| Patent | Date |
|---|
Process kit erosion and service life prediction
Grant 10,770,321 - Chiang , et al. Sep | 2020-09-08 |
Process Kit Erosion And Service Life Prediction
App 20190148194 - CHIANG; Kang-Lie ; et al. | 2019-05-16 |
Process kit erosion and service life prediction
Grant 10,177,018 - Chiang , et al. J | 2019-01-08 |
Process Kit Erosion And Service Life Prediction
App 20180047599 - CHIANG; Kang-Lie ; et al. | 2018-02-15 |
Local and global reduction of critical dimension (CD) asymmetry in etch processing
Grant 9,281,190 - Chiang , et al. March 8, 2 | 2016-03-08 |
Local And Global Reduction Of Critical Dimension (cd) Asymmetry In Etch Processing
App 20140273466 - Chiang; Kang-lie ; et al. | 2014-09-18 |
Methods for forming ultra thin structures on a substrate
Grant 7,981,812 - Chiang , et al. July 19, 2 | 2011-07-19 |
Method Of Substrate Polymer Removal
App 20090293907 - Fung; Nancy ; et al. | 2009-12-03 |
Methods Of For Forming Ultra Thin Structures On A Substrate
App 20090035944 - Chiang; Kang-Lie ; et al. | 2009-02-05 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 7,186,943 - Hoffman , et al. March 6, 2 | 2007-03-06 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 7,132,618 - Hoffman , et al. November 7, 2 | 2006-11-07 |
Post-etch treatment to remove residues
App 20060102197 - Chiang; Kang-Lie ; et al. | 2006-05-18 |
Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 7,030,335 - Hoffman , et al. April 18, 2 | 2006-04-18 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20050236377 - Hoffman, Daniel J. ; et al. | 2005-10-27 |
Method for modifying dielectric characteristics of dielectric layers
Grant 6,921,727 - Chiang , et al. July 26, 2 | 2005-07-26 |
Capacitively coupled plasma reactor with uniform radial distribution of plasma
Grant 6,900,596 - Yang , et al. May 31, 2 | 2005-05-31 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 6,894,245 - Hoffman , et al. May 17, 2 | 2005-05-17 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20040211759 - Hoffman, Daniel J. ; et al. | 2004-10-28 |
Method for modifying dielectric characteristics of dielectric layers
App 20040180556 - Chiang, Kang-Lie ; et al. | 2004-09-16 |
Method of etching an anisotropic profile in platinum
Grant 6,749,770 - Hwang , et al. June 15, 2 | 2004-06-15 |
Capacitively coupled plasma reactor with uniform radial distribution of plasma
App 20040056602 - Yang, Jang Gyoo ; et al. | 2004-03-25 |
Cathode pedestal for a plasma etch reactor
App 20040040664 - Yang, Jang Gyoo ; et al. | 2004-03-04 |
Gas distribution plate electrode for a plasma receptor
Grant 6,677,712 - Katz , et al. January 13, 2 | 2004-01-13 |
Gas Distribution Plate Electrode For A Plasma Reactor
App 20030201723 - Katz, Dan ; et al. | 2003-10-30 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20030136766 - Hoffman, Daniel J. ; et al. | 2003-07-24 |
Gas distribution plate electrode for a plasma reactor
Grant 6,586,886 - Katz , et al. July 1, 2 | 2003-07-01 |
Gas Distribution Plate Electrode For A Plasma Reactor
App 20030111961 - Katz, Dan ; et al. | 2003-06-19 |
Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20020108933 - Hoffman, Daniel J. ; et al. | 2002-08-15 |
Method of etching an anisotropic profile in platinum
App 20020037647 - Hwang, Jeng H. ; et al. | 2002-03-28 |
Method for allowing a stable power transmission into a plasma processing chamber
App 20010050267 - Hwang, Jeng H. ; et al. | 2001-12-13 |
Etching methods for anisotropic platinum profile
Grant 6,323,132 - Hwang , et al. November 27, 2 | 2001-11-27 |
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