Cheung; Nathan W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cheung; Nathan W..The latest application filed is for "method and system of layered thin-film device with ceramic substrates".

Company Profile

0.43.30

Cheung; Nathan W. - Wanchai HK
Cheung; Nathan W. - Kowloon HK
Cheung; Nathan W. - Albany CA
Cheung; Nathan W. - Hong Kong CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Internal light trapping method and structure using porous monocyrstalline silicon films for photovoltaic applications Grant 8,153,892 - Chan , et al. April 10, 2	2012-04-10
Method and structure for hydrogenation of silicon substrates with shaped covers Grant 8,153,887 - Chan , et al. April 10, 2	2012-04-10
Method and structure for hydrogenation of porous monocrystalline silicon substrates Grant 8,148,629 - Chan , et al. April 3, 2	2012-04-03
Texture process and structure for manufacture of composite photovoltaic device substrates Grant 8,143,511 - Chan , et al. March 27, 2	2012-03-27
Method and structure for hydrogenation of silicon substrates with shaped covers Grant 8,143,514 - Chan , et al. March 27, 2	2012-03-27
Method and System of Layered Thin-Film Device With Ceramic Substrates App 20120017970 - Cheung; Nathan W. ; et al.	2012-01-26
Controlled Process And Resulting Device App 20110294306 - Henley; Francois J. ; et al.	2011-12-01
Controlled process and resulting device Grant 8,012,852 - Henley , et al. September 6, 2	2011-09-06
Controlled process and resulting device Grant 7,846,818 - Henley , et al. December 7, 2	2010-12-07
Controlled Process And Resulting Device App 20100282323 - Henley; Francois J. ; et al.	2010-11-11
Controlled cleaving process Grant 7,781,305 - Henley , et al. August 24, 2	2010-08-24
Controlled process and resulting device Grant 7,776,717 - Henley , et al. August 17, 2	2010-08-17
Controlled process and resulting device Grant 7,759,217 - Henley , et al. July 20, 2	2010-07-20
Method and device for controlled cleaving process App 20090093103 - Henley; Francois J. ; et al.	2009-04-09
Texture process and structure for manufacture of composit photovoltaic device substrates App 20090071530 - Chan; Yick Chuen ; et al.	2009-03-19
Internal light trapping method and structure using porous monocyrstalline silicon films for photovoltaic applications App 20090071536 - Chan; Yick Chuen ; et al.	2009-03-19
Method and structure for textured thermal cut for photovoltaic applications for thin films App 20090065050 - Cheung; Nathan W. ; et al.	2009-03-12
Method and structure for hydrogenation of silicon substrates with shaped covers App 20090065051 - Chan; Yick Chuen ; et al.	2009-03-12
Controlled process and resulting device App 20080286945 - Henley; Francois J. ; et al.	2008-11-20
Controlled process and resulting device Grant 7,410,887 - Henley , et al. August 12, 2	2008-08-12
Controlled cleaving process App 20080182386 - Henley; Francois J. ; et al.	2008-07-31
Controlled cleaving process Grant 7,371,660 - Henley , et al. May 13, 2	2008-05-13
Method And Structure For Hydrogenation Of Porous Monocrystalline Silicon Substratres App 20080105301 - Chan; Yick Chuen ; et al.	2008-05-08
Method And Structure For Hydrogenation Of Silicon Substrates With Shaped Covers App 20080092948 - Chan; Yick Chuen ; et al.	2008-04-24
Method And Structure For Textured Thermal Cut For Photovoltaic Applications For Thin Films App 20080092949 - Cheung; Nathan W. ; et al.	2008-04-24
Method and Device for Controlled Cleaving Process App 20080057675 - Henley; Francois J. ; et al.	2008-03-06
Controlled Process and Resulting Device App 20080038901 - Henley; Francois J. ; et al.	2008-02-14
Controlled Process And Resulting Device App 20070122995 - HENLEY; FRANCOIS J. ; et al.	2007-05-31
Controlled Process And Resulting Device App 20070122997 - HENLEY; FRANCOIS J. ; et al.	2007-05-31
Controlled Process And Resulting Device App 20070123013 - HENLEY; FRANCOIS J. ; et al.	2007-05-31
Integrated, fluorescence-detecting microanalytical system Grant 7,221,455 - Chediak , et al. May 22, 2	2007-05-22
Controlled cleaving process Grant 7,160,790 - Henley , et al. January 9, 2	2007-01-09
Controlled cleaving process App 20060141747 - Henley; Francois J. ; et al.	2006-06-29
Controlled cleaving process App 20050186758 - Henley, Francois J. ; et al.	2005-08-25
Integrated, fluorescence-detecting microanalytical system App 20050157301 - Chediak, J. Alex ; et al.	2005-07-21
Gettering technique for wafers made using a controlled cleaving process Grant 6,890,838 - Henley , et al. May 10, 2	2005-05-10
Method and device for controlled cleaving process App 20050070071 - Henley, Francois J. ; et al.	2005-03-31
Method and device for controlled cleaving process Grant 6,790,747 - Henley , et al. September 14, 2	2004-09-14
Controlled cleaving process Grant 6,632,724 - Henley , et al. October 14, 2	2003-10-14
Method and device for controlled cleaving process App 20030113983 - Henley, Francois J. ; et al.	2003-06-19
Silicon-on-silicon hybrid wafer assembly Grant 6,558,802 - Henley , et al. May 6, 2	2003-05-06
Gettering technique for wafers made using a controlled cleaving process Grant 6,548,382 - Henley , et al. April 15, 2	2003-04-15
Method for fabricating multi-layered substrates Grant 6,534,381 - Cheung , et al. March 18, 2	2003-03-18
Method For Fabricating Multi-layered Substrates App 20030008475 - CHEUNG, NATHAN W. ; et al.	2003-01-09
Method and device for controlled cleaving process Grant 6,486,041 - Henley , et al. November 26, 2	2002-11-26
Controlled cleavage process and resulting device using beta annealing Grant 6,458,672 - Henley , et al. October 1, 2	2002-10-01
Controlled Cleaving Process App 20020106870 - Henley, Francois J. ; et al.	2002-08-08
Separation of thin films from transparent substrates by selective optical processing Grant 6,420,242 - Cheung , et al. July 16, 2	2002-07-16
Generic layer transfer methodology by controlled cleavage process App 20020081823 - Cheung, Nathan W. ; et al.	2002-06-27
Method of separating films from bulk substrates by plasma immersion ion implantation App 20020064924 - Cheung, Nathan W. ; et al.	2002-05-30
Generic layer transfer methodology by controlled cleavage process Grant 6,391,740 - Cheung , et al. May 21, 2	2002-05-21
Controlled cleavage using patterning App 20020056519 - Henley, Francois J. ; et al.	2002-05-16
Method of separation films from bulk substrates by plasma immersion ion implantation Grant 6,344,404 - Cheung , et al. February 5, 2	2002-02-05
Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials Grant 6,335,263 - Cheung , et al. January 1, 2	2002-01-01
Controlled cleavage thin film separation process using a reusable substrate Grant 6,335,264 - Henley , et al. January 1, 2	2002-01-01
Method and device for controlled cleaving process App 20010026997 - Henley, Francois J. ; et al.	2001-10-04
Controlled cleavage process and device for patterned films using a release layer Grant 6,291,314 - Henley , et al. September 18, 2	2001-09-18
Controlled cleavage process using patterning Grant 6,290,804 - Henley , et al. September 18, 2	2001-09-18
Method and device for controlled cleaving process Grant 6,284,631 - Henley , et al. September 4, 2	2001-09-04
Pre-semiconductor process implant and post-process film separation App 20010007790 - Henley, Francois J. ; et al.	2001-07-12
Controlled cleavage process and device for patterned films using patterned implants Grant 6,248,649 - Henley , et al. June 19, 2	2001-06-19
Economical silicon-on-silicon hybrid wafer assembly Grant 6,245,161 - Henley , et al. June 12, 2	2001-06-12
Pre-semiconductor process implant and post-process film separation Grant 6,184,111 - Henley , et al. February 6, 2	2001-02-06
Controlled cleavage process and resulting device using beta annealing Grant 6,162,705 - Henley , et al. December 19, 2	2000-12-19
Controlled cleavage thin film separation process using a reusable substrate Grant 6,159,825 - Henley , et al. December 12, 2	2000-12-12
Silicon-on-silicon wafer bonding process using a thin film blister-separation method Grant 6,159,824 - Henley , et al. December 12, 2	2000-12-12
Pressurized microbubble thin film separation process using a reusable substrate Grant 6,146,979 - Henley , et al. November 14, 2	2000-11-14
Gettering technique for silicon-on-insulator wafers Grant 6,083,324 - Henley , et al. July 4, 2	2000-07-04
Separation of thin films from transparent substrates by selective optical processing Grant 6,071,795 - Cheung , et al. June 6, 2	2000-06-06
Silicon-on-silicon hybrid wafer assembly Grant 6,048,411 - Henley , et al. April 11, 2	2000-04-11
Method for controlled cleaving process Grant 6,033,974 - Henley , et al. March 7, 2	2000-03-07
Controlled cleaning process Grant 6,013,563 - Henley , et al. January 11, 2	2000-01-11
Reusable substrate for thin film separation Grant 6,010,579 - Henley , et al. January 4, 2	2000-01-04