| Patent | Date |
|---|
Semiconductor Device With Buffer Layer
App 20210343549 - CHEW; Hwee Seng Jimmy ; et al. | 2021-11-04 |
Method Of Packaging Chip And Chip Package Structure
App 20210305064 - CHEW; Hwee Seng Jimmy | 2021-09-30 |
Method of packaging chip and chip package structure
Grant 11,049,734 - Chew June 29, 2 | 2021-06-29 |
Method of packaging chip and chip package structure
Grant 10,615,056 - Chew | 2020-04-07 |
Method Of Packaging Chip And Chip Package Structure
App 20190371626 - CHEW; Hwee Seng Jimmy | 2019-12-05 |
Method of packaging chip and chip package structure
Grant 10,431,477 - Chew O | 2019-10-01 |
Manufacturing method of semiconductor package
Grant 10,154,588 - Chew , et al. Dec | 2018-12-11 |
Semiconductor Package And Method Of Forming Thereof
App 20180204741 - CHEW; Hwee Seng Jimmy | 2018-07-19 |
Semiconductor Package For 3d Stacking And Method Of Forming Thereof
App 20180151392 - CHEW; Hwee Seng Jimmy | 2018-05-31 |
Method Of Packaging Chip And Chip Package Structure
App 20180151393 - CHEW; Hwee Seng Jimmy | 2018-05-31 |
Manufacturing method of package substrate and package manufacturing method of semiconductor device
Grant 9,892,916 - Lim , et al. February 13, 2 | 2018-02-13 |
Semiconductor Assembly and Method of Fabricating a Semiconductor Structure
App 20170330842 - Lim; Shoa Siong Raymond ; et al. | 2017-11-16 |
Manufacturing Method Of Semiconductor Package
App 20170303399 - CHEW; Hwee-Seng Jimmy ; et al. | 2017-10-19 |
Semiconductor structure and method of fabricating the same
Grant 9,754,899 - Lim , et al. September 5, 2 | 2017-09-05 |
Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
Grant 9,723,717 - Chew , et al. August 1, 2 | 2017-08-01 |
Manufacturing method of substrate structure having embedded interconnection layers
Grant 9,653,323 - Chew , et al. May 16, 2 | 2017-05-16 |
Semiconductor package
Grant 9,583,449 - Chew , et al. February 28, 2 | 2017-02-28 |
Semiconductor Package And Manufacturing Method Thereof
App 20160329306 - CHEW; Hwee-Seng Jimmy ; et al. | 2016-11-10 |
Manufacturing Method Of Package Substrate And Package Manufacturing Method Of Semiconductor Device
App 20160293416 - LIM; Shoa-Siong Raymond ; et al. | 2016-10-06 |
Chip And Manufacturing Method Thereof
App 20160268225 - CHEW; Hwee-Seng Jimmy ; et al. | 2016-09-15 |
Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof
Grant 9,396,982 - Chew , et al. July 19, 2 | 2016-07-19 |
Manufacturing Method Of Substrate Structure
App 20160189981 - CHEW; Hwee-Seng Jimmy ; et al. | 2016-06-30 |
Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
Grant 9,379,044 - Lim , et al. June 28, 2 | 2016-06-28 |
Chip and manufacturing method thereof
Grant 9,362,206 - Chew , et al. June 7, 2 | 2016-06-07 |
Semiconductor Package
App 20160118349 - CHEW; Hwee-Seng Jimmy ; et al. | 2016-04-28 |
Manufacturing method of forming an etch-back type semiconductor package with locking anchorages
Grant 9,305,868 - Chew , et al. April 5, 2 | 2016-04-05 |
Substrate structure, semiconductor package device, and manufacturing method of substrate structure
Grant 9,301,391 - Chew , et al. March 29, 2 | 2016-03-29 |
Semiconductor element for package miniaturization
Grant 9,287,157 - Chew , et al. March 15, 2 | 2016-03-15 |
Semiconductor Structure and Method of Fabricating the Same
App 20160013139 - Lim; Shoa Siong Raymond ; et al. | 2016-01-14 |
Semiconductor device carrier and semiconductor package using the same
Grant 9,219,027 - Chew , et al. December 22, 2 | 2015-12-22 |
Etch-back Type Semiconductor Package, Substrate And Manufacturing Method Thereof
App 20150111345 - CHEW; Hwee-Seng Jimmy ; et al. | 2015-04-23 |
Etch-back type semiconductor package, substrate and manufacturing method thereof
Grant 8,917,521 - Chew , et al. December 23, 2 | 2014-12-23 |
Chip And Manufacturing Method Thereof
App 20140299984 - Chew; Hwee-Seng Jimmy ; et al. | 2014-10-09 |
Interconnections for fine pitch semiconductor devices and manufacturing method thereof
Grant 8,846,519 - Chew , et al. September 30, 2 | 2014-09-30 |
Package structure
Grant 8,796,844 - Chew , et al. August 5, 2 | 2014-08-05 |
Apparatus for molding a semiconductor wafer and process therefor
Grant 8,791,583 - Chew , et al. July 29, 2 | 2014-07-29 |
Package structure
Grant 8,766,438 - Chew , et al. July 1, 2 | 2014-07-01 |
Semiconductor Device Carrier And Semiconductor Package Using The Same
App 20140167240 - Chew; Hwee-Seng Jimmy ; et al. | 2014-06-19 |
Manufacturing method for semiconductor device carrier and semiconductor package using the same
Grant 8,709,874 - Chew , et al. April 29, 2 | 2014-04-29 |
Substrate Structure, Semiconductor Package Device, And Manufacturing Method Of Semiconductor Package
App 20130175707 - Chew; Hwee-Seng Jimmy ; et al. | 2013-07-11 |
Substrate Structure, Semiconductor Package Device, And Manufacturing Method Of Substrate Structure
App 20130161809 - CHEW; Hwee-Seng Jimmy ; et al. | 2013-06-27 |
Package Carrier, Package Carrier Manufacturing Method, Package Structure For Semiconductor Device And Manufacturing Method Thereof
App 20130113099 - Lim; Shoa-Siong Raymond ; et al. | 2013-05-09 |
Chip And Manufacturing Method Thereof
App 20120220118 - CHEW; Hwee-Seng Jimmy ; et al. | 2012-08-30 |
Interconnections for fine pitch semiconductor devices and manufacturing method thereof
Grant 8,207,608 - Chew , et al. June 26, 2 | 2012-06-26 |
Package Structure
App 20120153466 - Chew; Hwee-Seng Jimmy ; et al. | 2012-06-21 |
Manufacturing Method For Semiconductor Device Carrier And Manufacturing Method For Semiconductor Package Using The Same
App 20120058604 - Chew; Hwee-Seng Jimmy ; et al. | 2012-03-08 |
Etch-back Type Semiconductor Package, Substrate And Manufacturing Method Thereof
App 20110267789 - CHEW; Hwee-Seng Jimmy ; et al. | 2011-11-03 |
Flip Chip In Package Using Flexible And Removable Leadframe
App 20080150107 - TAN; Teck Tiong ; et al. | 2008-06-26 |
Semiconductor package and manufacturing method thereof
App 20080145967 - Chew; Hwee-Seng Jimmy ; et al. | 2008-06-19 |
Chip and manufacturing method thereof
App 20080088013 - Chew; Hwee-Seng Jimmy ; et al. | 2008-04-17 |
Integrated Circuit Chip Formed On Substrate
App 20070284420 - Tan; Teck Tiong ; et al. | 2007-12-13 |
Flip chip in package using flexible and removable leadframe
App 20070196979 - Tan; Teck Tiong ; et al. | 2007-08-23 |
Optical sensor package and method of manufacture
App 20060180888 - Tan; Teck Tiong ; et al. | 2006-08-17 |
Heat sinking structure
App 20060103016 - Tan; Teck Tiong ; et al. | 2006-05-18 |
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