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Patent applications and USPTO patent grants for Chiang, Hua-Wen.The latest application filed is for "fabrication method of semiconductor".
Patent | Date |
---|---|
Fabrication method of semiconductor App 20030059721 - Shieh, Wen-Lo ;   et al. | 2003-03-27 |
Semiconductor chip package with cooling arrangement App 20030035270 - Shieh, Wen-Lo ;   et al. | 2003-02-20 |
Method and device for making a metal bump with an increased height App 20030006268 - Shieh, Wen-Lo ;   et al. | 2003-01-09 |
Method and device for making a metal bump with an increased height Grant 6,499,648 - Shieh , et al. December 31, 2 | 2002-12-31 |
Method And Device For Making A Metal Bump With An Increased Height App 20020179686 - Shieh, Wen-Lo ;   et al. | 2002-12-05 |
Manufacturing method for multilayer high density substrate App 20020072216 - Shieh, Wen Lo ;   et al. | 2002-06-13 |
Method of forming bumps on wafers or substrates Grant 6,358,834 - Shieh , et al. March 19, 2 | 2002-03-19 |
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