Chew; Hwee Seng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chew; Hwee Seng.The latest application filed is for "semiconductor structures with via openings and methods of making the same".

Company Profile

2.4.7

Chew; Hwee Seng - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Structures With Via Openings And Methods Of Making The Same App 20220157750 - Chew; Hwee Seng	2022-05-19
Apparatus And Method For Bonding A Plurality Of Dies To A Carrier Panel App 20220102189 - CHEW; HWEE SENG ; et al.	2022-03-31
Chip Packaging Method And Chip Structure App 20220102254 - CHEW; Hwee Seng	2022-03-31
Multi-layer substrate for semiconductor packaging Grant 10,446,457 - Lim , et al. Oc	2019-10-15
Multi-Layer Substrate For Semiconductor Packaging App 20180323121 - LIM; Shoa Siong ; et al.	2018-11-08
Multi-layer substrate for semiconductor packaging Grant 10,049,950 - Lim , et al. August 14, 2	2018-08-14
Method for device packaging Grant 9,120,169 - Chew , et al. September 1, 2	2015-09-01
Multi-Layer Substrate For Semiconductor Packaging App 20150155214 - Lim; Shoa Siong ; et al.	2015-06-04
In-situ Melt And Reflow Process For Forming Flip-chip Interconnections And Systems Thereof App 20110287560 - Chew; Hwee Seng ; et al.	2011-11-24
Thermal Bonding Process For Chip Packaging App 20080248610 - Chew; Hwee Seng ; et al.	2008-10-09

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