Chiang; Pang-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chiang; Pang-Ming.The latest application filed is for "wafer electroplating apparatus".
- Chiang; Pang-Ming - Taipei TW
- Chiang; Pang-Ming - Hsinchu TW
- Chiang; Pang-Ming - Taipei City TW
- Chiang, Pang-Ming - Hsin-Chu Hsien TW
| Patent | Date |
|---|---|
| Wafer electroplating apparatus Grant 7,449,091 - Du , et al. November 11, 2 | 2008-11-11 |
| Electroplating apparatus with functions of voltage detection and flow rectification Grant 7,238,265 - Wang , et al. July 3, 2 | 2007-07-03 |
| Wafer electroplating apparatus App 20060137974 - Du; Chen-Chung ; et al. | 2006-06-29 |
| Compress and position apparatus Grant 7,021,208 - Du , et al. April 4, 2 | 2006-04-04 |
| Compress and position apparatus App 20050051023 - Du, Chen-Chung ; et al. | 2005-03-10 |
| Electroplating apparatus with functions of voltage detection and flow rectification App 20050051425 - Wang, Chih-Cheng ; et al. | 2005-03-10 |
| Structure of the metal bumping on the input/output connector of a substrate or wafer and method for manufacturing the same App 20030107132 - Chiang, Pang-Ming ; et al. | 2003-06-12 |
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