Chi; Chieh-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chi; Chieh-Yuan.The latest application filed is for "fabrication method of electronic package".
- Chi; Chieh-Yuan - Taichung TW
| Patent | Date |
|---|---|
| Fabrication method of electronic package Grant 10,403,567 - Chen , et al. Sep | 2019-09-03 |
| Fabrication Method Of Electronic Package App 20180130727 - Chen; Yan-Heng ; et al. | 2018-05-10 |
| Electronic package and fabrication method thereof Grant 9,899,303 - Chen , et al. February 20, 2 | 2018-02-20 |
| Package structure and fabrication method thereof Grant 9,842,758 - Chen , et al. December 12, 2 | 2017-12-12 |
| Method for fabricating package structure Grant 9,768,140 - Chen , et al. September 19, 2 | 2017-09-19 |
| Conductive via structure and fabrication method thereof Grant 9,607,941 - Chen , et al. March 28, 2 | 2017-03-28 |
| Semiconductor package and fabrication method thereof and carrier structure Grant 9,548,219 - Chen , et al. January 17, 2 | 2017-01-17 |
| Package structure and fabrication method thereof Grant 9,515,040 - Chen , et al. December 6, 2 | 2016-12-06 |
| Fabrication method of semiconductor package having embedded semiconductor elements Grant 9,397,081 - Chen , et al. July 19, 2 | 2016-07-19 |
| Fabrication Method Of Semiconductor Package Having Embedded Semiconductor Elements App 20160141281 - Chen; Yan-Heng ; et al. | 2016-05-19 |
| Fabrication method of semiconductor package Grant 9,337,061 - Chen , et al. May 10, 2 | 2016-05-10 |
| Package Structure And Fabrication Method Thereof App 20160126126 - Chen; Yan-Heng ; et al. | 2016-05-05 |
| Electronic Package And Fabrication Method Thereof App 20160111359 - Chen; Yan-Heng ; et al. | 2016-04-21 |
| Method For Fabricating Package Structure App 20160049376 - Chen; Yan-Heng ; et al. | 2016-02-18 |
| Package Structure And Fabrication Method Thereof App 20160013146 - Chen; Yan-Heng ; et al. | 2016-01-14 |
| Method for fabricating semiconductor package Grant 9,224,646 - Chen , et al. December 29, 2 | 2015-12-29 |
| Semiconductor Package And Fabrication Method Thereof And Carrier Structure App 20150325508 - Chen; Yan-Heng ; et al. | 2015-11-12 |
| Semiconductor package having embedded semiconductor elements Grant 9,177,859 - Chen , et al. November 3, 2 | 2015-11-03 |
| Conductive Via Structure And Fabrication Method Thereof App 20150294938 - Chen; Yan-Heng ; et al. | 2015-10-15 |
| Method For Fabricating Semiconductor Package App 20140342506 - Chen; Yan-Heng ; et al. | 2014-11-20 |
| Fabrication Method Of Semiconductor Package App 20140342505 - Chen; Yan-Heng ; et al. | 2014-11-20 |
| Semiconductor Package And Fabrication Method Thereof App 20140332976 - Chen; Yan-Heng ; et al. | 2014-11-13 |
| Semiconductor package and method of manufacturing the same Grant 8,828,796 - Chi , et al. September 9, 2 | 2014-09-09 |
| Method For Fabricating Semiconductor Package App 20140134797 - Chi; Chieh-Yuan ; et al. | 2014-05-15 |
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