| Patent | Date |
|---|
Method For Connecting An Electrical Device To A Bottom Unit By Using A Solderless Joint
App 20220278085 - CHIANG; Chau Fatt ; et al. | 2022-09-01 |
Semiconductor Packages and Methods for Manufacturing Thereof
App 20220199478 - Yeo; Si Hao Vincent ; et al. | 2022-06-23 |
Double-sided cooled molded semiconductor package
Grant 11,302,613 - Chiang , et al. April 12, 2 | 2022-04-12 |
Pressure sensor having a lidless/laminate structure
Grant 11,274,984 - Chiang , et al. March 15, 2 | 2022-03-15 |
Semiconductor Package and Method for Fabricating a Semiconductor Package
App 20220037222 - Saw; Khay Chwan Andrew ; et al. | 2022-02-03 |
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package
App 20210391298 - Saw; Khay Chwan ; et al. | 2021-12-16 |
Semiconductor Package with Lead Tip Inspection Feature
App 20210366732 - Chiang; Chau Fatt ; et al. | 2021-11-25 |
Over-under sensor packaging with sensor spaced apart from control chip
Grant 11,174,152 - Chan , et al. November 16, 2 | 2021-11-16 |
Semiconductor Package And Method For Fabricating The Same
App 20210313294 - Chiang; Chau Fatt ; et al. | 2021-10-07 |
Chip to chip interconnect in encapsulant of molded semiconductor package
Grant 11,133,281 - Saw , et al. September 28, 2 | 2021-09-28 |
Manufacturing a package using plateable encapsulant
Grant 11,081,417 - Chan , et al. August 3, 2 | 2021-08-03 |
Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
App 20210050227 - Pok; Pei Luan ; et al. | 2021-02-18 |
Pressure Sensor
App 20210025774 - Chiang; Chau Fatt ; et al. | 2021-01-28 |
Double-Sided Cooled Molded Semiconductor Package
App 20210020550 - Chiang; Chau Fatt ; et al. | 2021-01-21 |
Molded Semiconductor Package with Double-Sided Cooling
App 20210020547 - Chiang; Chau Fatt ; et al. | 2021-01-21 |
Molded semiconductor package with double-sided cooling
Grant 10,886,199 - Chiang , et al. January 5, 2 | 2021-01-05 |
Chip to Lead Interconnect in Encapsulant of Molded Semiconductor Package
App 20200321269 - Chiang; Chau Fatt ; et al. | 2020-10-08 |
Chip to Chip Interconnect in Encapsulant of Molded Semiconductor Package
App 20200321276 - Saw; Khay Chwan ; et al. | 2020-10-08 |
Chip to lead interconnect in encapsulant of molded semiconductor package
Grant 10,796,981 - Chiang , et al. October 6, 2 | 2020-10-06 |
Semiconductor package with air cavity
Grant 10,777,536 - Chiang , et al. Sept | 2020-09-15 |
Semiconductor Package Having a Laser-Activatable Mold Compound
App 20200185293 - Schmalzl; Stefan ; et al. | 2020-06-11 |
Molding system with movable mold tool
Grant 10,639,833 - Chiang , et al. | 2020-05-05 |
Micro-electrical mechanical system sensor package and method of manufacture thereof
Grant 10,631,100 - Chiang , et al. | 2020-04-21 |
Micro-electrical mechanical system sensor package and method of manufacture thereof
Grant 10595132 - | 2020-03-17 |
Micro-electrical Mechanical System Sensor Package And Method Of Manufacture Thereof
App 20200084550 - Chiang; Chau Fatt ; et al. | 2020-03-12 |
Leadframe, Semiconductor Package and Method
App 20200051898 - Chiang; Chau Fatt ; et al. | 2020-02-13 |
Over-Under Sensor Packaging with Sensor Spaced Apart from Control Chip
App 20200048075 - Chan; Sook Woon ; et al. | 2020-02-13 |
Semiconductor package with a through port for sensor applications
Grant 10,549,985 - Maier , et al. Fe | 2020-02-04 |
Over-under sensor packaging with sensor spaced apart from control chip
Grant 10,501,312 - Chan , et al. Dec | 2019-12-10 |
Semiconductor package and method for fabricating a semiconductor package
Grant 10,490,470 - Chong , et al. Nov | 2019-11-26 |
Manufacturing a package using plateable encapsulant
App 20190341324 - CHAN; Sook Woon ; et al. | 2019-11-07 |
Multi-phase half bridge driver package and methods of manufacture
Grant 10,396,018 - Chiang , et al. A | 2019-08-27 |
Semiconductor package with plateable encapsulant and a method for manufacturing the same
Grant 10,396,007 - Chan , et al. A | 2019-08-27 |
Semiconductor Package with Air Cavity
App 20190181120 - Chiang; Chau Fatt ; et al. | 2019-06-13 |
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
App 20190164873 - Chiang; Chau Fatt ; et al. | 2019-05-30 |
Device having substrate with conductive pillars
Grant 10,304,780 - Chiang , et al. | 2019-05-28 |
Method of Forming a Semiconductor Package and Semiconductor Package
App 20190109103 - Chiang; Chau Fatt ; et al. | 2019-04-11 |
System And Method For Over Under Sensor Packaging
App 20190023561 - Chan; Sook Woon ; et al. | 2019-01-24 |
Device having substrate with conductive pillars
Grant 10,163,812 - Chiang , et al. Dec | 2018-12-25 |
Device Having Substrate With Conductive Pillars
App 20180308804 - Chiang; Chau Fatt ; et al. | 2018-10-25 |
Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips
Grant 10,099,411 - Wang , et al. October 16, 2 | 2018-10-16 |
Semiconductor package and method for fabricating a semiconductor package
App 20180174935 - CHONG; Hock Heng ; et al. | 2018-06-21 |
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture
App 20180148322 - Maier; Dominic ; et al. | 2018-05-31 |
Device Having Substrate With Conductive Pillars
App 20180108616 - Chiang; Chau Fatt ; et al. | 2018-04-19 |
Molded cavity package with embedded conductive layer and enhanced sealing
Grant 9,868,632 - Chiang , et al. January 16, 2 | 2018-01-16 |
Molding system with movable mold tool
App 20170282426 - CHIANG; Chau Fatt ; et al. | 2017-10-05 |
Molded Cavity Package with Embedded Conductive Layer and Enhanced Sealing
App 20170275159 - Chiang; Chau Fatt ; et al. | 2017-09-28 |
Manufacturing a package using plateable encapsulant
App 20170256472 - CHAN; Sook Woon ; et al. | 2017-09-07 |
Method and Apparatus for Simultaneously Encapsulating Semiconductor Dies with Layered Lead Frame Strips
App 20160339616 - Wang; Choon Huey ; et al. | 2016-11-24 |
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
Grant 9,475,691 - Chua , et al. October 25, 2 | 2016-10-25 |
Method of producing multiple semiconductor devices
Grant 8,053,280 - Chiang , et al. November 8, 2 | 2011-11-08 |
Method of manufacturing a semiconductor package using a carrier
Grant 7,977,161 - Chiang , et al. July 12, 2 | 2011-07-12 |
Method of manufacturing a semiconductor package with a bump using a carrier
Grant 7,838,332 - Goh , et al. November 23, 2 | 2010-11-23 |
Method Of Manufacturing A Semiconductor Package With A Bump Using A Carrier
App 20100129964 - Goh; Soon Lock ; et al. | 2010-05-27 |
Method of manufacturing a semiconductor package using a carrier
App 20100124802 - Chiang; Chau Fatt ; et al. | 2010-05-20 |
Method Of Producing Multiple Semiconductor Devices
App 20090134512 - Chiang; Chau Fatt ; et al. | 2009-05-28 |
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