Chew; Jimmy Hwee-Seng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chew; Jimmy Hwee-Seng.The latest application filed is for "semiconductor structure and semiconductor package device using the same".

Company Profile

2.5.6

Chew; Jimmy Hwee-Seng - Singapore SG
Chew; Jimmy Hwee Seng - Siglap Terrace SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor structure and semiconductor package device using the same Grant 10,763,133 - Chew , et al. Sep	2020-09-01
Semiconductor Structure And Semiconductor Package Device Using The Same App 20190035643 - CHEW; Jimmy Hwee-Seng ; et al.	2019-01-31
Method of manufacturing semiconductor package device Grant 10,109,503 - Chew , et al. October 23, 2	2018-10-23
Semiconductor Substrate, Package And Device And Manufacturing Methods Thereof App 20130020710 - Chew; Jimmy Hwee-Seng ; et al.	2013-01-24
Package Structure App 20120153465 - Chew; Jimmy Hwee-Seng ; et al.	2012-06-21
Handler for semiconductor singulation and method therefor Grant 7,692,440 - Chew , et al. April 6, 2	2010-04-06
Handler for semiconductor singulation and method therefor App 20060094339 - Chew; Jimmy Hwee Seng ; et al.	2006-05-04
Method for forming a flip chip on leadframe semiconductor package Grant 6,550,666 - Chew , et al. April 22, 2	2003-04-22
Method For Forming A Flip Chip On Leadframe Semiconductor Package App 20030038162 - Chew, Jimmy Hwee Seng ; et al.	2003-02-27

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