Patent | Date |
---|
Method of forming a damascene structure with integrated planar dielectric layers Grant 7,361,582 - Wu , et al. April 22, 2 | 2008-04-22 |
Forming phase change memories Grant 7,348,620 - Chiang , et al. March 25, 2 | 2008-03-25 |
Forming phase change memories App 20070138467 - Chiang; Chien ;   et al. | 2007-06-21 |
Method of forming a damascene structure with integrated planar dielectric layers Grant 7,229,907 - Wu , et al. June 12, 2 | 2007-06-12 |
Method of Forming A Damascene Structure with Integrated Planar Dielectric Layers App 20070123033 - Wu; Tom ;   et al. | 2007-05-31 |
Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby Grant 7,217,945 - Dennison , et al. May 15, 2 | 2007-05-15 |
Using selective deposition to form phase-change memory cells Grant 7,214,632 - Chiang May 8, 2 | 2007-05-08 |
Forming phase change memories Grant 7,196,351 - Chiang , et al. March 27, 2 | 2007-03-27 |
Using selective deposition to form phase-change memory cells Grant 7,183,567 - Chiang February 27, 2 | 2007-02-27 |
Reducing shunts in memories with phase-change material Grant 7,161,225 - Xu , et al. January 9, 2 | 2007-01-09 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Grant 7,112,887 - Swan , et al. September 26, 2 | 2006-09-26 |
Method of forming a damascene structure with integrated planar dielectric layers App 20060057829 - Wu; Tom ;   et al. | 2006-03-16 |
In-plane on-chip decoupling capacitors and method for making same Grant 6,949,831 - Chiang , et al. September 27, 2 | 2005-09-27 |
Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby App 20050194620 - Dennison, Charles ;   et al. | 2005-09-08 |
Reducing shunts in memories with phase-change material App 20050136557 - Xu, Daniel ;   et al. | 2005-06-23 |
Forming phase change memories App 20050104231 - Chiang, Chien ;   et al. | 2005-05-19 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme App 20050090042 - Swan, Johanna M. ;   et al. | 2005-04-28 |
Compositionally modified resistive electrode Grant 6,878,618 - Lowrey , et al. April 12, 2 | 2005-04-12 |
Forming phase change memories Grant 6,869,883 - Chiang , et al. March 22, 2 | 2005-03-22 |
Reducing shunts in memories with phase-change material Grant 6,861,267 - Xu , et al. March 1, 2 | 2005-03-01 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Grant 6,848,177 - Swan , et al. February 1, 2 | 2005-02-01 |
In-plane on-chip decoupling capacitors and method for making same App 20040245606 - Chiang, Chien ;   et al. | 2004-12-09 |
Metal structure for a phase-change memory device Grant 6,797,979 - Chiang , et al. September 28, 2 | 2004-09-28 |
In-plane on-chip decoupling capacitors and method for making same Grant 6,777,320 - Chiang , et al. August 17, 2 | 2004-08-17 |
Method to enhance performance of thermal resistor device Grant 6,770,524 - Chiang , et al. August 3, 2 | 2004-08-03 |
Forming phase change memories App 20040114317 - Chiang, Chien ;   et al. | 2004-06-17 |
Reduced area intersection between electrode and programming element App 20040087076 - Dennison, Charles H. ;   et al. | 2004-05-06 |
Compositionally modified resistive electrode App 20040069982 - Lowrey, Tyler A. ;   et al. | 2004-04-15 |
Method to enhance performance of thermal resistor device App 20040051128 - Chiang, Chien ;   et al. | 2004-03-18 |
Reduced area intersection between electrode and programming element Grant 6,673,700 - Dennison , et al. January 6, 2 | 2004-01-06 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme App 20030210534 - Swan, Johanna M. ;   et al. | 2003-11-13 |
High-resistivity metal in a phase-change memory cell App 20030211732 - Chiang, Chien | 2003-11-13 |
High-resistivity metal in a phase-change memory cell App 20030205720 - Chiang, Chien | 2003-11-06 |
Metal structure for a phase-change memory device App 20030193063 - Chiang, Chien ;   et al. | 2003-10-16 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme App 20030183943 - Swan, Johanna M. ;   et al. | 2003-10-02 |
Method to enhance performance of thermal resistor device Grant 6,621,095 - Chiang , et al. September 16, 2 | 2003-09-16 |
Using selective deposition to form phase-change memory cells App 20030151041 - Chiang, Chien | 2003-08-14 |
Using selective deposition to form phase-change memory cells App 20030146452 - Chiang, Chien | 2003-08-07 |
Metal structure for a phase-change memory device Grant 6,569,705 - Chiang , et al. May 27, 2 | 2003-05-27 |
Compositionally modified resistive electrode Grant 6,563,164 - Lowrey , et al. May 13, 2 | 2003-05-13 |
Using selective deposition to form phase-change memory cells Grant 6,545,287 - Chiang April 8, 2 | 2003-04-08 |
Reducing shunts in memories with phase-change material App 20030052351 - Xu, Daniel ;   et al. | 2003-03-20 |
Using Selective Deposition To Form Phase-change Memory Cells App 20030047727 - Chiang, Chien | 2003-03-13 |
Exposed phase edge mask method for generating periodic structures with subwavelength feature App 20030039893 - Farnsworth, Jeff ;   et al. | 2003-02-27 |
Reduced area intersection between electrode and programming element App 20030003691 - Dennison, Charles H. ;   et al. | 2003-01-02 |
Metal structure for a phase-change memory device App 20020080647 - Chiang, Chien ;   et al. | 2002-06-27 |
High-resistivity metal in a phase-change memory cell App 20020074658 - Chiang, Chien | 2002-06-20 |
Compositionally modified resistive electrode Grant 6,404,665 - Lowrey , et al. June 11, 2 | 2002-06-11 |
Compositionally modified resistive electrode App 20020038883 - Lowrey, Tyler A. ;   et al. | 2002-04-04 |
Method to enhance performance of thermal resistor device App 20020039310 - Chiang, Chien ;   et al. | 2002-04-04 |
Method to enhance performance of thermal resistor device Grant 6,339,544 - Chiang , et al. January 15, 2 | 2002-01-15 |
Fabricating low K dielectric interconnect systems by using dummy structures to enhance process Grant 6,309,956 - Chiang , et al. October 30, 2 | 2001-10-30 |
Low-K Dielectric layer and method of making same Grant 6,277,765 - Cheng , et al. August 21, 2 | 2001-08-21 |
Silicon-rich block copolymers to achieve unbalanced vias Grant 6,143,647 - Pan , et al. November 7, 2 | 2000-11-07 |
Silicon-rich block copolymers to achieve unbalanced vias Grant 6,051,869 - Pan , et al. April 18, 2 | 2000-04-18 |
Method for fabricating an interconnect structure with hard mask and low dielectric constant materials Grant 6,027,995 - Chiang , et al. February 22, 2 | 2000-02-22 |
Interconnect structure and method to achieve unlanded vias for low dielectric constant materials Grant 5,935,868 - Fang , et al. August 10, 1 | 1999-08-10 |
Interconnect structure with hard mask and low dielectric constant materials Grant 5,886,410 - Chiang , et al. March 23, 1 | 1999-03-23 |
Unlanded via structure and method for making same Grant 5,880,030 - Fang , et al. March 9, 1 | 1999-03-09 |
Method for forming multileves interconnections for semiconductor fabrication Grant 5,817,572 - Chiang , et al. October 6, 1 | 1998-10-06 |
Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections Grant 5,739,579 - Chiang , et al. April 14, 1 | 1998-04-14 |