Chiang; Po Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chiang; Po Yuan.The latest application filed is for "semiconductor chip fabrication and packaging methods thereof".
- Chiang; Po Yuan - Shanghai CN
| Patent | Date |
|---|---|
| Semiconductor chip fabrication and packaging methods thereof Grant 11,335,648 - Lu , et al. May 17, 2 | 2022-05-17 |
| Fabrication method of packaging structure Grant 10,950,525 - Jin , et al. March 16, 2 | 2021-03-16 |
| Wafer dicing method Grant 10,658,239 - Lu , et al. | 2020-05-19 |
| Semiconductor Chip Fabrication And Packaging Methods Thereof App 20200098704 - LU; Li Hui ; et al. | 2020-03-26 |
| Semiconductor chip, and fabrication and packaging methods thereof Grant 10,522,479 - Lu , et al. Dec | 2019-12-31 |
| Fabrication Method Of Packaging Structure App 20190393134 - JIN; Li Zhong ; et al. | 2019-12-26 |
| Packaging structure and fabrication method thereof Grant 10,446,474 - Jin , et al. Oc | 2019-10-15 |
| Wafer Dicing Method App 20190181045 - Lu; Lihui ; et al. | 2019-06-13 |
| Semiconductor Chip, And Fabrication And Packaging Methods Thereof App 20180337143 - LU; Li Hui ; et al. | 2018-11-22 |
| Packaging Structure And Fabrication Method Thereof App 20180182690 - JIN; Li Zhong ; et al. | 2018-06-28 |
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