Cheung; Sammy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheung; Sammy.The latest application filed is for "application-specific integrated circuit equivalents of programmable logic and associated methods".

Company Profile

0.8.6

Cheung; Sammy - South San Francisco CA
Cheung; Sammy - Pleasanton CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Application-specific integrated circuit equivalents of programmable logic and associated methods Grant 8,863,061 - Chua , et al. October 14, 2	2014-10-14
Application-specific Integrated Circuit Equivalents Of Programmable Logic And Associated Methods App 20130314122 - Chua; Kar Keng ; et al.	2013-11-28
Application-specific integrated circuit equivalents of programmable logic and associated methods Grant 8,504,963 - Chua , et al. August 6, 2	2013-08-06
Application-specific Integrated Circuit Equivalents Of Programmable Logic And Associated Methods App 20130002295 - Chua; Kar Keng ; et al.	2013-01-03
Application-specific integrated circuit equivalents of programmable logic and associated methods Grant 8,291,355 - Chua , et al. October 16, 2	2012-10-16
Application-specific Integrated Circuit Equivalents Of Programmable Logic And Associated Methods App 20110084727 - Chua; Kar Keng ; et al.	2011-04-14
Application-specific integrated circuit equivalents of programmable logic and associated methods Grant 7,870,513 - Chua , et al. January 11, 2	2011-01-11
Application-specific integrated circuit equivalents of programmable logic and associated methods App 20070210827 - Chua; Kar Keng ; et al.	2007-09-13
Application-specific integrated circuit equivalents of programmable logic and associated methods Grant 7,243,329 - Chua , et al. July 10, 2	2007-07-10
Application-specific integrated circuit equivalents of programmable logic and associated methods App 20060001444 - Chua; Kar Keng ; et al.	2006-01-05
Isolation testing scheme for multi-die packages Grant 6,599,764 - Ang , et al. July 29, 2	2003-07-29
High-performance interconnect App 20010010471 - Ngai, Tony ; et al.	2001-08-02
High-performance interconnect Grant 6,239,615 - Ngai , et al. May 29, 2	2001-05-29

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