Chew; Chee Chuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chew; Chee Chuan.The latest application filed is for "bump chip lead frame and package".
- Chew; Chee Chuan - Petaling Jaya MY
- Chew; Chee Chuan - Singapore SG
| Patent | Date |
|---|---|
| Bump chip lead frame and package Grant 6,864,423 - Tan , et al. March 8, 2 | 2005-03-08 |
| Bump chip lead frame and package App 20020074147 - Tan, Aik Chong ; et al. | 2002-06-20 |
| Printer Grant D448,044 - Wu , et al. September 18, 2 | 2001-09-18 |
| Color capable single-cartridge inkjet service station Grant 5,757,395 - Chew , et al. May 26, 1 | 1998-05-26 |
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