Chiang; Lien Jin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chiang; Lien Jin.The latest application filed is for "high performance thermal solution concept for surface mount device packages".
- Chiang; Lien Jin - New Taipei TW
- Chiang; Lien Jin - New Taipei City TW
- Chiang; Lien-Jin - Taoyuan Hsien TW
- Chiang; Lien-Jin - Guangdong CN
- Chiang; Lien-Jin - Shenzhen CN
- Chiang; Lien-Jin - Tu-Cheng TW
- Chiang; Lien-Jin - Taoyuan TW
| Patent | Date |
|---|---|
| High performance thermal solution concept for surface mount device packages Grant 11,357,097 - Lin , et al. June 7, 2 | 2022-06-07 |
| High Performance Thermal Solution Concept For Surface Mount Device Packages App 20220132651 - Lin; Yung You ; et al. | 2022-04-28 |
| Electronic apparatus with natural convection structure Grant 7,457,133 - Chiang , et al. November 25, 2 | 2008-11-25 |
| Rotary total heat exchange apparatus Grant 7,445,038 - Liu , et al. November 4, 2 | 2008-11-04 |
| Rotary Total Heat Exchange Apparatus App 20060213636 - Liu; Tay-Jian ; et al. | 2006-09-28 |
| Total heat exchanger App 20060130508 - Liu; Tay-Jian ; et al. | 2006-06-22 |
| Electronic apparatus with natural convection structure App 20040201973 - Chiang, Lien-Jin ; et al. | 2004-10-14 |
| Waterproof and heat-dissipating structure of electronic apparatus Grant 6,776,650 - Cheng , et al. August 17, 2 | 2004-08-17 |
| Waterproof and heat-dissipating structure of electronic apparatus App 20040067688 - Cheng, Bruce C.H. ; et al. | 2004-04-08 |
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