Chia; Chok
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chia; Chok.The latest application filed is for "flip-chip qfn structure using etched lead frame".
- Chia; Chok - Cupertino CA
| Patent | Date |
|---|---|
| Flip-chip QFN structure using etched lead frame Grant 8,525,309 - Chia , et al. September 3, 2 | 2013-09-03 |
| Flip-chip Qfn Structure Using Etched Lead Frame App 20130001757 - Chia; Chok ; et al. | 2013-01-03 |
| Bond pad structure for gold wire bonding to copper low K dielectric silicon devices App 20060113667 - Chia; Chok ; et al. | 2006-06-01 |
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