| Patent | Date |
|---|
Structure of integrated radio frequency multi-chip package and method of fabricating the same
Grant 10,886,593 - Chiang , et al. January 5, 2 | 2021-01-05 |
Wireless receiving device
Grant 10,707,835 - Liang , et al. | 2020-07-07 |
Structure Of Integrated Radio Frequency Multi-chip Package And Method Of Fabricating The Same
App 20200203817 - CHIANG; Ching-Wen ; et al. | 2020-06-25 |
Wireless Receiving Device
App 20200195231 - LIANG; Chia-Jen ; et al. | 2020-06-18 |
Method for manufacturing a multi-band antenna package structure
Grant 10,566,299 - Chiang , et al. Feb | 2020-02-18 |
Method For Manufacturing A Multi-band Antenna Package Structure
App 20190333883 - CHIANG; CHING-WEN ; et al. | 2019-10-31 |
Multi-band antenna package structure, manufacturing method thereof and communication device
Grant 10,424,550 - Chiang , et al. Sept | 2019-09-24 |
Variable inductor and integrated circuit using the variable inductor
Grant 10,361,154 - Liang , et al. | 2019-07-23 |
Variable Inductor And Integrated Circuit Using The Variable Inductor
App 20190189556 - LIANG; CHIA-JEN ; et al. | 2019-06-20 |
Variable Inductor And Integrated Circuit Using The Variable Inductor
App 20190189342 - LIANG; CHIA-JEN ; et al. | 2019-06-20 |
Multi-band Antenna Package Structure, Manufacturing Method Thereof And Communication Device
App 20190189572 - CHIANG; CHING-WEN ; et al. | 2019-06-20 |
Radio frequency amplifier and integrated circuit using the radio frequency amplifier
Grant 10,298,182 - Liang , et al. | 2019-05-21 |
Radio frequency amplifier and integrated circuit using the radio frequency amplifier
Grant 10,277,170 - Liang , et al. | 2019-04-30 |
Package structure and fabrication method thereof
Grant 10,249,562 - Chiang , et al. | 2019-04-02 |
Electronic package and fabrication method thereof
Grant 10,236,227 - Chuang , et al. | 2019-03-19 |
Method of fabricating substrate structure
Grant 10,199,345 - Lin , et al. Fe | 2019-02-05 |
Method of fabricating electronic package
Grant 10,199,320 - Chiang , et al. Fe | 2019-02-05 |
Multi-band antenna package structure, manufacturing method thereof and communication device
Grant 10,096,558 - Chiang , et al. October 9, 2 | 2018-10-09 |
Method for fabricating electronic package
Grant 10,096,541 - Chiang , et al. October 9, 2 | 2018-10-09 |
Electronic package and fabrication method thereof and substrate structure
Grant 10,049,973 - Chiang , et al. August 14, 2 | 2018-08-14 |
Method Of Fabricating Substrate Structure
App 20180138140 - Lin; Hsin-Ta ; et al. | 2018-05-17 |
Substrate structure, fabrication method thereof and conductive structure
Grant 9,899,344 - Lin , et al. February 20, 2 | 2018-02-20 |
Method Of Fabricating Electronic Package
App 20180040550 - Chiang; Ching-Wen ; et al. | 2018-02-08 |
Method For Fabricating Electronic Package
App 20170330826 - Chiang; Ching-Wen ; et al. | 2017-11-16 |
Electronic package and method of fabricating the same
Grant 9,818,683 - Chiang , et al. November 14, 2 | 2017-11-14 |
Substrate structure, electronic package and method for fabricating the electronic package
Grant 9,754,868 - Chiang , et al. September 5, 2 | 2017-09-05 |
Fabrication method of semiconductor package
Grant 9,748,183 - Chiang , et al. August 29, 2 | 2017-08-29 |
Substrate Structure, Electronic Package And Method For Fabricating The Electronic Package
App 20170194238 - Chiang; Ching-Wen ; et al. | 2017-07-06 |
Fabrication Method Of Semiconductor Package
App 20170186703 - Chiang; Ching-Wen ; et al. | 2017-06-29 |
Electronic Package And Method Of Fabricating The Same
App 20170148716 - Chiang; Ching-Wen ; et al. | 2017-05-25 |
Semiconductor package and fabrication method thereof
Grant 9,627,307 - Chiang , et al. April 18, 2 | 2017-04-18 |
Electronic Package And Method Of Fabricating The Same
App 20170040248 - Chiang; Ching-Wen ; et al. | 2017-02-09 |
Substrate Structure, Fabrication Method Thereof And Conductive Structure
App 20160358873 - Lin; Hsin-Ta ; et al. | 2016-12-08 |
Electronic Package And Fabrication Method Thereof And Substrate Structure
App 20160276256 - Chiang; Ching-Wen ; et al. | 2016-09-22 |
Electronic package and fabrication method thereof
App 20160260644 - Chuang; Lung-Shan ; et al. | 2016-09-08 |
Electronic Package And Fabrication Method Thereof
App 20160148873 - Chiang; Ching-Wen ; et al. | 2016-05-26 |
Semiconductor Package And Fabrication Method Thereof
App 20160133556 - Chiang; Ching-Wen ; et al. | 2016-05-12 |
Semiconductor Structure And Method Of Fabricating The Same
App 20160086903 - Chiang; Ching-Wen ; et al. | 2016-03-24 |
Package Structure And Fabrication Method Thereof
App 20160066427 - Chiang; Ching-Wen ; et al. | 2016-03-03 |
Interposer With Conductive Post And Fabrication Method Thereof
App 20160049359 - Chiang; Ching-Wen ; et al. | 2016-02-18 |
Interposer and method of manufacturing the same
Grant 9,196,596 - Chiang , et al. November 24, 2 | 2015-11-24 |
Interposer And Method Of Manufacturing The Same
App 20140367849 - Chiang; Ching-Wen ; et al. | 2014-12-18 |
| 