Galbraith , et al. July 14, 1	1992-07-14
Methods of reducing anti-fuse resistance during programming Grant 5,126,282 - Chiang , et al. June 30, 1	1992-06-30
Misalignment tolerant antifuse Grant 5,087,958 - Chen , et al. February 11, 1	1992-02-11
Structure for protecting thin dielectrics during processing Grant 4,941,028 - Chen , et al. July 10, 1	1990-07-10

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