Chew; Soon Ing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chew; Soon Ing.The latest application filed is for "semiconductor device package having asymmetric chip mounting area and lead widths".
- Chew; Soon Ing - Milpitas CA
| Patent | Date |
|---|---|
| Semiconductor package having a baseplate with a die attach region and a peripheral region Grant 9,293,407 - Komposch , et al. March 22, 2 | 2016-03-22 |
| Semiconductor device package having asymmetric chip mounting area and lead widths Grant 9,209,116 - Komposch , et al. December 8, 2 | 2015-12-08 |
| Semiconductor Device Package Having Asymmetric Chip Mounting Area And Lead Widths App 20150340306 - Komposch; Alexander ; et al. | 2015-11-26 |
| PCB Based RF-Power Package Window Frame App 20150048492 - Komposch; Alexander ; et al. | 2015-02-19 |
| PCB based RF-power package window frame Grant 8,907,467 - Komposch , et al. December 9, 2 | 2014-12-09 |
| Flange for semiconductor die Grant 8,604,609 - Mohammed , et al. December 10, 2 | 2013-12-10 |
| PCB Based RF-Power Package Window Frame App 20130256858 - Komposch; Alexander ; et al. | 2013-10-03 |
| Flange for Semiconductor Die App 20130037932 - Mohammed; Anwar A. ; et al. | 2013-02-14 |
| Flange for semiconductor die Grant 8,314,487 - Mohammed , et al. November 20, 2 | 2012-11-20 |
| Open cavity leadless surface mountable package for high power RF applications Grant 8,110,915 - Fowlkes , et al. February 7, 2 | 2012-02-07 |
| High power ceramic on copper package Grant 8,110,445 - Mohammed , et al. February 7, 2 | 2012-02-07 |
| Air cavity package with copper heat sink and ceramic window frame Grant 8,013,429 - Mohammed , et al. September 6, 2 | 2011-09-06 |
| Flange for Semiconductor Die App 20110147921 - Mohammed; Anwar A. ; et al. | 2011-06-23 |
| Open Cavity Leadless Surface Mountable Package for High Power RF Applications App 20110089529 - Fowlkes; Donald ; et al. | 2011-04-21 |
| Thermally enhanced electronic package Grant 7,811,862 - Mohammad , et al. October 12, 2 | 2010-10-12 |
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