Chia; Wei-Kong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chia; Wei-Kong.The latest application filed is for "method and apparatus of relative datapath cell placement with structure bonding".
- Chia; Wei-Kong - Los Altos CA
- Chia; Wei-Kong - Sunnyvale CA
| Patent | Date |
|---|---|
| Method and apparatus of relative datapath cell placement with structure bonding Grant 6,792,585 - Ku , et al. September 14, 2 | 2004-09-14 |
| Method for mixed placement of structured and non-structured circuit elements Grant 5,930,499 - Chen , et al. July 27, 1 | 1999-07-27 |
| Logic circuit simulator and logic simulation method having reduced number of simulation events Grant 5,384,720 - Ku , et al. January 24, 1 | 1995-01-24 |
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