loadpatents
Patent applications and USPTO patent grants for Chia; Bonnie T.The latest application filed is for "method and apparatus for cleaning a substrate".
Patent | Date |
---|---|
Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes Grant 11,031,273 - Chia , et al. June 8, 2 | 2021-06-08 |
Lift pin assembly Grant 10,892,180 - Chia , et al. January 12, 2 | 2021-01-12 |
High conductance process kit Grant 10,763,086 - Chia , et al. Sep | 2020-09-01 |
Method and Apparatus for cleaning a substrate App 20200230782 - AGARWAL; Pulkit ;   et al. | 2020-07-23 |
Physical Vapor Deposition (pvd) Electrostatic Chuck With Improved Thermal Coupling For Temperature Sensitive Processes App 20200185247 - CHIA; BONNIE T ;   et al. | 2020-06-11 |
High Conductance Process Kit App 20180130644 - CHIA; Bonnie T. ;   et al. | 2018-05-10 |
High conductance process kit Grant 9,865,437 - Chia , et al. January 9, 2 | 2018-01-09 |
Methods and Apparatus for Cleaning a Substrate App 20160322239 - AGARWAL; Pulkit ;   et al. | 2016-11-03 |
High Conductance Process Kit App 20160189936 - CHIA; Bonnie T. ;   et al. | 2016-06-30 |
Lift Pin Assembly App 20150348823 - CHIA; BONNIE T. ;   et al. | 2015-12-03 |
Finned shutter disk for a substrate process chamber Grant 9,147,558 - Chia , et al. September 29, 2 | 2015-09-29 |
Finned Shutter Disk For A Substrate Process Chamber App 20140196848 - CHIA; BONNIE T. ;   et al. | 2014-07-17 |
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